Semiconductor Module Including Components in Plastic Casing

• US 20080105966A1
• Filed: 10/09/2007
• Published: 05/08/2008
• Est. Priority Date: 06/01/2005
• Status: Active Grant

• Current Assignee: Tahoe Research Limited (f/k/a Learndale Limited) (Vector Capital Corporation)
• Original Assignee: Infineon Technologies AG
• Inventors: Beer, Gottfried, Simbuerger, Werner, Pressel, Klaus, Kienmayer, Christoph
• Granted Patent: US 7,863,728 B2
• Time in Patent Office: Days
• US Class Current: 257/690
• CPC Class Codes: G01S 19/36 relating to the receiver frond end
• CPC Class Codes: G01S 7/032 Constructional details for solid-state radar subsystems
• CPC Class Codes: H01L 21/568 Temporary substrate used as encapsulation process aid H01L21/4832 and H01L21/566 take precedence
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2223/6627 Waveguides, e.g. microstrip line, strip line, coplanar line
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/12105 Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/2402 Laminated, e.g. MCM-L type
• CPC Class Codes: H01L 2224/24137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/24226 the HDI interconnect connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the item being planar
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 2224/73267 Layer and HDI connectors
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/19 : Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 24/24 : of an individual high density interconnect connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/82 : by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 24/96 : the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01018 : Argon [Ar]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/16152 : Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/1903 : including wave guides
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/19107 : off-chip wires
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01Q 1/2283 : mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 1/44 : using equipment having another main function to serve additionally as an antenna , e.g. means for giving an antenna an aesthetic aspectH01Q1/27 - H01Q1/34 take precedence
• CPC Class Codes: H01Q 19/00 : Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic combination of horns with slotted waveguide array H01Q13/0233
• CPC Class Codes: H01Q 21/0087 : Apparatus or processes specially adapted for manufacturing antenna arrays manufacturing waveguides H01P11/00
• CPC Class Codes: H01Q 23/00 : Antennas with active circuits or circuit elements integrated within them or attached to them
• CPC Class Codes: H01Q 9/0407 : Substantially flat resonant element parallel to ground plane, e.g. patch antenna dipole H01Q9/285; monopole H01Q9/40
• CPC Class Codes: H01Q 9/0457 : electromagnetically coupled to the feed line

Abstract

A semiconductor module includes components in a plastic casing. The semiconductor module includes a plastic package molding compound and a semiconductor chip. Also provided in the module are a first principal surface including an upper side of the plastic package molding compound and at least one active upper side of the semiconductor chip, a second principle surface including a back side of the plastic package molding compound, and a multilayered conductor track structure disposed on the first principal surface and a second metal layer disposed on the second principle surface.

Claims

1. A semiconductor module including components in a plastic casing, wherein said semiconductor module comprises:

a plastic package molding compound;

a semiconductor chip embedded in the plastic package molding compound;

a first principal surface including an upper side of the plastic package molding compound and at least one active upper side of the semiconductor chip;

a second principle surface including a back side of the plastic package molding compound;

a multilayered conductor track structure. disposed on the first principal surface, alternately including structured insulation layers and structured first metal layers; and

a second metal layer disposed on the second principle surface.

2. The semiconductor module according to claim 1, wherein the semiconductor chip includes a voltage controlled oscillator (VCO).

3. The semiconductor module according to claim 1, wherein the semiconductor chip includes a digital signal processor semiconductor chip (DSP).

4. The semiconductor module according to claim 1, wherein the semiconductor chip includes a digital signal processor semiconductor chip (DSP) and further includes active and/or passive components embedded in the plastic package molding compound.

5. The semiconductor module according to claim 1, further including surface-mountable solder balls which are provided as external contacts on a circuit board and as mechanical supports and/or spacers of the semiconductor module.

6. The semiconductor module according to claim 1, further including at least one through contact extending from the second metal layer on the second principle surface to the structured metal layers disposed on said first principle surface.

7. A semiconductor module having components in a plastic casing, the semiconductor module comprising:

a plastic package molding compound;

a semiconductor chip;

a first principal surface including an upper side of the plastic package molding compound and at least one active upper side of the semiconductor chip

a second principle surface including a back side of the plastic package molding compound;

a multilayered conductor track structure disposed on the first principal surface; and

a heat sink disposed on the second principle surface.

8. The semiconductor module according to claim 7, wherein the heat sink includes cooling fins between which the plastic package molding compound is disposed.

9. The semiconductor module according to claim 7, wherein the heat sink is a screening case and the plastic package molding compound is disposed on an inner side of the screening case.

10. The semiconductor module according to claim 7 further including a second metal layer is disposed on the second principle side.

11. The semiconductor module according to claim 10, wherein the second metal layer is electrically isolated from the heat sink.

12. The semiconductor module according to claim 10, wherein the second metal layer is electrically conductively connected to the multilayer conductor track by a through contact extending from the second principle surface to the first principle surface.

13. The semiconductor module according to claim 7 further including external contacts, wherein the cooling fins of the heat sink include solder balls and form a plane with the external contacts of in which the external contacts and the solder balls of the heat sink are surface-mountable.

14. A method for fabricating a semiconductor module with components in a plastic casing comprising:

providing components of a semiconductor module including at least one semiconductor chip with electrodes on an active upper side;

applying the semiconductor chip with the electrodes to an upper side of a subcarrier;

embedding the components in a plastic package molding compound having a second principle surface including a back side of the plastic molding compound;

removing the subcarrier to expose a first principal surface from the plastic package molding compound and electrodes of the semiconductor chip to form a composite board;

applying a multilayered conductor track structure to the first principal surface to form the upper side of the composite board by selective application of structured insulation layers and structured metal layers alternately to the upper side of the composite board;

applying a metal layer to the second principle side of the composite board.

15. The method according to claim 14, wherein the composite board or a laminate of semiconductor chips and plastic package molding compound is thinned from the back side to a thickness.

16. The method according to claim 14, further including applying a heat sink to the second principle side.

17. The method according to claim 16 further including electrically isolating the heat sink from the metal layer.

18. The method according to claim 14 further including soldering surface-mountable solder balls, which are provided as external contacts on a circuit board and as mechanical supports and/or spacers, onto the semiconductor module.

19. The method according to claim 14 further including applying a heat sink including cooling fins to the second principle surface and applying solder balls to the cooling fins thereof.

20. The method according to claim 19 further including bonding cooling fins to a circuit board using a thermally conducting adhesive.

21. The method according to claim 14, further including applying a heat sink with cooling fins to the second principle surface the cooling fins include solder balls and form a plane with external contacts of the semiconductor module in which the external contacts and the solder balls of said heat sink are surface-mountable.

22. The method according to claim 14 further including laminating the upper side of the subcarrier with an adhesive film before applying components of the semiconductor module.

23. The method according to claim 14 further including, during fabrication of the multilayered conductor track structure, disposing passive thin-film elements between the insulation layers before and/or during application of the metal layers.

24. The method according to claim 14 further including embedding the components in a plastic package molding compound using an injection molding method, a compression molding method or a dispensing method.

25. The method according to claim 14, further including laminating a plastic laminate onto the subcarrier loaded with components to laminate the components into a plastic package molding compound.