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SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

  • US 20080093718A1
  • Filed: 12/18/2007
  • Published: 04/24/2008
  • Est. Priority Date: 01/10/2005
  • Status: Abandoned Application
First Claim
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1. A method for manufacturing a semiconductor component, comprising the steps of:

  • providing a heatsink having first and second major surfaces;

    providing a leadframe having at least one leadframe lead;

    disposing a liquid crystal polymer on a portion of the at least one leadframe lead;

    partially curing the liquid crystal polymer; and

    mating the liquid crystal polymer and the heatsink.

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