Low Profile Internal Antenna

• US 20080100516A1
• Filed: 10/27/2006
• Published: 05/01/2008
• Est. Priority Date: 10/27/2006
• Status: Active Grant

• Current Assignee: Google Technology Holdings LLC (Alphabet Inc.)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Faraone, Antonio, DiNallo, Carlo
• Granted Patent: US 7,642,964 B2
• Time in Patent Office: Days
• US Class Current: 343/702
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 13/10 Resonant slot antennas
• CPC Class Codes: H01Q 5/357 using a single feed point

Abstract

A multi-band folded inverted conformal antenna (101), suitable for use internally within an electronic device (501), facilitates low-profile designs with the multi-band folded inverted conformal antenna (601) extending less than five millimeters above a circuit substrate (102) in some embodiments. The multi-band folded inverted conformal antenna (601) includes planar sections and a slot (407), and is capable of multi-mode operation. For example, one embodiment is configured to operate in a first common mode (401), a differential mode (402), and a second common mode (403), thereby allowing the multi-band folded inverted conformal antenna (601) to operate in a first operational bandwidth, second operational bandwidth, and third operational bandwidth. Portions of the ground plane conductor (103) passing beneath the multi-band folded inverted conformal antenna (101) are selectively removed at areas corresponding to concentrations of electrical charge, thereby allowing a more low-profile design.

Claims

1. A low-profile antenna assembly, comprising:

a. a multiband folded inverted conformal antenna element; and

b. a circuit substrate coupled to the multiband folded inverted conformal antenna element, the circuit substrate comprising a ground plane structure;

wherein the ground plane structure comprises one or more ground plane voids disposed at locations corresponding to electric charge concentrations associated with the multiband folded inverted conformal antenna.

2. The low-profile antenna assembly of claim 1, wherein the multiband folded inverted conformal antenna element comprises a planar portion separated from the circuit substrate by an antenna height, wherein the antenna height is less than five millimeters.

3. The low-profile antenna assembly of claim 1, wherein the circuit substrate comprises a printed circuit board having a distal end comprising one or more corner regions, wherein the multiband folded inverted conformal antenna element is disposed at the distal end.

4. The low-profile antenna assembly of claim 3, wherein the one or more ground plane voids are disposed at least at the one or more corner regions.

5. The low-profile antenna assembly of claim 3, wherein the one or more ground plane voids are disposed along an edge of the printed circuit board.

6. The low-profile antenna assembly of claim 4, wherein the circuit substrate comprises a circuit substrate width, wherein a corner region width of the one or more corner regions is less than twenty-five percent of the circuit substrate width.

7. The low-profile antenna assembly of claim 3, wherein the ground plane conductor at the distal end comprises a T-shaped cross-section.

8. The low-profile antenna assembly of claim 1, wherein the multiband folded inverted conformal antenna element is configured to operate in at least a first common mode, a differential mode, and a second common mode.

9. The low-profile antenna assembly of claim 1, wherein the multiband folded inverted conformal antenna element produces a tri-mode electromagnetic response having at least a first operational bandwidth, a second operational bandwidth, and a third operational bandwidth.

10. The low-profile antenna assembly of claim 9, wherein an electric charge associated with the multiband folded inverted conformal antenna when operating in one of the first operational bandwidth, the second operational bandwidth, or the third operational bandwidth is maximized at locations corresponding to the one or more ground plane voids.

11. The low-profile antenna assembly of claim 1, further comprising a transceiver circuit coupled to the multiband folded inverted conformal antenna, wherein the transceiver circuit is capacitively coupled to the multiband folded inverted conformal antenna.

12. The low-profile antenna assembly of claim 1, wherein the multiband folded inverted conformal antenna element comprises at least one side portion extending distally from the circuit substrate, further wherein the multiband folded inverted conformal antenna element comprises at least one slot.

13. The low-profile antenna assembly of claim 12, wherein at least a portion of the slot passes along the at least one side portion.

14. The low-profile antenna assembly of claim 12, wherein the multiband folded inverted conformal antenna further comprises a planar portion extending from the at least one side portion such that the planar portion is substantially parallel with the circuit substrate, wherein the planar portion is substantially U-shaped.

15. The low-profile antenna assembly of claim 1, wherein the multiband folded inverted conformal antenna element comprises a conductor having at least a first face, a second face, and a third face, wherein the second face couples the first face to the third face, wherein transitions from the first face to the second face and from the second face to the third face occur above the one or more ground plane voids.

18. The two-way communication device of claim 15, wherein the corner regions comprise a corner region length and a corner region width, wherein both the corner region length and the corner region width are less than 1/15^th of the longest resonant wavelength of the internal folded inverted conformal antenna element.

20. The antenna assembly of claim 18, wherein the T-shaped conformal antenna folded back on ground comprises a first side extending distally from the printed circuit board and a second side extending substantially orthogonally from the first side, wherein the T-shaped conformal antenna folded back on ground comprises a slot traversing at least the first side and the second side.

16. A two-way communication device, comprising an internal folded inverted conformal antenna element coupled to a printed circuit board having a ground plane, wherein portions of the ground plane disposed beneath radiating elements of the internal folded inverted conformal antenna element are removed at locations corresponding to an electric charge configuration associated with the internal folded inverted conformal antenna element operating within an operational bandwidth.

17. The two-way communication device of claim 16, wherein the printed circuit board has an end comprising corner regions, wherein the internal folded inverted conformal antenna element is coupled to the printed circuit board at the end, wherein the portions of the ground plane are located in the corner regions.

19. An antenna assembly, comprising a T-shaped conformal antenna folded back on ground coupled to a printed circuit board having a ground plane coupled thereto, wherein the T-shaped conformal antenna folded back on ground is electrically coupled to the ground plane at a single point, wherein the ground plane comprises ground plane voids disposed beneath at least portions of the T-shaped conformal antenna folded back on ground.