Sensor-type semiconductor package and fabrication

• US 20080105941A1
• Filed: 11/02/2007
• Published: 05/08/2008
• Est. Priority Date: 11/03/2006
• Status: Abandoned Application

• Current Assignee: Siliconware Precision Industries Co., Ltd.
• Original Assignee: Siliconware Precision Industries Co., Ltd.
• Inventors: Huang, Chih-Ming, Chan, Chang-Yueh, Hsiao, Cheng-Hsu, Chang, Tse-Wen
• Application Number:
  US11/982,514
• Publication Number:
  US 20080105941A1
• Time in Patent Office: Days
• US Class Current: 257/433
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14683 Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof not peculiar thereto H01L21/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/16235 Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/1815 Shape
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80

Abstract

The invention provides a sensor-type semiconductor package and fabrication method thereof. The fabrication method includes steps of: attaching a sensor chip to a chip carrier; electrically connecting the sensor chip and a chip carrier via a plurality of bonding wires; mounting a light-permeable body to the sensor chip with an adhesive layer as a partition therebetween, wherein the planar size of the light-permeable body is larger than a predefined planar size of the sensor-type semiconductor package to be formed; forming an encapsulant on the chip carrier for encapsulating the sensor chip and the bonding wires with the upper surface of the light-permeable body being exposed from the encapsulant; and cutting through the light-permeable body, the encapsulant and the chip carrier according to the predefined planar size. Accordingly the contacting area between the cut light-permeable body and the cut encapsulant increased and the bonding therebetween is reinforced.

Claims

1. A fabrication method of a sensor-type semiconductor package, comprising steps of:

attaching a sensor chip to a chip carrier and electrically connecting the sensor chip with the chip carrier via a plurality of bonding wires;

mounting a light-permeable body to the sensor chip with an adhesive layer as a partition therebetween, wherein a planar size of the light-permeable body is larger than a predefined planar size of the sensor-type semiconductor package to be formed;

forming an encapsulant on the chip carrier for encapsulating the sensor chip and the plurality of bonding wires with an upper surface of the light-permeable body being exposed from the encapsulant; and

cutting through the light-permeable body, the encapsulant and the chip carrier according to the predefined planar size of the sensor-type semiconductor package so that the cut light-permeable body and the sensor-type semiconductor package have the same planar size.

2. The fabrication method of claim 1, wherein the sensor-type semiconductor package is fabricated in a batch-type process, comprising steps of providing a module having a plurality of chip carriers, attaching a plurality of sensor chips to the respective chip carriers, mounting a light-permeable body to each of the plurality of sensor chip, encapsulating the plurality of chip carriers and performing a cutting process so as to obtain a plurality of the sensor-type semiconductor packages.

3. The fabrication method of claim 2, wherein the light-permeable body is a whole piece of glass having a plurality of adhesive layers formed thereon, and the plurality of adhesive layers are positioned corresponding to the sensor chips.

4. The fabrication method of claim 1, wherein the encapsulant is filled between the chip carrier and the light-permeable body by dispensing so as to encapsulate the sensor chip and the plurality of bonding wires.

5. The fabrication method of claim 1, further comprising steps of:

disposing the chip carrier in a mold cavity of a mold with the upper surface of the light-permeable body abutting against an top of the mold cavity; and

injecting an encapsulating material into the mold cavity so as to form the encapsulate encapsulating the sensor chip and the plurality of bonding wires on the chip carrier.

6. The fabrication method of claim 1, wherein the sensor chip has an active surface and a non-active surface opposed to the active surface, a sensor area and a plurality of electrode pads are formed on the active surface of the sensor chip, the non-active surface of the sensor chip is attached to the chip carrier and the sensor chip is electrically connected with the chip carrier via the plurality of bonding wires connected to the electrode pads of the sensor chip.

7. The fabrication method of claim 6, wherein the adhesive layer is disposed between the sensor area and the electrode pads of the sensor chip so as to enclose and seal the sensor area.

8. The fabrication method of claim 6, wherein, the non-active surface of the sensor chip is thinned and the sensor chip is a selected before being attached to the chip carrier

9. The fabrication method of claim 1, wherein the cutting step further comprises steps of bevel cutting the light-permeable body according to the predefined planar size of the sensor-type semiconductor package to form bevel edges on the light-permeable body;

and cutting from the bevel edges so as to obtain a sensor-type semiconductor package having bevel edges formed on the sides of the cut light-permeable body.

10. The fabrication method of claim 1, further comprising forming a rough structure on a side of the light-permeable body, wherein the side is contacted with the adhesive layer and the encapsulant.

11. A fabrication method of a sensor-type semiconductor package, comprising steps of:

attaching a sensor chip to a chip carrier and electrically connecting the sensor chip with the chip carrier via a plurality of bonding wires;

mounting a light-permeable body to the sensor chip with an adhesive layer as a partition therebetween, wherein the adhesive layer covers end portions of the plurality of bonding wires connected to the sensor chip and a planar size of the light-permeable body is larger than a predefined planar size of the sensor-type semiconductor package to be formed;

forming an encapsulant on the chip carrier for encapsulating the sensor chip and the plurality of bonding wires with an upper surface of the light-permeable body being exposed from the encapsulant; and

cutting through the light-permeable body, the encapsulant and the chip carrier according to the predefined planar size of the sensor-type semiconductor package so that the cut light-permeable body and the sensor-type semiconductor package have the same planar size.

12. The fabrication method of claim 11, the step of mounting the light-permeable body to the sensor chip further comprises steps of heating the light-permeable body with a heating source provided below the chip carrier so as to melt the adhesive layer;

and removing the heating source form the chip carrier for solidifying the adhesive layer after the melted adhesive layer contacts the plurality of bonding wires and covers the end portions of the plurality of bonding wires.

13. The fabrication method of claim 11, wherein the adhesive layer is made of a B-stage epoxy resin, and it enters a half-melting state and has an adhesive property when the light-permeable body is heated, thereby the light-permeable body is mounted to the sensor chip and the adhesive layer covering the end portions of the plurality of bonding wires connected to the sensor chip.

14. The fabrication method of claim 11, further comprising steps of clipping the light-permeable body by a mechanical arm having a heating function;

providing a heating source to heat the adhesive layer disposed on a lower surface of the light-permeable body to a melting state such that the end portions of the plurality of bonding wires can be covered by the adhesive layer at the melting state; and

removing the mechanical arm and the heating source for solidifying the adhesive layer.

15. The fabrication method of claim 11, wherein the adhesive layer partially covers the end portions of the bonding wires connected to the sensor chip.

16. A sensor-type semiconductor package, comprising:

a chip carrier;

a sensor chip mounted on the chip carrier and electrically connected with the chip carrier via a plurality of bonding wires;

a light-permeable body mounted on the sensor chip through an adhesive layer; and

an encapsulant formed between the chip carrier and the light-permeable body for encapsulating the sensor chip and the plurality of bonding wires with an upper surface of the light-permeable body being exposed from the encapsulant, wherein a planar size of the light-permeable body is the same as a planar size of the formed sensor-type semiconductor package.

17. The sensor-type semiconductor package of claim 16, wherein end portions of the plurality of bonding wires connected to the sensor chip are partially covered by the adhesive layer.

18. The sensor-type semiconductor package of claim 16, wherein the encapsulant is filled between the chip carrier and the light-permeable body by dispensing so as to encapsulate the sensor chip and the bonding wires.

19. The sensor-type semiconductor package of claim 16, wherein the chip carrier is disposed in a mold cavity of a mold with the upper surface of the light-permeable body abutting against a top of the mold cavity, then an encapsulating material is injected into the mold cavity to form the encapsulate encapsulating the sensor chip and the plurality of bonding wires on the chip carrier.

20. The sensor-type semiconductor package of claim 16, wherein the sensor chip has an active surface and a non-active surface opposed to the active surface, a sensor area and a plurality of electrode pads formed on the active surface of the sensor chip, the non-active surface of the sensor chip is attached to the chip carrier, and the sensor chip is electrically connected with the chip carrier via the plurality of bonding wires connected to the electrode pads of the sensor chip.

21. The sensor-type semiconductor package of claim 20, wherein the adhesive layer serves as a partition between the light-permeable body and the sensor chip, and is disposed between the sensor area and the plurality of electrode pads of the sensor chip so as to enclose and seal the sensor area.

22. The sensor-type semiconductor package of claim 16, wherein the light-permeable body has bevel edges formed on sides thereof.

23. The sensor-type semiconductor package of claim 16, wherein the light-permeable body further comprises a rough structure formed on a side thereof and to be contacted with the adhesive layer and the encapsulant.