HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF
3 Assignments
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Accused Products
Abstract
The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.
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Citations
513 Claims
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1-459. -459. (canceled)
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460. An electronic assembly comprising:
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a substrate having a plurality of contact locations on one side thereof; and a plurality of flexible elongated electrical conductors, each flexible elongated electrical conductor having a first end attached to a respective one of the contact locations, and a second end most distant from the substrate, the second ends of the elongated electrical conductors are at an angle with respect to the first end of the elongated electrical conductor and the contact location, the angle being between a minimum and maximum value, the flexible elongated electrical conductor is resiliently depressible towards the substrate, wherein the first locations of two of the flexible elongated electrical conductor located next to one another are spaced from one another by a first distance and the second ends of the two elongated electrical conductors are spaced from one another by a second distance which is determined by the angles corresponding to the first and second flexible elongated electrical conductors, the second ends of each of the two flexible elongated electrical conductors being an area of the flexible elongated electrical conductor which is most distant from the substrate and remaining most distant from the substrate after depression of the second end towards the substrate, each flexible elongated electrical conductor comprising a flexible elongated element of a first material, and a second material on the flexible elongated element, the flexible elongated electrical conductor having a first composition and the second material having a second composition. - View Dependent Claims (480, 481, 512)
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461-479. -479. (canceled)
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482-511. -511. (canceled)
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513-579. -579. (canceled)
Specification