Light-emitting devices and related systems

• US 20080099777A1
• Filed: 12/30/2005
• Published: 05/01/2008
• Est. Priority Date: 10/19/2005
• Status: Abandoned Application

• Current Assignee: Rambus International Ltd (Rambus Inc.)
• Original Assignee: Luminus Devices Incorporated (Sanan Optoelectronics Company Limited)
• Inventors: Nemchuk, Nikolay I., Lim, Michael, Erchak, Alexei A., Lidorikis, Elefterios, Venezia, Jo A., Karlicek, Robert F.
• Application Number:
  US11/323,332
• Publication Number:
  US 20080099777A1
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21V 19/001 the light sources being semiconductors devices, e.g. LEDs
• CPC Class Codes: F21V 29/71 using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
• CPC Class Codes: F21V 29/74 with fins or blades
• CPC Class Codes: F21V 29/83 the elements having apertures, ducts or channels, e.g. heat radiation holes
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49113 the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 Silicon [Si]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/0105 Tin [Sn]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H01L 33/648 : the elements comprising fluids, e.g. heat-pipes

Abstract

Light-emitting devices can include a package that supports one or more light-emitting die (e.g., light-emitting diode die, laser diode die) and which can ensure mechanically stability, can facilitate electrical and/or thermal coupling with light-emitting die, and can manipulate the manner by which light generated by the die is emitted out of the light-emitting device. The package can also facilitate the integration of the light-emitting devices in various components and systems. For example, suitable packages may facilitate the use of light-emitting devices in components and systems such as light-emitting panel assemblies, LCD back lighting, general lighting, decorative or display lighting, automotive lighting, and other types of lighting components and systems.

Claims

1. A light-emitting device comprising:

a sub-package including a front side and a back side;

a light-emitting die supported on the front side of the sub-package; and

a heat spreading component attached to a backside of the sub-package to form a first contact area therebetween,

wherein the light-emitting device is capable of dissipating more than 10 W of heat away from the light-emitting die.

2. The light-emitting device of claim 1, wherein the heat spreading component comprises a heat pipe.

3. The light-emitting device of claim 1, wherein the external heat sink comprises a heat pipe.

4. The light-emitting device of claim 1, wherein the heat spreading component has a thickness greater than 3 times a thickness of the light-emitting die.

5. The light-emitting device of claim 1, wherein the heat spreading component has a thickness greater than about 3 mm.

6. The light-emitting device of claim 1, wherein the heat spreading component comprises a non-smooth surface region configured to increase heat conduction to a surrounding ambient.

7. The light-emitting device of claim 6, wherein the non-smooth surface region comprises a finned region.

8. The light-emitting device of claim 1, wherein the heat spreading component comprises at least one cavity extending into an interior of the heat spreading component.

9. The light-emitting device of claim 8, wherein the at least one cavity extends from a first surface to a second surface of the heat spreading component, via the interior of the heat spreading component.

10. The light-emitting device of claim 9, wherein the heat spreading component comprises a copper component.

11. The light-emitting device of claim 1, wherein the heat spreading component comprises a copper plate.

12. The light-emitting device of claim 1, wherein the heat spreading component comprises an aluminum component.

13. The light-emitting device of claim 1, wherein the heat spreading component comprises an aluminum plate.

14. The light-emitting device of claim 1, wherein the heat spreading component has a thermal conductivity greater than 80 W/mK.

15. The light-emitting device of claim 1, further comprising a first attachment material attaching the sub-package back side and the heat spreading component at the first contact area.

16. The light-emitting device of claim 15, further comprising a second attachment material attaching the heat spreading component backside and the external heat sink at the second contact area.

17. The light-emitting device of claim 16, wherein the second attachment material includes at least 10% voiding.

18. A light-emitting device comprising:

a sub-package including a front side and a back side;

a light-emitting die supported on the front side of the sub-package;

a heat spreading component attached to a backside of the sub-package to form a first contact area therebetween; and

an external heat sink attached to a backside of the heat spreading component to form a second contact area therebetween,

wherein the second contact area is greater than the first contact area.

19. The light-emitting device of claim 18, wherein the light-emitting device is capable of dissipating more than 10 W of heat away from the light-emitting die.

20. The light-emitting device of claim 18, wherein the heat spreading component comprises a heat pipe.

21. The light-emitting device of claim 18, wherein the external heat sink comprises a heat pipe.

22. The light-emitting device of claim 18, wherein the second contact area is about 2 times greater than the first contact area.

23. The light-emitting device of claim 18, wherein the second contact area is about 6 times greater than the first contact area.

24. The light-emitting device of claim 18, wherein the heat spreading component has a thickness greater than 3 times a thickness of the light-emitting die.

25. The light-emitting device of claim 18, wherein the heat spreading component has a thickness greater than about 3 mm.

26. The light-emitting device of claim 18, wherein the heat spreading component comprises a non-smooth surface region configured to increase heat conduction to a surrounding ambient.

27. The light-emitting device of claim 26, wherein the non-planar surface region of the heat spreading component comprises a finned region.

28. The light-emitting device of claim 18, wherein the heat spreading component comprises at least one cavity extending into an interior of the heat spreading component.

29. The light-emitting device of claim 28, wherein the at least one cavity extends from a first surface to a second surface of the heat spreading component, via the interior of the heat spreading component.

30. The light-emitting device of claim 18, wherein the heat spreading component comprises a copper component.

31. The light-emitting device of claim 18, wherein the heat spreading component comprises a copper plate.

32. The light-emitting device of claim 18, wherein the heat spreading component comprises an aluminum component.

33. The light-emitting device of claim 18, wherein the heat spreading component comprises an aluminum plate.

34. The light-emitting device of claim 18, wherein the heat spreading component has a thermal conductivity greater than 80 W/mK.

35. The light-emitting device of claim 18, further comprising a first attachment material attaching the sub-package back side and the heat spreading component at the first contact area.

36. The light-emitting device of claim 35, further comprising a second attachment material attaching the heat spreading component backside and the external heat sink at the second contact area.

37. The light-emitting device of claim 36, wherein the second attachment material includes at least 10% voiding.