Asset Including a Radio Frequency Identification Tag and Method of Forming the Same

• US 20080094223A1
• Filed: 10/23/2007
• Published: 04/24/2008
• Est. Priority Date: 10/23/2006
• Status: Abandoned Application

• Current Assignee: Xterprise Incorporated (SML Group Limited)
• Original Assignee: Xterprise Incorporated (SML Group Limited)
• Inventors: Frew, Dean, Svalesen, Richard
• Application Number:
  US11/876,978
• Publication Number:
  US 20080094223A1
• Time in Patent Office: Days
• US Class Current: 340/572.7
• CPC Class Codes: G06K 19/041 Constructional details G06K19/06 takes precedence

Abstract

An asset including a radio frequency identification (RFID) tag and method of forming the same are presented. In one embodiment, the asset includes an asset carrier surrounding the asset and an RFID tag coupled to the asset carrier. The RFID tag includes a carrier, an integrated circuit located in the carrier, and an antenna coupled to the carrier about multiple sides of the asset. The RFID tag also includes an encapsulant surrounding the carrier and the antenna.

Claims

1. An asset, comprising:

an asset carrier surrounding said asset; and

a radio frequency identification (RFID) tag coupled to said asset carrier, including;

a carrier,

an integrated circuit located in said carrier,

an antenna coupled to said carrier about multiple sides of said asset, and

an encapsulant surrounding said carrier and said antenna.

2. The asset as recited in claim 1 wherein said antenna is located about three sides of said asset.

3. The asset as recited in claim 1 wherein said RFID tag is located within said asset carrier.

4. The asset as recited in claim 1 wherein said encapsulant is a plastic laminated encapsulant.

5. The asset as recited in claim 1 wherein said RFID tag further includes an adhesive coupled to said carrier and a strain relief member coupled to said adhesive on a surface opposite said carrier, said encapsulant surrounding said adhesive and said strain relief member.

6. The asset as recited in claim 5 wherein said adhesive and said strain relief member cover at least a portion of a surface area of said carrier and said antenna.

7. The asset as recited in claim 5 wherein said strain relief member is formed from a temperature resistive material.

8. A method of forming an asset, comprising:

providing an asset carrier around said asset; and

coupling a radio frequency identification (RFID) tag to said asset carrier, including;

providing an integrated circuit in a carrier,

coupling an antenna to said carrier about multiple sides of said asset, and

surrounding said carrier and said antenna with an encapsulant.

9. The method as recited in claim 8 wherein said antenna is located about three sides of said asset.

10. The method as recited in claim 8 wherein said RFID tag is located within said asset carrier.

11. The method as recited in claim 8 wherein said encapsulant is a plastic laminated encapsulant.

12. The method as recited in claim 8 wherein said coupling said RFID tag to said asset carrier further includes:

coupling an adhesive to said carrier, and

coupling a strain relief member to said adhesive on a surface opposite said carrier, said encapsulant surrounding said adhesive and said strain relief member.

13. The method as recited in claim 12 wherein said adhesive and said strain relief member cover at least a portion of a surface area of said carrier and said antenna.

14. The method as recited in claim 12 wherein said strain relief member is formed from a temperature resistive material.

15. A radio frequency identification (RFID) system, comprising:

an RFID reader; and

an asset, including;

an asset carrier surrounding said asset, and

an RFID tag coupled to said asset carrier, including;

a carrier,

an integrated circuit located in said carrier,

an antenna coupled to said carrier about multiple sides of said asset, and

an encapsulant surrounding said carrier and said antenna.

16. The RFID system as recited in claim 15 wherein said antenna is located about three sides of said asset.

17. The RFID system as recited in claim 15 wherein said RFID tag is located within said asset carrier.

18. The RFID system as recited in claim 15 wherein said encapsulant is a plastic laminated encapsulant.

19. The RFID system as recited in claim 15 wherein said RFID tag further includes an adhesive coupled to said carrier and a strain relief member coupled to said adhesive on a surface opposite said carrier, said encapsulant surrounding said adhesive and said strain relief member.

20. The RFID system as recited in claim 19 wherein said adhesive and said strain relief member cover at least a portion of a surface area of said carrier and said antenna.