Probe card and method for constructing same
5 Assignments
0 Petitions
Accused Products
Abstract
In one embodiment, a probe card for testing dice on a wafer includes a substrate, a number of cantilevers formed on a surface thereof, and a number of probes extending from unsupported ends of the cantilevers. The unsupported ends of the cantilevers project over cavities on the surface of the substrate. The probes have tips to contact pads on the dice under test. The probe card may include a compressive layer above the surface of the substrate with a number of holes through which the probes extend.
57 Citations
29 Claims
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1-10. -10. (canceled)
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11. A method of fabricating a probe card, the method comprising:
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forming a pattern of intersecting recesses on a surface of a substrate to form a plurality of raised portions on the surface of the substrate;
forming a plurality of cantilever structures on the substrate;
forming a cavity under each of the cantilever structures; and
forming a probe on each of the cantilever structures, the probe being configured to flex towards a cavity when pressed against a contact point of a device under test. - View Dependent Claims (12, 13, 14, 15)
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16-20. -20. (canceled)
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21. A method of fabricating a probe card, the method comprising:
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forming a plurality of electrically conducting cantilevers on a surface of a substrate, each of the cantilevers having an unsupported end projecting over one of an equal number of cavities formed on the surface of the substrate;
forming a plurality of electrically conducting probes extending from the unsupported ends of the cantilevers, each of the probes having a tip adapted for contacting a pad on a surface of the DUT; and
forming an electrically insulating compressive layer above the surface of the substrate, the compressive layer having a plurality of holes extending therethrough and through which the probes extend to contact pads on the surface of the DUT. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29)
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Specification