HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF
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Accused Products
Abstract
The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer forms or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer. The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.
200 Citations
54 Claims
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1-28. -28. (canceled)
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29. A method of probing an electronic component by contacting the electronic component with a plurality of flexible contact elements, the method comprising the steps of:
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providing a first substrate corresponding to an area of the electronic component to be probed, said substrate having a front surface;
mounting and connecting a second substrate to the front surface of the first substrate, said second substrate having a plurality of flexible contact elements bonded to and extending from a surface thereof;
urging the first substrate and the electronic component towards one another so that the flexible contact elements make contact with a surface of the electronic component shape;
the flexible contact elements flex and wipe the surface of the electronic component when the flexible contacts contact the electronic components;
the flexible contact elements substantially compliantly respond when the flexible contact elements are withdrawn from contacting the electronic component; and
aligning the second substrate to the first substrate to align the flexible contact elements to the electronic component. - View Dependent Claims (30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54)
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40. A probe structure comprising an assembly comprising:
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a first substrate having a top surface, a bottom surface, a first plurality of terminals disposed on the top surface, and a second plurality of terminals disposed on the bottom surface;
at least one second substrate having a top surface and a bottom surface;
means for effecting electrical connections between the at least one second substrate and the first substrate;
a plurality of probe elements disposed on the top surface of the at least one second substrate;
the probe elements are free-standing flexible conductors shaped so that a free end thereof laterally movers when pressed against a surface; and
means for aligning the second substrate to the first substrate to align the flexible contact elements to the electronic component. - View Dependent Claims (41, 42, 43)
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Specification