Coated Package with Filter Profile

• US 20080105939A1
• Filed: 05/07/2007
• Published: 05/08/2008
• Est. Priority Date: 07/28/2004
• Status: Active Grant

• Current Assignee: Wistron Corporation
• Original Assignee: Wistron Corporation
• Inventors: Tan, Boon Keat, Keh, Kean Loo, Oon, Chin Hin
• Granted Patent: US 7,951,863 B2
• Time in Patent Office: Days
• US Class Current: 257/432
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 27/1443 with at least one potential jump or surface barrier
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/02325 the optical elements not being integrated nor being directly associated with the device
• CPC Class Codes: H01L 31/02327 the optical elements being integrated or being directly associated to the device, e.g. back reflectors optical coatings H01L31/0216
• CPC Class Codes: Y10T 428/31511 Of epoxy ether
• CPC Class Codes: Y10T 428/31515 As intermediate layer

Abstract

Method for packaging a photo detector integrated circuit (IC) and a pigment filter and resulting package are described. An encapsulated package (e.g., an epoxy-encapsulated package) that includes a first surface is provided. A filter layer is then coated directly onto the first surface. The filter layer provides optical filtering properties (e.g., a predetermined filtering profile) in addition to the filtering provided by the pigment filter.

Claims

1-10. -10. (canceled)

11. A package for an integrated circuit, comprising:

an integrated circuit die that includes a photo detector disposed on or adjacent to a first upper surface thereof and a first light filter disposed over the photo detector;

a substrate-upon which the integrated circuit is mounted;

wherein at least portions of the integrated circuit die and substrate are encapsulated by a light transmissive epoxy encapsulant having a second upper surface; and

a coating disposed over at least portions of the second upper surface and configured to form a second light filter.

12. The package of claim 11, wherein the second light filter is an interference filter.

13. The package of claim 12, wherein the interference fitter includes an infrared (IR) block filter.

14. The package of claim 12, wherein the package is configured for high volume manufacturing;

and wherein the second light filter is formed directly on a plurality of encapsulated packages in high density form.