Single Chip USB Packages With Contact-Pins Cover

• US 20080093720A1
• Filed: 10/17/2007
• Published: 04/24/2008
• Est. Priority Date: 08/04/1999
• Status: Active Grant

• Current Assignee: Super Talent Technology, Corporation
• Original Assignee: Super Talent Electronics, Inc.
• Inventors: Kim, Jin, Shen, Ming-Shiang, Ma, Abraham, Hiew, Siew
• Granted Patent: US 7,535,719 B2
• Time in Patent Office: Days
• US Class Current: 257/679
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/18 the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01024 Chromium [Cr]
• CPC Class Codes: H01L 2924/0103 Zinc [Zn]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01077 Iridium [Ir]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H05K 1/117 : Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
• CPC Class Codes: H05K 3/284 : for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 5/0278 : of USB type details relating to connectors H01R27/00

Abstract

A low-profile Universal-Serial-Bus (USB) assembly includes a modular USB core component that is retractably mounted into an external housing. The modular USB core component includes a PCBA in which all passive components and unpackaged IC chips are attached to a single side of a PCB opposite to the metal contacts. The IC chips (e.g., USB controller, flash memory) are attached to the PCB by wire bonding or other chip-on-board (COB) technique. The passive components are attached by conventional surface mount technology (SMT) techniques. The housing includes a retractable mechanism that facilitates selective exposure of metal contacts, either by sliding a front portion of the modular USB core component into and out of a front opening of the housing, or by providing a cover plate that slidably covers the front portion of the modular USB core component.

Claims

1. A low-profile USB assembly adapted to be retractably accessed by a data terminal, said USB assembly comprising:

a modular USB core component comprising;

a printed circuit board assembly (PCBA) including;

a card body,

a non-volatile memory device mounted on the card body,

a card reader interface circuit mounted on said card body, and

a processing unit mounted on said card body and connected to said non-volatile memory device and said card reader interface circuit,

wherein said card body comprises a printed circuit board (PCB) having opposing first and second surfaces, a plurality of metal contacts disposed on the first surface, at least one passive component mounted on the second surface,

wherein at least one of the non-volatile memory device, the card reader interface circuit and the processing unit comprises an unpackaged integrated circuit (IC) die mounted on the second surface of the PCB handle section, and

wherein a plurality of conductive traces are formed on the PCB such that each conductive trace is electrically connected to at least one of an associated metal contact, the IC die and the passive component; and

a single-piece molded housing formed on the second surface of the PCBA such that said at least one passive component and said at least one IC die are covered by said molded housing, and such that substantially all of the first surface of the PCB is exposed; and

a housing disposed around at least a portion of the modular USB core component such that the metal contacts are disposed adjacent to a front opening defined in the housing; and

retractable means slidably connected to the housing and manually movable between a first position in which the metal contacts are covered by a wall, and a second position in which the metal contacts are exposed for access by the data terminal.

2. The low-profile USB assembly according to claim 1,

wherein said retractable means comprises a holder that is disposed in the housing, the holder having peripheral walls surrounding a trough, the peripheral walls including a front wall disposed adjacent to the second opening,

wherein the modular USB core component is fixedly received in the trough of the holder such that the metal contacts are disposed adjacent to the front wall, and

wherein the holder is slidable within the housing between a retracted position, in which the front wall of the holder blocks the front opening of the housing and a wall of the housing covers the metal contacts of the modular USB core component, and a deployed position, in which a front portion of the holder is extended through the front opening of the housing such that the metal contacts of the modular USB core component are exposed for access by the data terminal.

3. The low-profile USB assembly of claim 2, wherein the housing comprises a lower housing portion and an upper housing portion mounted on the lower case portion, and wherein the holder comprises a single-piece, pre-molded plastic structure that is slidably disposed in a cavity defined by the upper housing portion and the lower housing portion.

4. The low-profile USB assembly of claim 3, wherein said upper housing portion is snap-coupled to said lower housing portion.

5. The low-profile USB assembly of claim 3,

wherein the housing includes opposing upper and lower walls, and opposing first and second side walls extending between the upper wall and the lower wall, and

wherein the holder further comprises a protruding button extending through an opening defined in one of said upper wall, said lower wall, said first side wall and said second side wall of the housing.

6. The low-profile USB assembly of claim 5, wherein the protruding button comprises a resilient structure disposed such that the protruding button is biased out of said opening.

7. The low-profile USB assembly of claim 6, wherein the housing further comprises a locking groove defined inside of the cavity, and

wherein the resilient structure includes a locking protrusion that is slidably engaged in the locking groove.

8. The low-profile USB assembly of claim 3, wherein at least one of the lower housing portion and the upper housing portion in include a corner structure defining a key chain hole adjacent to a corner of said housing.

9. The low-profile USB assembly of claim 3, wherein at least one of the lower housing portion and the upper housing portion in include a post structure defining a key chain hole disposed adjacent to center of a rear wall of said housing.

10. The low-profile USB assembly of claim 1,

wherein the modular USB core component is fixedly received in the housing such that the metal contacts are disposed adjacent to the front wall, and

wherein said retractable means comprises a cover plate that is slidably disposed in the housing such that the cover plate is slidable between a closed position, in which the cover plate is disposed over the metal contacts of the modular USB core component, and an open position, in which the cover plate is disposed inside the housing and the metal contacts of the modular USB core component are exposed for access by the data terminal.

11. The low-profile USB assembly of claim 10, wherein the cover plate includes a switch button extending from the cover plate and disposed outside the housing.

12. The low-profile USB assembly of claim 10, wherein the housing includes a through hole defined in a rear wall of the housing for receiving a key chain.

13. The low-profile USB assembly of claim 1, wherein the at least one integrated circuit (IC) die is electrically connected to the conductive traces by a plurality of wire bonds extending between said at least one IC die and corresponding contact pads disposed on the second surface of the PCB.

14. The low-profile USB assembly of claim 13, wherein the at least one passive component includes a lead that is soldered to a corresponding contact pad disposed on the second surface of the PCB.

15. The low-profile USB assembly of claim 14, wherein the at least one passive component comprises at least one of a resistor, a capacitor, an oscillator, and a light emitting diode.

16. The low-profile USB assembly of claim 13, wherein the at least one integrated circuit (IC) die includes a first IC die comprising an USB controller circuit, and a second IC die comprising a flash memory circuit.

17. The low-profile USB assembly of claim 16, wherein the at least one IC die comprises a plurality of flash memory dies disposed in a stacked arrangement such that a first flash memory die is mounted on the second surface of the PCB, and a second flash memory die is mounted on a surface of the first flash memory die.

18. The low-profile USB assembly of claim 17, wherein the first flash memory die is connected to said PCB by a first plurality of said wire bonds, and the second flash memory die is connected to one of the first flash memory die and said PCB by a second plurality of wire bonds.

19. The low-profile USB assembly of claim 13, wherein the at least one integrated circuit (IC) die includes a single-chip controller/flash die comprising controller circuit and one or more flash block mass storage circuits that are interconnected by a bus.

20. A method for producing an USB assembly comprising:

producing a modular USB core component including;

a PCBA including;

a card body,

a non-volatile memory device mounted on the card body,

a card reader interface circuit mounted on said card body, and

a processing unit mounted on said card body and connected to said non-volatile memory device and said card reader interface circuit,

wherein said card body comprises a printed circuit board (PCB) having opposing first and second surfaces, a plurality of metal contacts disposed on the first surface, at least one passive component mounted on the second surface,

wherein at least one of the non-volatile memory device, the card reader interface circuit and the processing unit comprises an unpackaged integrated circuit (IC) die mounted on the second surface of the PCB handle section, and

wherein a plurality of conductive traces are formed on the PCB such that each conductive trace is electrically connected to at least one of an associated metal contact, the IC die and the passive component; and

a single-piece molded housing formed on the second surface of the PCBA such that said at least one passive component and said at least one IC die are covered by said molded housing, and such that substantially all of the first surface of the PCB is exposed; and

; and

mounting said modular USB core component into a housing including a retractable mechanism that is slidably connected to the housing and manually movable between a first position in which the metal contacts are covered by a wall, and a second position in which the metal contacts are exposed for access by the data terminal.