MIXED-MODE ENCAPSULATED ELECTROPHORETIC DISPLAY FOR ELECTRONIC DEVICE

• US 20080111786A1
• Filed: 02/07/2007
• Published: 05/15/2008
• Est. Priority Date: 11/13/2006
• Status: Active Grant

• Current Assignee: Google Technology Holdings LLC (Alphabet Inc.)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Goudarzi, Vahid
• Granted Patent: US 7,903,083 B2
• Time in Patent Office: Days
• US Class Current: 345/107
• CPC Class Codes: G02F 1/133391 Constructional arrangement for sub-divided displays
• CPC Class Codes: G02F 1/167 by electrophoresis
• CPC Class Codes: G02F 1/1675 Constructional details
• CPC Class Codes: H04M 1/0266 for a display module assembly

Abstract

A substrate (104) has a region of conductor segments (110) and a matrix display driver (106) mounted on it. The matrix display driver is used for creating pixilated images or symbols, while the conductor segments are used for turning on or off iconic elements. An encapsulated electrophoretic display laminate (108) is mounted over both the matrix display driver and the region of conductor segments to form the mixed mode display.

Claims

1. A mixed mode encapsulated electrophoretic display for an electronic device, comprising:

a substrate fabricated of a electrically insulative material;

a matrix display driver disposed on the substrate;

a region of conductor segments in the shape of symbols to be displayed disposed on the substrate; and

an encapsulated electrophoretic laminate disposed over both the matrix display driver and the region of conductor segments, the encapsulated electrophoretic laminate including a layer of encapsulated electrophoretic material and a transparent conductor layer disposed over the encapsulated electrophoretic layer.

2. A mixed mode encapsulated electrophoretic display as defined in claim 1, wherein the matrix display driver is a thin film transistor matrix display driver.

3. A mixed mode encapsulated electrophoretic display as defined in claim 2, wherein the thin film transistor matrix is disposed on glass.

4. A mixed mode encapsulated electrophoretic display as defined in claim 3, wherein the thin film transistor matrix is disposed in a cavity of the substrate.

5. A mixed mode encapsulated electrophoretic display as defined in claim 2, wherein the thin film transistor matrix is disposed on a plastic member that is adhered to the substrate.

6. A mixed mode encapsulated electrophoretic display as defined in claim 1, wherein the encapsulated electrophoretic laminate has a perimeter which is sealed to the substrate.

7. A mixed mode encapsulated electrophoretic display as defined in claim 1, wherein the substrate is a circuit board, the circuit board having a surface on which the matrix display driver and region of conductor segments is disposed, the circuit board further comprising a keypad region including a plurality of keypad target conductor regions each corresponding to a key location.

8. A mixed mode encapsulated electrophoretic display as defined in claim 7, wherein the transparent conductor layer of the encapsulated electrophoretic laminate is electrically coupled to the circuit board.

9. A method of manufacturing a mixed mode encapsulated electrophoretic display for an electronic device, comprising:

providing a substrate fabricated of an electrically insulative material;

mounting a matrix display driver on the substrate;

providing a region of conductor segments in the shape of symbols to be displayed on the substrate; and

mounting an encapsulated electrophoretic laminate over both the matrix display driver and the region of conductor segments, the encapsulated electrophoretic laminate including a layer of encapsulated electrophoretic material and a transparent conductor layer disposed over the encapsulated electrophoretic layer.

10. A method of manufacturing a mixed mode encapsulated electrophoretic display as defined in claim 9, wherein mounting a matrix display driver on the substrate comprises mounting a thin film transistor matrix display driver on the substrate.

11. A method of manufacturing a mixed mode encapsulated electrophoretic display as defined in claim 10, wherein the thin film transistor matrix display driver is disposed on a glass carrier.

12. A method of manufacturing a mixed mode encapsulated electrophoretic display as defined in claim 11, wherein providing the substrate further comprises providing a cavity on the substrate, and wherein mounting the thin film transistor matrix on the substrate comprises mounting the thin film transistor matrix in the cavity.

13. A method of manufacturing a mixed mode encapsulated electrophoretic display as defined in claim 10, wherein the thin film transistor matrix is disposed on a plastic substrate, mounting the thin film transistor matrix on the substrate comprises adhering the thin film transistor matrix to the substrate.

14. A method of manufacturing a mixed mode encapsulated electrophoretic display as defined in claim 9, further comprising sealing a perimeter of the encapsulated electrophoretic laminate to the substrate.

15. A method of manufacturing a mixed mode encapsulated electrophoretic display as defined in claim 9, wherein providing the substrate comprises providing a circuit board, the circuit board having a surface on which the matrix display driver is mounted and the region of conductor segments is provided, the circuit board is further provided with a keypad region including a plurality of keypad target conductor regions each corresponding to a key location.

16. A method of manufacturing a mixed mode encapsulated electrophoretic display as defined in claim 15, further comprising electrically connecting the transparent conductor layer of the encapsulated electrophoretic laminate to the circuit board.

17. An electronic device, comprising:

a circuit board having a surface;

a matrix display driver mounted in correspondence with the surface of the circuit board;

a region of conductor segments in the shape of symbols to be displayed on the substrate disposed on surface of the circuit board;

an encapsulated electrophoretic laminate mounted on the circuit board, and covering both the matrix display driver and the region of conductor segments and sealed to the circuit board, and further having a layer of encapsulated electrophoretic material and a transparent conductor layer disposed over the encapsulated electrophoretic layer, wherein the transparent conductor layer is electrically coupled to the circuit board; and

a housing having a front portion having an opening shaped in correspondence with the electrophoretic laminate, and covering a periphery of the encapsulated electrophoretic laminate.

18. An electronic device as defined in claim 17, wherein the matrix display driver is mounted in a cavity in the circuit board.

19. An electronic device as defined in claim 17, wherein the circuit board further comprises a keypad region including a plurality of keypad target conductor regions each corresponding to a key location.

20. An electronic device as defined in claim 17, wherein the matrix display driver is a thin film transistor matrix display driver.