On-board temperature/humidity sensor

• US 20080103722A1
• Filed: 09/11/2006
• Published: 05/01/2008
• Est. Priority Date: 09/07/2006
• Status: Abandoned Application

• Current Assignee: Qualcomm, Inc.
• Original Assignee: Qualcomm, Inc.
• Inventors: Mattis, Eric Stephen, Aldern, Scott, Krulce, Darrell L.
• Application Number:
  US11/519,318
• Publication Number:
  US 20080103722A1
• Time in Patent Office: Days
• US Class Current: 702/130
• CPC Class Codes: G07C 5/008 communicating information to a remotely located station transmission systems for measured values G08C
• CPC Class Codes: G07C 5/085 using electronic data carriers
• CPC Class Codes: H04Q 9/00 Arrangements in telecontrol or telemetry systems for selectively calling a substation from a main station, in which substation desired apparatus is selected for applying a control signal thereto or for obtaining measured values therefrom

Abstract

The specification and drawing figures describe and show an on-board temperature/humidity sensing device that includes an enclosure. The enclosure contains a circuit board. A sensor is mounted on the surface of the circuit board. The sensor is capable of monitoring environmental data within the enclosure. The sensor is operatively connected to a microprocessor with programmable sensor data acquisition capabilities capable of capable of establishing monitored threshold limits of environmental properties within the enclosure, monitoring, and transmitting environmental data to a remote data collector.

Claims

1. A system for monitoring temperature and humidity, comprising:

an enclosure adapted to contain a printed circuit board;

a sensor mounted on the surface of the printed circuit board adapted to monitor temperature and humidity within the enclosure; and

a microprocessor with programmable sensor data acquisition capabilities operatively connected to the sensor adapted to selectively establish monitored threshold limits of temperature and humidity ranges within the enclosure and to transmit temperature and humidity data collected from the sensor to a at least one remote data collector.

2. A system for monitoring temperature and humidity as recited in claim 1, wherein the sensor further monitors functionality of a modem operatively connected to the enclosure.

3. A system for monitoring temperature and humidity as recited in claim 2, wherein the sensor is mounted on a surface of the printed circuit board by soldering during manufacture of the printed circuit board.

4. A system for monitoring temperature and humidity as recited in claim 2, wherein the sensor is removably mountable on the surface of the printed circuit board.

5. A system for monitoring temperature and humidity as recited in claim 1, wherein the enclosure is mountable on a vehicle.

6. A system for monitoring temperature and humidity as recited in claim 1, wherein the microprocessor with programmable sensor data acquisition capabilities is operatively connected to one or more servers located remote from the enclosure.

7. In a vehicle-mounted enclosure, a sensing device, comprising:

a sensor,

wherein the sensor is mounted on an electronic circuit board for monitoring environmental properties within the enclosure;

means operatively connected to the sensor for selecting desired minimum and maximum ranges of the environmental properties within the enclosure; and

means operatively connected to the sensor for collecting data relating to the desired minimum and maximum ranges of the environmental properties within the enclosure; and

means operatively connected to the sensor for transmitting the data to a remote data collector.

8. In a vehicle-mounted enclosure, a sensing device as recited in claim 7, wherein the sensor is capable of monitoring temperature within the enclosure.

9. In a vehicle-mounted enclosure, a sensing device as recited in claim 7, wherein the sensor is capable of monitoring humidity within the enclosure.

10. In a vehicle-mounted enclosure, a sensing device as recited in claim 7, wherein the means operatively connected to the sensor for selecting desired minimum and maximum ranges of the environmental properties within the enclosure includes a microprocessor with programmable sensor data acquisition capabilities.

11. In a vehicle-mounted enclosure, a sensing device as recited in claim 10, wherein the microprocessor with programmable sensor data acquisition capabilities is capable of transmitting environmental data to at least one remote modem.

12. In a vehicle-mounted enclosure, a sensing device as recited in claim 7, wherein the means operatively connected to the sensor for collecting data relating to the desired minimum and maximum ranges of the environmental properties within the enclosure includes a microprocessor with programmable sensor data acquisition capabilities.

13. In vehicle-mounted enclosure, a sensing device as recited in claim 12, wherein the microprocessor with programmable sensor data acquisition capabilities is capable of transmitting environmental data to a plurality of remote data collectors.

14. A method for sensing temperature and humidity within a remote vehicle-mounted enclosure, comprising the steps of:

selecting material to form the enclosure;

manufacturing the enclosure;

installing within the enclosure a circuit board;

mounting on the circuit board a sensor adapted to monitor conditions within the enclosure; and

including a microprocessor with programmable sensor data acquisition capabilities in the enclosure for collecting and transmitting information about temperature and humidity within the enclosure to at least one server not located in the enclosure.

15. A method for sensing temperature and humidity within a remote vehicle-mounted enclosure, wherein the mounting step includes the substep of soldering the sensor on the circuit board.

16. A method for sensing temperature and humidity within a remote vehicle-mounted enclosure, wherein the mounting step includes the substep of soldering the sensor on a surface of the circuit board.