Method And Apparatus For Providing Active Compliance In A Probe Card Assembly

• US 20080100312A1
• Filed: 11/01/2006
• Published: 05/01/2008
• Est. Priority Date: 11/01/2006
• Status: Active Grant

• Current Assignee: FormFactor Incorporated
• Original Assignee: FormFactor Incorporated
• Inventors: Breinlinger, Keith
• Granted Patent: US 7,825,675 B2
• Time in Patent Office: Days
• US Class Current: 324/754
• CPC Class Codes: G01R 31/2891 related to sensing or controlling of force, position, temperature G01R31/2874 takes precedence; sensing of force G01L; sensing of position G01B, G01D; sensing of temperature G01K; controlling in general G05

Abstract

A probe card assembly can comprise a first source of compliance and a second source of compliance. The probe card assembly can further comprise a controller, which can be configured to apportion a total compliance demand placed on the probe card assembly between the first source of compliance and the second source of compliance.

Claims

1. A probe card assembly comprising:

a first source of compliance;

a second source of compliance; and

a controller configured to apportion a total compliance demand placed on the probe card assembly between the first source of compliance and the second source of compliance.

2. The probe card assembly of claim 1, wherein:

the first source of compliance comprises a plurality of probes disposed on a probe head assembly and configured to contact an electronic device to be tested; and

the second source of compliance comprises an actuator configured to change, in response to a control signal from the controller, a position of the probe head assembly.

3. The probe card assembly of claim 2, wherein the controller is configured to control the actuator in response to a signal corresponding to the total compliance demand.

4. The probe card assembly of claim 3 further comprising a sensor configured to sense a parameter relating to the total compliance demand and generate the signal corresponding to a compliance demand of the probe card assembly.

5. The probe card assembly of claim 4, wherein:

the signal generated by the sensor corresponds to a level of force on at least one of the probes, and

the controller is configured to control the actuator to reduce the level of the force.

6. The probe card assembly of claim 5, wherein the controller is configured to control the actuator to reduce the level of the force if the level of the force exceeds a predetermined threshold.

7. The probe card assembly of claim 5 further comprising a plurality of actuators, wherein:

the sensor is further configured to sense a plurality of forces on ones of the probes in a plurality of sectors of the probe head assembly and generate a plurality of signals corresponding to the forces; and

the controller is further configured to control individually each actuator to reduce individually a level of one of the forces associated with a particular sector.

8. The probe card assembly of claim 4, wherein the signal provided by the sensor relates to an orientation of the probes with respect to the electronic device to be tested.

9. The probe card assembly of claim 4, wherein the sensor comprises a plurality of sensors each configured to provide a signal relating to a distance between a portion of the probe head assembly and a corresponding portion of the electronic device to be tested.

10. The probe card assembly of claim 9 further comprising a plurality of actuators, wherein each of the actuators is configured to selectively move a portion of the probe card assembly.

11. The probe card assembly of claim 4, wherein the sensor comprises a plurality of sensors each configured to provide a signal indicating contact between one of the probes and the electronic device to be tested.

12. The probe card assembly of claim 4, wherein the actuator is machine driven and the controller receives as input the signal from the sensor and outputs a control signal for driving the actuator.

13. The probe card assembly of claim 2, wherein the electronic device to be tested comprises a plurality of semiconductor dies.

14. A method of making a probe card assembly, the method comprising:

configuring a plurality of probes attached to a probe head assembly to provide a first source of compliance in response to contact between the probes and an electronic device to be tested;

configuring a sensor to generate a signal relating to a total compliance demand of the probe card assembly;

configuring an actuator to move selectively, in response to a control signal, the probe head assembly; and

configuring a controller to receive as an input the signal generated by the sensor and output the control signal to the actuator to provide a second source of compliance.

15. The method of claim 14, wherein the configuring the controller further comprises configuring the controller to output the control signal to move the actuator to provide the second source of compliance in an amount sufficient to meet, with the first source of compliance, the compliance demand of the probe card assembly.

16. The method of claim 14, wherein:

the configuring the sensor comprises configuring the sensor to generate the signal to correspond to a force on at least one of the probes; and

the configuring the controller comprises configuring the controller to generate the control signal to cause the actuator to move the probe head assembly to reduce the force to a predetermined threshold value.

17. The method of claim 14 further comprising:

configuring a plurality of sensors to provide signals relating to a relationship between sectors of the probe head assembly and corresponding sectors of the electronic device;

configuring each of a plurality of actuators to apply a force to one of the sectors of the probe head assembly; and

the configuring the controller comprises configuring the controller to receive as input signals from the sensors and generate as output control signals for driving the actuators.

18. A method of using a probe card assembly, the method comprising:

testing an electronic device, wherein the testing comprises bringing probes of the probe card assembly and terminals of the electronic device into contact, wherein the probes are resilient and provide a first source of compliance in response to the contact between the probes and the terminals; and

during the testing;

monitoring a compliance demand of the probe card assembly, and

altering a position of the probes with respect to the electronic device to provide a second source of compliance that, in combination with the first source of compliance, is sufficient to meet the compliance demand of the probe card assembly.

19. The method of claim 18, wherein the testing further comprises providing test signals to the electronic device through ones of the probes.

20. The method of claim 18, wherein:

the monitoring comprises monitoring a force on one of the probes, and

the altering comprises altering a position of the probes with respect to the electronic device to reduce the force.

21. The method of claim 20, wherein the altering comprises altering a position of the probes with respect to the electronic device if the force exceeds a threshold value.

22. The method of claim 18 wherein:

the monitoring comprises monitoring a plurality of forces on a plurality of the probes, and

the altering comprises moving one or more selected portions of a probe head assembly to which the probes are attached to balance the plurality of forces.

23. The method of claim 18, wherein:

the monitoring comprises, while bringing the electronic device and the probe card assembly into contact, determining a difference between an orientation of the probes and an orientation of the electronic device, and

the altering comprises, if the difference exceeds a threshold value, selectively moving one or more portions of the probe head assembly to reduce the difference.

24. The method of claim 23, wherein the altering comprises selectively moving one or more portions of the probe head assembly if the difference exceeds a threshold value.

25. The method of claim 18, wherein the altering comprises activating at least one actuator.

26. The method of claim 18, wherein:

the monitoring comprises, determining distances between portions of a probe head assembly to which the probes are attached and corresponding portions of the electronic device, and

determining whether a difference between ones of the distances exceeds a threshold.

27. The method of claim 20, wherein the altering comprises applying at least one force to at least one portion of the probe head assembly to reduce the difference.

28. The method of claim 18, wherein the bringing comprises moving the probe card assembly.

29. The method of claim 18, wherein the electronic device comprises a plurality of semiconductor dies.

30. A probe card assembly comprising:

a probe head assembly comprising a plurality of probes disposed to make electrical connections with terminals of an electronic device while the terminals are pressed against and moved an over travel distance past first contact with the probes, wherein the probes are resilient and provide a first source of compliance; and

moving means for moving the probe head assembly to provide a second source of compliance.

31. The probe card assembly of claim 30, wherein the moving means comprises:

a plurality of sensors;

a plurality of actuators; and

a controller configured to control the actuators in accordance with signals from the sensors.

32. The probe card assembly of claim 31, wherein the sensors comprise devices each configured to produce a signal that corresponds to a force on one of the probes.

33. The probe card assembly of claim 31, wherein the sensors comprise devices each configured to produce a signal that corresponds to a distance between a portion of the probe head assembly and a corresponding portion of the electronic device.