High performance system-on-chip using post passivation process

• US 20080093745A1
• Filed: 12/17/2007
• Published: 04/24/2008
• Est. Priority Date: 12/21/1998
• Status: Abandoned Application

• Current Assignee: Qualcomm, Inc.
• Original Assignee: Megica Corporation (Chipbond Technology Corporation)
• Inventors: Lin, Mou-Shiung
• Application Number:
  US11/957,510
• Publication Number:
  US 20080093745A1
• Time in Patent Office: Days
• US Class Current: 257/759
• CPC Class Codes: H01L 21/768 Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
• CPC Class Codes: H01L 21/76807 for dual damascene structures
• CPC Class Codes: H01L 21/76838 characterised by the formation and the after-treatment of the conductors etching for patterning the conductors H01L21/3213
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/05001 Internal layers
• CPC Class Codes: H01L 2224/0554 External layer
• CPC Class Codes: H01L 2224/05552 in top view
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/13022 the bump connector being at least partially embedded in the surface
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 23/3192 Multilayer coating
• CPC Class Codes: H01L 23/522 including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
• CPC Class Codes: H01L 23/5222 Capacitive arrangements or effects of, or between wiring layers other capacitive arrangements H01L23/642
• CPC Class Codes: H01L 23/5223 Capacitor integral with wiring layers
• CPC Class Codes: H01L 23/5227 Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 23/5228 Resistive arrangements or effects of, or between, wiring layers other resistive arrangements H01L23/647
• CPC Class Codes: H01L 23/5286 Arrangements of power or ground buses
• CPC Class Codes: H01L 23/5329 Insulating materials
• CPC Class Codes: H01L 23/53295 Stacked insulating layers
• CPC Class Codes: H01L 23/60 Protection against electrostatic charges or discharges, e.g. Faraday shields
• CPC Class Codes: H01L 23/642 : Capacitive arrangements H01L23/49589, H01L23/645, H01L23/647, H01L23/66 take precedence; capacitive effects between wiring layers on the semiconductor body H01L23/5222
• CPC Class Codes: H01L 23/645 : Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 23/647 : Resistive arrangements H01L23/66, H01L23/62 take precedence
• CPC Class Codes: H01L 24/03 : Manufacturing methods
• CPC Class Codes: H01L 24/05 : of an individual bonding area
• CPC Class Codes: H01L 27/0676 : comprising combinations of diodes, or capacitors or resistors
• CPC Class Codes: H01L 27/08 : including only semiconductor components of a single kind
• CPC Class Codes: H01L 28/10 : Inductors
• CPC Class Codes: H01L 28/20 : Resistors
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 : Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01011 : Sodium [Na]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01022 : Titanium [Ti]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01038 : Strontium [Sr]
• CPC Class Codes: H01L 2924/01042 : Molybdenum [Mo]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01073 : Tantalum [Ta]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01084 : Polonium [Po]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/04941 : TiN
• CPC Class Codes: H01L 2924/04953 : TaN
• CPC Class Codes: H01L 2924/05042 : Si3N4
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/10329 : Gallium arsenide [GaAs]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/12044 : OLED
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1423 : Monolithic Microwave Integrated Circuit [MMIC]
• CPC Class Codes: H01L 2924/15174 : in different layers of the multilayer substrate
• CPC Class Codes: H01L 2924/19015 : including thin film passive components
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/19104 : on the semiconductor or solid-state device, i.e. passive-on-chip
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: Y10S 257/92 : Conductor layers on different levels connected in parallel, e.g. to reduce resistance

Abstract

The present invention extends the above referenced continuation-in-part application by in addition creating high quality electrical components, such as inductors, capacitors or resistors, on a layer of passivation or on the surface of a thick layer of polymer. In addition, the process of the invention provides a method for mounting discrete electrical components at a significant distance removed from the underlying silicon surface.

Claims

1. An integrated circuit chip comprising:

a silicon substrate;

multiple semiconductor devices in or on said silicon substrate, wherein one of said multiple semiconductor devices comprises a transistor;

a first dielectric layer over said silicon substrate;

a first metallization structure over said first dielectric layer, wherein said first metallization structure is connected to said multiple semiconductor devices, wherein said first metallization structure comprises a first metal layer and a second metal layer over said first metal layer, wherein said first metallization structure comprises a pad, wherein said pad has a size between 0.5 and 30 micrometers;

a second dielectric layer between said first and second metal layers;

a passivation layer over said first metallization structure and over said first and second dielectric layers, and wherein a first opening in said passivation layer exposes said pad, wherein said first opening has a transverse dimension between 0.5 and 30 micrometers;

a polymer layer over said passivation layer, wherein a second opening in said polymer layer exposes said pad, and wherein said polymer layer has a thickness between 2 and 150 micrometers;

a second metallization structure comprising a first portion in said second opening and a second portion on said polymer layer, wherein said first and second portions comprise electroplated copper, and wherein said second portion has a thickness greater than those of said first and second metal layers.

2. The integrated circuit chip of claim 1, wherein said polymer layer comprises polyimide.

3. The integrated circuit chip of claim 1, wherein said polymer layer comprises benzocyclobutene (BCB).

4. The integrated circuit chip of claim 1, wherein said topmost nitride layer has a thickness greater than that of said topmost oxide layer.

5. The integrated circuit chip of claim 1, wherein said polymer layer has a thickness greater than that of said passivation layer.

6. The integrated circuit chip of claim 1, wherein said first metallization structure comprises aluminum.

7. The integrated circuit chip of claim 1, wherein said first metallization structure comprises electroplated copper.

8. An integrated circuit chip comprising:

a silicon substrate;

multiple semiconductor devices in or on said silicon substrate, wherein one of said multiple semiconductor devices comprises a transistor;

a first dielectric layer over said silicon substrate;

a first metallization structure over said first dielectric layer, wherein said first metallization structure is connected to said multiple semiconductor devices, wherein said first metallization structure comprises a first metal layer and a second metal layer over said first metal layer;

a second dielectric layer between said first and second metal layers;

a passivation layer over said first metallization structure and over said first and second dielectric layers, wherein said passivation layer comprises an oxide layer and a nitride layer, wherein said nitride layer is over said oxide layer, and wherein a first opening in said passivation layer exposes a pad of said first metallization structure, wherein said first opening has a transverse dimension between 0.5 and 30 micrometers;

a polymer layer over said passivation layer, wherein a second opening in said polymer layer exposes said pad, and wherein said polymer layer has a thickness between 2 and 150 micrometers; and

a second metallization structure comprising a first portion in said second opening and a second portion on said polymer layer, wherein said first and second portions comprise electroplated copper, and wherein said second portion has a thickness greater than those of said first and second metal layers.

9. The integrated circuit chip of claim 8, wherein said polymer layer comprises polyimide.

10. The integrated circuit chip of claim 8, wherein said polymer layer comprises benzocyclobutene (BCB).

11. The integrated circuit chip of claim 8, wherein said nitride layer has a thickness greater than that of said oxide layer.

12. The integrated circuit chip of claim 8, wherein said polymer layer has a thickness greater than that of said passivation layer.

13. The integrated circuit chip of claim 8, wherein said first metallization structure comprises aluminum.

14. The integrated circuit chip of claim 8, wherein said first metallization structure comprises electroplated copper.

15. An integrated circuit chip comprising:

a silicon substrate;

multiple semiconductor devices in or on said silicon substrate, wherein one of said multiple semiconductor devices comprises a transistor;

a first dielectric layer over said silicon substrate;

a first metallization structure over said first dielectric layer, wherein said first metallization structure is connected to said multiple semiconductor devices, wherein said first metallization structure comprises a first metal layer and a second metal layer over said first metal layer;

a second dielectric layer between said first and second metal layers;

a passivation layer over said first metallization structure and over said first and second dielectric layers, wherein said passivation layer comprises an oxide layer and a nitride layer, wherein said nitride layer is over said oxide layer, and wherein a first opening in said passivation layer exposes a pad of said first metallization structure, wherein said first opening has a transverse dimension between 0.5 and 30 micrometers;

a polymer layer over said passivation layer, wherein a second opening in said polymer layer exposes said pad, wherein said second opening has a transverse dimension between 0.5 and 30 micrometers, and wherein said polymer layer has a thickness between 2 and 150 micrometers; and

a second metallization structure comprising a first portion in said second opening and a second portion on said polymer layer, wherein said first and second portions comprise electroplated copper, and wherein said second portion has a thickness greater than those of said first and second metal layers.

16. The integrated circuit chip of claim 15, wherein said polymer layer comprises polyimide.

17. The integrated circuit chip of claim 15, wherein said polymer layer comprises benzocyclobutene (BCB).

18. The integrated circuit chip of claim 15, wherein said polymer layer has a thickness greater than that of said passivation layer.

19. The integrated circuit chip of claim 15, wherein said first metallization structure comprises aluminum.

20. The integrated circuit chip of claim 15, wherein said first metallization structure comprises electroplated copper.