Acceleration sensor

• US 20080105053A1
• Filed: 12/14/2007
• Published: 05/08/2008
• Est. Priority Date: 02/16/2005
• Status: Active Grant

• Current Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Original Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Inventors: Katsuki, Shinichiro, Katahara, Yutaka, Fukaura, Teruya, Shibata, Seishi
• Granted Patent: US 7,673,514 B2
• Time in Patent Office: Days
• US Class Current: 73/514.16
• CPC Class Codes: B81B 2201/0235 Accelerometers
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: G01P 15/08 with conversion into electric or magnetic values
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/4847 the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
• CPC Class Codes: H01L 24/05 of an individual bonding area

Abstract

An acceleration sensor in accordance with an aspect of the present invention comprises a first substrate, a multilayer second substrate and a sensor portion. The multilayer second substrate is opposed to the first substrate. The multilayer second substrate is provided with an electrode drawing opening. Further, the multilayer second substrate consists of a plurality of layers. The sensor portion (a movable mass body and a fixed electrode) is provided in a sealed cavity portion which is formed between the first substrate and the multilayer second substrate which are opposed to each other.

Claims

1. An acceleration sensor comprising:

a first substrate;

a second substrate consisting of a first layer opposed to said first substrate and one or more second layers formed on part of a surface of said first layer; and

a sensor portion provided in a sealed cavity portion formed between said first substrate and said second substrate which are opposed to each other,

wherein said second layers are formed above said sensor portion.

2. The acceleration sensor according to claim 1, further comprising:

a frame body held by said first substrate and said second substrate, surrounding said cavity portion;

an electrode portion provided in said cavity portion and connected to either said sensor portion or said frame body;

an opening so formed as to face on a surface of said electrode portion in said first layer; and

an electrode wire formed in said opening and connected to said electrode portion.

3. The acceleration sensor according to claim 2, wherein

said electrode wire has a pad portion connectable to an external wire in a surface of said first layer.