SEMICONDUCTOR DEVICE, METHOD OF MAKING THE SAME AND LIQUID CRYSTAL DISPLAY DEVICE
First Claim
1. A thin-film semiconductor device comprising an insulator, a semiconductor thin-film formed on said insulator and a transistor comprising a source region, a drain region, a channel region and a gate electrode formed at the surface of said semiconductor thin-film, said semiconductor thin-film having amorphous regions of Type-IV element and dendrite crystal regions of Type-IV element connecting said source region and said drain region.
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Abstract
To provide TFT of improved low-temperature polycrystalline layer that has higher electron mobility and assures less fluctuation in manufacture in view of realizing a liquid-crystal display device having a large display area by utilizing a glass substrate. A TFT having higher electron mobility can be realized within the predetermined range of characteristic fluctuation by utilizing the semiconductor thin-film (called quasi single crystal thin-film) formed of poly-crystal grain joined with the {111} twin-boundary of Diamond structure as the channel region (namely, active region) of TFT.
11 Citations
11 Claims
- 1. A thin-film semiconductor device comprising an insulator, a semiconductor thin-film formed on said insulator and a transistor comprising a source region, a drain region, a channel region and a gate electrode formed at the surface of said semiconductor thin-film, said semiconductor thin-film having amorphous regions of Type-IV element and dendrite crystal regions of Type-IV element connecting said source region and said drain region.
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3. A thin-film semiconductor device comprising an insulating substrate, a poly-crystal semiconductor thin-film formed on said insulating substrate and a transistor comprising a source region, a drain region, a channel region and a gate electrode formed at the surface of said poly-crystal semiconductor thin-film, said poly-crystal thin-film comprising crystal of an element selected from the group of Type-IV element and the alloy thereof, the crystal boundaries of said poly-crystal thin-film being {111} twin of Diamond structure, said poly-crystal thin-film having a seed metal layer of a metal M selected the group of Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ru, Rh, Pd, Ag, Os, Ir, Pt, Au and the alloy thereof, or of a compound MxAy of said metal M and said Type-IV element A (x and y are mixing crystal ratio of M and A), or of a layered structure of said metal M and said Type-IV element A provided at the surface thereof near said channel region of said transistor.
- 4. A method of manufacturing a thin-film semiconductor device comprising the steps of forming an amorphous semiconductor thin-film partially provided with a seed crystal metal at the surface thereof on a major surface of an insulator, and crystallizing said semiconductor thin-film with a direction from said seed crystal metal to said major surface of said insulator substrate by annealing said semiconductor thin-film.
- 5. A method of manufacturing a thin-film semiconductor device comprising the steps of depositing amorphous Si thin-film at the upper part of an insulator, providing seed crystal metal at the surface of said thin-film except for the surface of channel forming area, forming crystal grains of said Si joined by twin-boundaries in the surface of said thin-film in said channel forming area by heat treatment of said amorphous Si thin-film, and providing a gate electrode at the surface of said channel forming area of said Si thin-film via a gate insulating film.
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6. A method of manufacturing a thin-film semiconductor device comprising the steps of depositing an amorphous Si thin-film with the thickness of 10 to 150 nm at the upper part of an insulator, providing seed crystal metal on the surface of said thin-film except for the surface of a channel forming area, annealing said amorphous Si thin-film at the temperature of 600°
- C. or lower, and providing a gate electrode to the surface of said channel forming area of said Si thin-film via a gate insulating film.
- View Dependent Claims (7)
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8. A method of manufacturing a thin-film semiconductor device comprising the steps of depositing a first amorphous Si thin-film at the upper part of an insulator, providing a seed crystal metal to a first thin-film area except for an active region of the thin-film transistor, crystallizing said first Si thin-film by annealing, depositing a second amorphous Si thin-film at the upper part of said first Si thin-film thus-obtained, forming crystal grains of Si jointed by twin boundaries in said second thin-film area of the active region by annealing said second thin-film, providing a gate insulating film on the surface of said active region of said second thin-film, and providing a gate electrode on said gate insulating film.
Specification