PASSIVE HEAT-DISSIPATING TYPE POWER SUPPLY APPARATUS FOR INCREASING HEAT-DISSIPATING EFFICIENCY AND FABRICATING PROCESS THEREOF

• US 20080101039A1
• Filed: 06/19/2007
• Published: 05/01/2008
• Est. Priority Date: 10/31/2006
• Status: Abandoned Application

• Current Assignee: Delta Electronics Incorporated
• Original Assignee: Delta Electronics Incorporated
• Inventors: Hsu, Jui-Yuan, Chang, Chien-Chung, Wu, Wen-Ching
• Application Number:
  US11/764,856
• Publication Number:
  US 20080101039A1
• Time in Patent Office: Days
• US Class Current: 361/720
• CPC Class Codes: H05K 7/209 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20909 takes precedence
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

The present invention relates to a power supply apparatus having a passive heat-dissipating mechanism. The power supply apparatus includes an insulating housing, a printed circuit board and at least an electronic component. The insulating housing has a closed receptacle therein and includes a first edge, a second edge and a third edge. The first edge is greater than the second edge and the second edge is greater than or equal to the third edge. An aspect ratio of the first edge to the second edge is greater than 2.5. The electronic component is mounted on the printed circuit board.

Claims

1. A power supply apparatus having a passive heat-dissipating mechanism, said power supply apparatus comprising:

an insulating housing having a closed receptacle therein and including a first edge, a second edge and a third edge, wherein said first edge is greater than said second edge and said second edge is greater than or equal to said third edge, and an aspect ratio of said first edge to said second edge is greater than 2.5;

a printed circuit board accommodated in said receptacle of said insulating housing; and

at least an electronic component mounted on said printed circuit board.

2. The power supply apparatus according to claim 1 wherein said aspect ratio of said first edge to said second edge is in a range of from 2.5 to 20.0.

3. The power supply apparatus according to claim 1 wherein said power supply apparatus is a power adapter.

4. The power supply apparatus according to claim 1 further comprising a power input member and a power output member disposed on opposite sides of said insulating housing and electrically connected to said printed circuit board.

5. The power supply apparatus according to claim 1 wherein said insulating housing is substantially a rectangular solid, and said first edge, said second edge and said third edge correspond to a length, a width and a height, respectively.

6. The power supply apparatus according to claim 5 wherein said insulating housing is substantially stick-shaped.

7. A process for fabricating a power supply apparatus having a passive heat-dissipating mechanism, said process comprising steps of:

providing an insulating housing having a closed receptacle therein and including a first edge, a second edge and a third edge, wherein said first edge is greater than said second edge and said second edge is greater than or equal to said third edge, and an aspect ratio of said first edge to said second edge is greater than 2.5;

providing a printed circuit board having at least an electronic component mounted thereon; and

accommodating said printed circuit board within said receptacle of said insulating housing, thereby fabricating said power supply apparatus.

8. The process according to claim 7 wherein said aspect ratio of said first edge to said second edge is in a range of from 2.5 to 20.0.

9. The process according to claim 7 wherein said power supply apparatus is a power adapter.

10. The process according to claim 7 further comprising a step of electrically connecting a power input member and a power output member to said printed circuit board.

11. The process according to claim 7 wherein said insulating housing is substantially a rectangular solid, and said first edge, said second edge and said third edge correspond to a length, a width and a height, respectively.

12. The process according to claim 11 wherein said insulating housing is substantially stick-shaped.

13. A process for fabricating a power supply apparatus having a passive heat-dissipating mechanism, said process comprising steps of:

providing an insulating housing having a closed receptacle therein and including a first edge, a second edge and a third edge, wherein said first edge is greater than said second edge, said second edge is greater than or equal to said third edge, and said insulating housing has a constant volume;

selecting a desired value of said third edge, and adjusting an aspect ratio of said first edge to said second edge to be greater than 2.5;

providing a printed circuit board having at least an electronic component mounted thereon; and

accommodating said printed circuit board within said receptacle of said insulating housing, thereby fabricating said power supply apparatus.

14. The process according to claim 13 wherein said aspect ratio of said first edge to said second edge is in a range of from 2.5 to 20.0.

15. The process according to claim 13 wherein said power supply apparatus is a power adapter.

16. The process according to claim 13 further comprising a step of electrically connecting a power input member and a power output member to said printed circuit board.

17. The process according to claim 13 wherein said insulating housing is substantially a rectangular solid, and said first edge, said second edge and said third edge correspond to a length, a width and a height, respectively.

18. The process according to claim 17 wherein said insulating housing is substantially stick-shaped.