RFID tag using patch antenna designs and low cost manufacturing techniques

• US 20080106418A1
• Filed: 11/02/2006
• Published: 05/08/2008
• Est. Priority Date: 11/02/2006
• Status: Abandoned Application

• Current Assignee: Symbol Technologies, Inc. (Zebra Technologies Corporation)
• Original Assignee: Symbol Technologies, Inc. (Zebra Technologies Corporation)
• Inventors: Tran, Hai, Sloan, Michael, Shanks, Wayne E.
• Application Number:
  US11/591,492
• Publication Number:
  US 20080106418A1
• Time in Patent Office: Days
• US Class Current: 340/572.7
• CPC Class Codes: G06K 19/0723 the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card

Abstract

Methods, systems, and apparatuses for improved tag assemblies, are described herein. In an aspect, a radio frequency identification (RFID) tag assembly includes an enclosure, a substrate, an antenna, an electrical circuit, and a plate. The substrate is coupled to an inner surface of the enclosure. The antenna is formed on a surface of the substrate. The electrical circuit is on the substrate and is electrically coupled to the antenna. The plate is attached to an outer surface of the enclosure and configured to be a ground plane for the antenna.

Claims

1. A radio frequency identification (RFID) tag assembly comprising:

an enclosure;

a substrate coupled to an inner surface of the enclosure;

an antenna formed on the substrate;

an electrical circuit on the substrate and electrically coupled to the antenna; and

a plate attached to an outer surface of the enclosure and configured to be a ground plane.

2. The tag assembly of claim 1 wherein, the enclosure comprises a first enclosure portion and a second enclosure portion coupled together to form a gap therebetween, wherein the substrate is located in the gap.

3. The tag assembly of claim 2, wherein the first enclosure portion and the second enclosure portion are coupled by a weld.

4. The tag assembly of claim 3, wherein the weld is a vibration weld.

5. The tag assembly of claim 1, wherein the substrate is a flexible substrate.

6. The tag assembly of claim 1, wherein the antenna is a patch antenna.

7. The tag assembly of claim 1, wherein the antenna is a dipole antenna.

8. The tag assembly of claim 1, wherein the antenna is a dual dipole antenna.

9. The tag assembly of claim 1, wherein the enclosure comprises a material that is transparent to radio frequency electromagnetic waves.

10. The tag assembly of claim 9, wherein the enclosure comprises a plastic.

11. The tag assembly of claim 10, wherein the plastic is polypropylene.

12. The tag assembly of claim 1, wherein the plate comprises aluminum.

13. The tag assembly of claim 1, wherein the plate is configured to be electrically coupled to a surface of an item to which the tag assembly is mounted.

14. The tag assembly of claim 1, wherein the enclosure comprises at least one opening configured to accommodate an attaching member to attach the tag assembly to a surface.

15. The tag assembly of claim 1, wherein the plate and the enclosure are coupled by a weld.

16. The tag assembly of claim 15, where the weld is an ultrasonic weld.

17. A method for assembling a radio frequency identification (RFID) tag assembly comprising:

(1) positioning a substrate within an opening in a first surface of a first portion of an enclosure, wherein an antenna is formed on a surface of the substrate, wherein an electrical circuit is coupled to a surface of the substrate and the electrical circuit is electrically coupled to the antenna;

(2) attaching a second enclosure portion to the first enclosure portion to form the enclosure, wherein the substrate is enclosed within the enclosure; and

(3) attaching a plate to an outer surface of the enclosure, wherein the plate is configured to be a ground plane for the antenna.

18. The method of claim 17, wherein the antenna is a patch antenna, further comprising forming the patch antenna on the substrate.

19. The method of claim 17, wherein step (2) comprises:

welding the second enclosure portion to the first enclosure portion.

20. The method of claim 19, wherein step (2) comprises:

welding the second enclosure portion to the first enclosure portion using vibration welding.

21. The method of claim 17, wherein step (2) comprises:

attaching the second enclosure portion to the first enclosure portion using an adhesive.

22. The method of claim 17, wherein step (3) comprises:

welding the plate to the enclosure.

23. The method of claim 22, wherein step (3) comprises:

welding the plate to the enclosure using ultrasonic welding.

24. The method of claim 17, wherein step (3) comprises:

attaching the plate to the enclosure using an adhesive.

25. The method of claim 17, further comprising:

(4) forming at least one opening in the enclosure, wherein the opening is configured to accommodate an attaching member to attach the tag to a surface.

26. The method of claim 17, further comprising:

(4) attaching the tag assembly to a surface of an item, wherein the plate is electrically coupled to the surface of the item.

27. The method of claim 17, further comprising:

(4) testing the tag assembly.