I/O MODULE WITH CONFIGURABLE ASICS THAT INCLUDE A MATRIX SWITCH

• US 20080112140A1
• Filed: 12/12/2006
• Published: 05/15/2008
• Est. Priority Date: 11/09/2006
• Status: Active Grant

• Current Assignee: Avago Technologies General IP PTE Limited (Broadcom, Inc.)
• Original Assignee: Avago Technologies ECBU IP Singapore Pte Limited (Broadcom, Inc.)
• Inventors: Wong, King Wai
• Granted Patent: US 7,802,020 B2
• Time in Patent Office: Days
• US Class Current: 361/728
• CPC Class Codes: H03K 19/177 arranged in matrix form

Abstract

An I/O module for use with I/O devices such as pumps, valves, thermocouples, and mass flow controllers includes an application-specific integrated circuit (ASIC) associated with each electrical signal interface to an I/O device. Additionally, a matrix switch is incorporated into each of the ASICs in order to enable electrical signals related to the I/O device to be distributed between the ASICs. Matrix switches within the different ASICs are electrically connected by at least one signal path that is dedicated to electrical signal distribution within the I/O module and the matrix switches are configurable on an ASIC-by-ASIC basis such that the desired electrical signal distribution can be achieved on a per-application basis. Incorporating configurable matrix switches into the ASICs enables electrical signals to be easily distributed among the ASICs in an I/O module.

Claims

1. An input/output (I/O) module for interfacing with an I/O device used in an industrial application, the I/O module comprising:

a housing;

an electrical connector, accessible from outside the housing, for connecting the I/O module to at least one I/O device, the electrical connector comprising multiple electrical signal interfaces for making an electrical signal connection between the at least one I/O device and the I/O module;

within the housing, multiple application-specific integrated circuits (ASICs) associated with the electrical signal interfaces, wherein each of the ASICs comprises a matrix switch and signal processing circuitry configured to process signals related to the at least one I/O device;

within the housing, electrical signal paths between the ASICs and the electrical signal interfaces; and

within the housing, electrical signal paths between the matrix switches of the ASICs.

2. The I/O module of claim 1 wherein the electrical signal paths between the matrix switches provides electrical signal connectivity between the matrix switches of each ASIC in the I/O module.

3. The I/O module of claim 1 wherein the ASICs further comprise a serial interface.

4. The I/O module of claim 3 wherein the matrix switches are configurable in response to a matrix switch configuration command received at the serial interface.

5. The I/O module of claim 4 wherein the I/O module further comprises a microprocessor configured to generate matrix switch configuration commands.

6. The I/O module of claim 5 further comprising a data bus between the microprocessor and the serial interface over which the matrix switch configuration commands can be communicated.

7. The I/O module of claim 6 wherein the signal processing circuitry is configured in response to a configuration command received via the serial interface.

8. The I/O module of claim 1 wherein the ASICs are organized into different groups, wherein the ASICS within a group are electrically connected via group-specific signal paths and wherein the groups are connected via a global signal bus.

9. The I/O module of claim 1 further comprising a microprocessor and memory within the housing, the memory having computer readable program code stored thereon, which when executed by the microprocessor allows a user to remotely configure the I/O module to support an I/O device by selecting an I/O device from a menu of pre-programmed I/O devices.

10. The I/O module of claim 9 wherein the computer readable program code comprises configuration options for multiple different types of I/O devices.

11. The I/O module of claim 9 wherein the computer readable program code enables the I/O module to be configured to correspond to multiple different I/O devices in parallel.

12. The I/O module of claim 9 wherein the computer readable program code comprises computer readable program code for individually configuring the ASICs to correspond to a particular I/O device.

13. The I/O module of claim 9 wherein the computer readable program code comprises a graphical user interface that enables a user to configure the I/O module and to monitor a parameter of the I/O device from a remote computer.

14. The I/O module of claim 9 wherein the computer readable program code enables a user to configure an I/O device directly from a web browser.

15. The I/O module of claim 9 further comprising a communications module configured to enable communication between the I/O module and a remote computer.

16. An input/output (I/O) module for interfacing with an I/O device used in an industrial application, the I/O module comprising:

a housing;

an electrical connector, accessible from outside the housing, for connecting the I/O module to at least one I/O device, the electrical connector comprising multiple electrical signal interfaces for making an electrical signal connection between the at least one I/O device and the I/O module;

within the housing, multiple application-specific integrated circuits (ASICs) associated with the electrical signal interfaces, wherein each of the ASICs comprises a matrix switch and signal processing circuitry configured to process signals related to the at least one I/O device;

within the housing, electrical signal paths between the ASICs and the electrical signal interfaces; and

within the housing, an electrical signal path between the matrix switches of the ASICs;

within the housing, a microprocessor and memory, the memory having computer readable program code stored thereon, which when executed by the microprocessor allows a user to configure the I/O module to support an I/O device.

17. The I/O module of claim 16 wherein the electrical signal path between the matrix switches provides electrical signal connectivity between the matrix switches of each ASIC in the I/O module.

18. The I/O module of claim 16 wherein the ASICs further comprise a serial interface and wherein the matrix switches are configurable in response to a matrix switch configuration command received at the serial interface.

19. A method for configuring an input/output (I/O) module for use with an I/O device in an industrial application, the method comprising:

connecting an I/O device to at least one electrical connector of an I/O module, wherein the I/O module comprises application-specific integrated circuits (ASICs) and wherein each ASIC comprises a matrix switch and signal processing circuitry;

accessing a configuration program, which is stored within the I/O module, from a remote host computer; and

configuring the I/O module to correspond to the I/O device to which the I/O module is connected, wherein configuring the I/O module comprises;

generating a matrix switch configuration command;

communicating the matrix switch configuration command to at least one of the matrix switches; and

configuring the matrix switch in response to the matrix switch configuration command.

20. The method of claim 19 further comprising configuring the matrix switch to distribute an electrical signal from a first ASIC to a second ASIC.