Inductor structure
First Claim
1. An inductor structure, located in a semiconductor substrate, the semiconductor substrate comprising a topmost interconnect in a first dielectric layer, a second dielectric layer under the first dielectric layer, and at least one via in the second dielectric layer and filled with a via plug connecting the topmost interconnect, the inductor structure comprising:
- a first conductive layer in a spiral shape filled in a trench opening in the first dielectric layer and comprising a same material as the topmost interconnect; and
a second conductive layer in the second dielectric layer beneath the first conductive layer and connecting the bottom of the first conductive layer with its top, the second conductive layer having a same shape as the spiral shape and comprising a same material as the via plug.
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Accused Products
Abstract
An inductor structure is disclosed in the present invention. The inductor structure is formed in a semiconductor substrate, in which a spiral first conductive layer and the topmost interconnect of a multilevel interconnection structure are simultaneously formed in a first dielectric layer, the first conductive layer has the same material as the topmost interconnect has, a second conductive layer and the via plug of the multilevel interconnection structure are simultaneously formed, the second conductive layer is filled in a trench opening in a second dielectric layer, beneath the first conductive layer, and attached to the bottom of the first conductive layer to become an integrated whole. Thus, the cross-sectional area of the conductive layer of the coil is increased and the resistance can be reduced to obtain higher Q factor.
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Citations
9 Claims
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1. An inductor structure, located in a semiconductor substrate, the semiconductor substrate comprising a topmost interconnect in a first dielectric layer, a second dielectric layer under the first dielectric layer, and at least one via in the second dielectric layer and filled with a via plug connecting the topmost interconnect, the inductor structure comprising:
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a first conductive layer in a spiral shape filled in a trench opening in the first dielectric layer and comprising a same material as the topmost interconnect; and a second conductive layer in the second dielectric layer beneath the first conductive layer and connecting the bottom of the first conductive layer with its top, the second conductive layer having a same shape as the spiral shape and comprising a same material as the via plug. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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Specification