ETCHING OXIDE WITH HIGH SELECTIVITY TO TITANIUM NITRIDE

• US 20080102640A1
• Filed: 10/30/2006
• Published: 05/01/2008
• Est. Priority Date: 10/30/2006
• Status: Abandoned Application

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Hassan, Sajjad Amin, Ying, Chentsau
• Application Number:
  US11/554,425
• Publication Number:
  US 20080102640A1
• Time in Patent Office: Days
• US Class Current: 438/704
• CPC Class Codes: H01L 21/31116 by dry-etching
• CPC Class Codes: H01L 21/67069 for drying etching

Abstract

A substrate comprising an oxide layer covering a nitride layer, is etched in a process zone of a substrate processing chamber. A process gas comprising H₂ gas is introduced into the process zone, and the process gas is energized to etch through the oxide layer to at least partially expose the nitride layer. The energized process gas has a selectivity of etching the oxide layer to the nitride layer of at least about 25:1.

Claims

1. A method for etching a substrate, the method comprising:

(a) providing a substrate in a process zone, the substrate comprising an oxide layer above a titanium nitride layer;

(b) introducing a process gas comprising H₂ into the process zone; and

(c) energizing the process gas to etch through the oxide layer to at least partially expose the titanium nitride layer, the energized process gas having an etching selectivity ratio of etching the oxide layer to etching the titanium nitride layer of at least 25;

1.

2. A method according to claim 1 wherein the oxide layer comprises a silicon dioxide layer.

3. A method according to claim 2 wherein the substrate further comprises a silicon nitride layer above the titanium nitride layer.

4. A method according to claim 2 wherein the selectivity ratio of etching the silicon dioxide layer to etching the titanium nitride layer is from about 26:

1 to about 28;

1.

5. A method according to claim 2 wherein the silicon dioxide layer etching rate is greater than about 6000 angstroms per minute.

6. A method according to claim 1 wherein the process gas comprises a halogenated non-hydrogen-containing gas and a carrier gas.

7. A method according to claim 6 wherein the volumetric flow ratio of the halogenated non-hydrogen-containing gas to hydrogen gas is from about 1:

2 to about 12;

1.

8. A method according to claim 7 wherein the volumetric flow ratio of halogenated non-hydrogen-containing gas to hydrogen gas is from about 2:

1 to about 8;

1.

9. A method according to claim 6 wherein the halogenated non-hydrogen-containing gas comprises at least one of CF₄, C₂F₆ and C₄F₈.

10. A method according to claim 6 further comprising a halogenated hydrogen-containing gas comprising at least one of CHF₃, CHF₃, CH₂F₂ and CH₃F.

11. A method according to claim 6 wherein the carrier gas comprises at least one of Ar, He, N₂ and Ne.

12. A method according to claim 1 wherein the substrate comprises aluminum features under the titanium nitride layer.

13. A method according to claim 1 wherein step (c) comprises energizing the process gas by coupling a source RF power of from about 500 to about 4500 Watts and a bias RF power of from about 10 to about 2000 Watts to the process gas.

14. A method for etching a substrate in a substrate processing chamber comprising an antenna and process electrodes, the method comprising:

(a) providing a substrate in the chamber, the substrate comprising a silicon dioxide layer above a titanium nitride layer;

(b) introducing a process gas comprising an etchant gas, a carrier gas and H₂ gas into the chamber; and

(c) applying a bias RF power level to the process electrodes and a source RF power level to the antenna to energize the process gas to etch the silicon dioxide layer at a faster rate than the titanium nitride layer, the energized process gas having a selectivity of etching the silicon dioxide layer to the titanium nitride layer of at least 25;

1.

15. A method according to claim 14 wherein the process gas has a selectivity of etching the silicon dioxide layer to the titanium nitride layer of from about 26:

1 to about 28;

1.

16. A method according to claim 14 wherein the silicon dioxide layer etch rate is greater than about 6000 angstroms per minute.

17. A method according to claim 14 wherein the etchant gas comprises CF₄ and CHF₃ and the carrier gas comprises Ar.

18. A method according to claim 14 wherein the volumetric flow ratio of etchant gas to carrier gas to H₂ gas is about 10:

10;

1.

19. A method according to claim 14 wherein the bias RF power level is from about 500 to about 4500 Watts and the source RF power level is from about 10 to about 2000 Watts.

20. A method according to claim 14 wherein step (c) further comprises applying a bias RF power level to the process electrodes having a gap therebetween of from about 1 to about 4 inches.

21. A substrate processing apparatus comprising:

(a) a process chamber comprising;

(i) a substrate support comprising a receiving surface for a substrate;

(ii) a gas distributor to distribute a process gas in the chamber;

(iii) a gas energizer to energize the process gas, the gas energizer comprising an antenna and process electrodes; and

(iv) a gas exhaust to exhaust the process gas;

(b) a substrate transfer mechanism communicable to the process chamber, the substrate transfer mechanism configured to transfer a substrate to the chamber; and

(c) a controller operatively coupled to the process chamber, the substrate transfer mechanism, the gas distributor, the gas energizer and the gas is exhaust, the controller comprising a program code that includes instructions to operate;

(i) the substrate transfer mechanism;

(ii) the gas distributor; and

(iii) the gas energizer to apply a bias RF power level to the process electrodes and a source RF power level to the antenna, wherein the process gas is energized to etch a silicon dioxide layer relative to a titanium nitride layer with an etching selectivity ratio of at least 25;

1.

22. An apparatus according to claim 21 wherein the program code comprises instructions to operate the gas distributor and gas energizer to provide in the chamber an energized process gas having an etching ratio of etching the silicon dioxide layer to the titanium nitride layer of from about 26:

1 to about 28;

1.

23. An apparatus according to claim 21 wherein the program code comprises instructions to operate the gas energizer to apply a bias RF power level to the process electrodes and a source RF power level to the antenna, thereby energizing the process gas to etch the silicon dioxide layer at a rate greater than about 6000 angstroms per minute.

24. An apparatus according to claim 21 wherein the program code comprises instructions to operate the gas distributor to introduce a process gas comprising an etchant gas comprising CHF₃ and CF₄, and a carrier gas comprising Ar.

25. An apparatus according to claim 21 wherein the program code comprises instructions to operate the gas distributor to introduce a process gas comprising an etchant gas, carrier gas and H₂ gas into the chamber wherein the volumetric flow ratio of etchant gas to carrier gas to H₂ gas is about 10:

10;

1.

26. An apparatus according to claim 21 wherein the program code comprises instructions to operate the gas energizer to apply a bias RF power level of is from about 500 to about 4500 Watts to the process electrodes and a source RF power level of from about 10 to about 2000 Watts to the antenna.

27. An apparatus according to claim 21 wherein the program code comprises instructions to operate the gas distributor and gas exhaust to maintain the pressure in the chamber at from about 50 to about 600 mT.