FLEXIBLE PRINTED BOARD

• US 20080110666A1
• Filed: 11/08/2007
• Published: 05/15/2008
• Est. Priority Date: 11/14/2006
• Status: Active Grant

• Current Assignee: Japan Display Central Incorporated (Japan Display Incorporated)
• Original Assignee: Toshiba Mobile Display Company Limited (Japan Display Incorporated)
• Inventors: OOTA, Tsutomu
• Granted Patent: US 7,968,798 B2
• Time in Patent Office: Days
• US Class Current: 174/254
• CPC Class Codes: H05K 1/0224 Patterned shielding planes, ground planes or power planes H05K1/0253 takes precedence
• CPC Class Codes: H05K 1/0253 Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings H05K1/0251 takes precedence
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 2201/09609 Via grid, i.e. two-dimensional array of vias or holes in a single plane interposers H05K2201/10378
• CPC Class Codes: H05K 2201/09681 Mesh conductors, e.g. as a ground plane

Abstract

A base layer of a bent portion of a FPC is formed on the front side thereof with second ground bent lines arranged in a mesh pattern and third ground bent lines intersecting with the second ground bent lines in a lateral direction, and on the back side thereof with first ground bent lines along the bending direction. The first ground bent lines are electrically connected to the second ground bent lines and the third ground bent lines via through holes.

Claims

1. A flexible printed board having two planar portions and a bent portion being positioned therebetween comprising:

a plurality of first signal lines formed on one surface of a base layer of the bent portion and configured to connect the signal lines on the two planer portions;

a plurality of first ground lines formed on the one surface of the base layer of the bent portion and configured to connect the ground lines on the two planer portions;

a plurality of second ground lines formed on the other surface of the base layer of the bent portion and configured to connect the ground lines on the two planer portions in a diagonal mesh pattern;

a plurality of third ground lines configured to connect the plurality of second ground lines and formed in a direction orthogonal to a bending direction of the bent portion; and

through holes configured to connect the first ground lines on the one surface of the bent portion and the second ground lines or the third ground lines on the other surface of the bent portion.

2. The flexible printed board according to claim 1, further comprising a cover layer configured to cover the one surface of the bent portion over a portion other than the second ground lines and the third ground lines.

3. The flexible printed board according to claim 1, wherein the first signal lines and the first ground lines are formed in parallel to the bending direction of the bent portion.

4. The flexible printed board according to claim 1, wherein the flexible printed board connects a liquid crystal cell and a printed wiring assembly as a driver.