Reflective Light Source Device and Manufacture Method Thereof

• US 20080100772A1
• Filed: 10/30/2007
• Published: 05/01/2008
• Est. Priority Date: 11/01/2006
• Status: Abandoned Application

• Current Assignee: AU Optronics Corporation
• Original Assignee: AU Optronics Corporation
• Inventors: Lin, Yu-Chuan, Lin, Po-Iem
• Application Number:
  US11/928,225
• Publication Number:
  US 20080100772A1
• Time in Patent Office: Days
• US Class Current: 349/61
• CPC Class Codes: G02F 1/133615 Edge-illuminating devices, i.e. illuminating from the side
• CPC Class Codes: H01L 2224/48 of an individual wire connector
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H05K 1/0274 Optical details, e.g. printed circuits comprising integral optical means H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/2054 Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
• CPC Class Codes: H05K 3/3452 Solder masks

Abstract

The present invention provides a backlight module and a light source device used therein. The present invention also provides the light source device manufacturing method. The light source device comprises a circuit substrate, light-emitting elements and a solder-resist reflective layer. The circuit substrate has a metal circuit layer and contacts thereon. The light-emitting elements are arranged in the form of arrays on the circuit substrate and are connected to the contacts. One end of each contact is connected to the metal circuit layer, and the other end is connected to the light-emitting element. The solder-resist reflective layer is formed on the circuit substrate and is disposed on the same side as the light-emitting elements. The solder-resist reflective layer covers the metal circuit layer but exposes the contacts.

Claims

1. A light source device comprising:

a circuit substrate having two or more contacts;

at least one light-emitting element being electrically connected to said contact; and

a solder-resist reflective layer formed on said circuit substrate and disposed on the same side as said light-emitting element, said solder-resist reflective layer is distributed between said contacts.

2. The light source device of claim 1, wherein the wavelength of reflective spectrum of said solder-resist reflective layer ranges between 380 nm (nanometer) and 780 nm.

3. The light source device of claim 2, wherein said solder-resist reflective layer has a reflectance over 95% for visible light having wavelength between 380 nm and 780 nm.

4. The light source device of claim 1, wherein said light-emitting element includes a light emitting diode (LED).

5. The light source device of claim 1, wherein said solder-resist reflective layer is made of mixture having a solder-resist material and a reflective material.

6. The light source device of claim 5, wherein said solder-resist material includes a thermosetting resin.

7. The light source device of claim 5, wherein said solder-resist material includes an acrylic ester.

8. The light source device of claim 5, wherein said reflective material is selected from the group of barium sulfate, titanium oxide, boron nitride, aluminum oxide and the combination thereof.

9. The light source device of claim 1, wherein said solder-resist reflective layer has a white upper surface.

20. A backlight module for a liquid crystal display device containing a light source device as claimed in claim 1.

10. A light source device manufacturing method comprising the following steps:

preparing a circuit substrate having at least one contact;

forming a solder-resist reflective layer on said circuit substrate and exposing said contact; and

disposing a light-emitting element on said contact.

11. The light source device manufacturing method of claim 10, wherein said circuit substrate preparing step includes copper foil circuit etching.

12. The light source device manufacturing method of claim 10, wherein said solder-resist reflective layer forming step includes the following steps:

mixing a solder-resist material and a reflective material to create a solder-resist reflective material; and

distributing said solder-resist reflective material over said circuit substrate to form said solder-resist reflective layer.

13. The light source device manufacturing method of claim 12, wherein said solder-resist reflective material distributing step includes coating, printing, or sputtering said solder-resist reflective material onto said circuit substrate.

14. The light source device manufacturing method of claim 12 further comprising a development process performed on said solder-resist reflective material distributed over said circuit substrate.

15. The light source device manufacturing method of claim 12 further comprising a baking process performed on said solder-resist reflective material distributed over said circuit substrate.

16. The light source device manufacturing method of claim 12, wherein said solder-resist reflective materials mixing step includes adjusting the ratio of said solder-resist material to said reflective material to make the reflectance of said mixed solder-resist reflective material greater than 95% for visible light having wavelength between 380 nm and 780 nm.

17. The light source device manufacturing method of claim 12, wherein said solder-resist material is selected from the group of epoxy resin, acrylic ester and the combination thereof.

18. The light source device manufacturing method of claim 12, wherein said reflective material is selected from the group of barium sulfate, titanium oxide, boron nitride, aluminum oxide and the combination thereof.

19. The light source manufacturing method of claim 10, wherein said light-emitting element disposing step includes performing a surface mount process to connect said light-emitting element onto said contact.