Laser Lift-Off of Sapphire From a Nitride Flip-Chip
First Claim
1. A method for fabricating a flip-chip light emitting diode device, the method including:
- (a) depositing epitaxial layers on a growth substrate to produce, an epitaxial wafer;
(b) fabricating a plurality of light emitting diode devices on the epitaxial wafer;
(c) dicing the epitaxial wafer to generate at least one separated device die from the epitaxial wafer, said device die including at least one of the plurality of the light emitting diode devices and a portion of the growth substrate;
(d) flip chip bonding the device die to a mount, said flip chip bonding including securing the device die to the mount by bonding an electrode of the device die to a bonding pad of the mount; and
,(e) subsequent to step (d), removing at least some of the growth substrate from the device die.
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Accused Products
Abstract
In a method for fabricating a flip-chip light emitting diode device, epitaxial layers are deposited on a sapphire growth substrate to produce an epitaxial wafer. A plurality of light emitting diode devices are fabricated on the epitaxial wafer. The epitaxial wafer is diced to generate a device die. The device die is flip chip bonded to a mount. The flip chip bonding includes securing the device die to the mount by bonding at least one electrode of the device die to at least one bonding pad of the mount. Subsequent to the flip chip bonding, the growth substrate of the device die is removed via the application of laser light.
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Citations
10 Claims
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1. A method for fabricating a flip-chip light emitting diode device, the method including:
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(a) depositing epitaxial layers on a growth substrate to produce, an epitaxial wafer; (b) fabricating a plurality of light emitting diode devices on the epitaxial wafer; (c) dicing the epitaxial wafer to generate at least one separated device die from the epitaxial wafer, said device die including at least one of the plurality of the light emitting diode devices and a portion of the growth substrate; (d) flip chip bonding the device die to a mount, said flip chip bonding including securing the device die to the mount by bonding an electrode of the device die to a bonding pad of the mount; and
,(e) subsequent to step (d), removing at least some of the growth substrate from the device die. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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Specification