SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE
First Claim
1. A method for manufacturing a semiconductor component, comprising the steps of:
- providing a heatsink having first and second major surfaces;
providing a leadframe having at least one leadframe lead;
disposing a liquid crystal polymer on a portion of the at least one leadframe lead;
partially curing the liquid crystal polymer; and
mating the liquid crystal polymer and the heatsink.
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Abstract
A semiconductor component having a semiconductor chip mounted on a packaging substrate and a method for manufacturing the semiconductor component that uses batch processing steps for fabricating the packaging substrate. A heatsink is formed using an injection molding process. The heatsink has a front surface for mating with a semiconductor chip and a leadframe assembly. The heatsink also has a back surface from which a plurality of fins extend. The leadframe assembly includes a leadframe having leadframe leads extending from opposing sides of the leadframe to a central area of the leadframe. A liquid crystal polymer is disposed in a ring-shaped pattern on the leadframe leads. The liquid crystal polymer is partially cured. The leadframe assembly is mounted on the front surface of the heatsink and the liquid crystal polymer is further cured to form a packaging assembly, which is then singulated into packaging substrates.
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Citations
44 Claims
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1. A method for manufacturing a semiconductor component, comprising the steps of:
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providing a heatsink having first and second major surfaces;
providing a leadframe having at least one leadframe lead;
disposing a liquid crystal polymer on a portion of the at least one leadframe lead;
partially curing the liquid crystal polymer; and
mating the liquid crystal polymer and the heatsink. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28)
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29. A method for manufacturing a semiconductor component, comprising the steps of:
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forming a plurality of heatsinks, each heatsink of the plurality of heatsinks having first and second major surfaces;
providing a leadframe having a plurality of leadframe leads;
disposing a liquid crystal polymer on the plurality of leadframe leads;
partially curing the liquid crystal polymer;
coupling the leadframe to the plurality of heatsinks through the partially cured liquid crystal polymer to form a packaging frame comprising a plurality of packaging substrates; and
singulating the packaging frame to separate the plurality of packaging substrates from each other. - View Dependent Claims (30, 31, 32, 33, 34)
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35. A method for manufacturing a semiconductor component, comprising the steps of:
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providing a heatsink having first and second major surfaces;
providing a ball grid array substrate having a first major surface and a second major surface, the second major surface having solder balls coupled thereto;
disposing a liquid crystal polymer on a portion of the first major surface of the ball grid array substrate;
partially curing the liquid crystal polymer;
mating a first major surface of a semiconductor chip to the liquid crystal polymer; and
mating a second major surface of the semiconductor chip to the heatsink. - View Dependent Claims (36, 37, 38)
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39. A semiconductor component, comprising:
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a heatsink having first and second major surfaces;
a liquid crystal polymer disposed on the first major surface of the heatsink, the liquid crystal polymer having a first side;
first and second leadframe leads disposed on first and second portions of the liquid crystal polymer, respectively;
a semiconductor chip having an active surface and a back surface, the active surface coupled to the heatsink;
an interconnect coupling the semiconductor chip to the first leadframe lead; and
a clip coupling the back surface to the second leadframe lead. - View Dependent Claims (40, 41, 42, 43, 44)
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Specification