Plasma Processing Apparatus
First Claim
1. A plasma processing apparatus which includes:
- a cylindrical vacuum chamber;
exhaust means connected to said vacuum chamber;
a supporting table disposed in the vacuum chamber and supporting a substrate;
a main supply nozzle disposed over said supporting table inside said vacuum chamber, and feeding a main source gas with the tip end thereof directed to an axial center portion of the vacuum chamber;
an auxiliary supply nozzle disposed over said supporting table inside said vacuum chamber, and feeding sub-source gas and rare gas with the tip end thereof directed to the axial center portion of said vacuum chamber;
a ring-shaped high-frequency antenna disposed in an upper portion of said vacuum chamber, coaxially with said vacuum chamber;
power feeding means for antenna connected to said high-frequency antenna, and causing electromagnetic waves to be outputted from said high-frequency antenna;
a bias electrode plate disposed inside said supporting table; and
high-frequency bias power feeding means connected to said bias electrode plate, and causing a self-bias potential to occur in said substrate,the plasma processing apparatus characterized by comprising;
lifting-and-lowering means which lifts up and down said supporting table; and
controlling means which,when a size of said substrate to be placed on said supporting table is instructed,reads out a uniform sputter-etching map, recorded as being associated with the above-mentioned size of substrate, and showing a uniform sputter-etching possible region based on the relationship between;
the size Dp of a center diameter, which is between the outer diameter and the inner diameter, of a ring-shaped high-density plasma region formed along said high-frequency antenna; and
the height H from said center of said high-density plasma region to the bottom of the plasma diffusion region inside the vacuum chamber;
concurrently, obtains, on the basis of the internal pressure of said vacuum chamber and the frequency of electromagnetic waves to be produced from said high-frequency antenna, the height Hp between said center of said high-density plasma region and the upper surface inside said vacuum chamber, and also obtains a value of said Dp, meanwhile, said controlling means obtains, on the basis of the internal pressure of said vacuum chamber and the magnitude of the self-bias potential to be produced in said substrate, the height Hs between the bottom portion of said plasma diffusion region and the top surface of said supporting table;
after that, obtains on the basis of the above-mentioned value of Dp, the above-mentioned value of Hp and the above-mentioned value of Hs, a value of said H in a uniform sputter-etching possible region from said read-out map;
and then controls said lifting-and-lowering means and lifts up and down said supporting table so that H can have the above-mentioned value.
1 Assignment
0 Petitions
Accused Products
Abstract
When the size of a substrate 1 is instructed, a map of uniform sputter-etching possible region based on the relationship between the diameter-size Dp of a high-density plasma region and the height H from the center of the high-density plasma region to the bottom of a plasma diffusion region is read out; on the basis of the internal pressure and the frequency of electromagnetic waves from an antenna 116, the value of the height Hp from the center of the high-density plasma region to the upper surface inside a vacuum chamber 111, and the value of the Dp are obtained; on the basis of the internal pressure and the magnitude of the self-bias potential of the substrate 1, the height Hs between the bottom of the plasma diffusion region and the top surface of a supporting table 113 is obtained; on the basis of the above-mentioned values of Dp, Hp and Hs, the value of the H in the uniform sputter-etching possible region is obtained from the map; and a lifting-and-lowering device 121 is controlled so that H can have the above-mentioned value.
-
Citations
4 Claims
-
1. A plasma processing apparatus which includes:
-
a cylindrical vacuum chamber; exhaust means connected to said vacuum chamber; a supporting table disposed in the vacuum chamber and supporting a substrate; a main supply nozzle disposed over said supporting table inside said vacuum chamber, and feeding a main source gas with the tip end thereof directed to an axial center portion of the vacuum chamber; an auxiliary supply nozzle disposed over said supporting table inside said vacuum chamber, and feeding sub-source gas and rare gas with the tip end thereof directed to the axial center portion of said vacuum chamber; a ring-shaped high-frequency antenna disposed in an upper portion of said vacuum chamber, coaxially with said vacuum chamber; power feeding means for antenna connected to said high-frequency antenna, and causing electromagnetic waves to be outputted from said high-frequency antenna; a bias electrode plate disposed inside said supporting table; and high-frequency bias power feeding means connected to said bias electrode plate, and causing a self-bias potential to occur in said substrate, the plasma processing apparatus characterized by comprising; lifting-and-lowering means which lifts up and down said supporting table; and controlling means which, when a size of said substrate to be placed on said supporting table is instructed, reads out a uniform sputter-etching map, recorded as being associated with the above-mentioned size of substrate, and showing a uniform sputter-etching possible region based on the relationship between;
the size Dp of a center diameter, which is between the outer diameter and the inner diameter, of a ring-shaped high-density plasma region formed along said high-frequency antenna; and
the height H from said center of said high-density plasma region to the bottom of the plasma diffusion region inside the vacuum chamber;concurrently, obtains, on the basis of the internal pressure of said vacuum chamber and the frequency of electromagnetic waves to be produced from said high-frequency antenna, the height Hp between said center of said high-density plasma region and the upper surface inside said vacuum chamber, and also obtains a value of said Dp, meanwhile, said controlling means obtains, on the basis of the internal pressure of said vacuum chamber and the magnitude of the self-bias potential to be produced in said substrate, the height Hs between the bottom portion of said plasma diffusion region and the top surface of said supporting table; after that, obtains on the basis of the above-mentioned value of Dp, the above-mentioned value of Hp and the above-mentioned value of Hs, a value of said H in a uniform sputter-etching possible region from said read-out map; and then controls said lifting-and-lowering means and lifts up and down said supporting table so that H can have the above-mentioned value. - View Dependent Claims (2)
-
-
3. A plasma processing apparatus which includes:
-
a cylindrical vacuum chamber; exhaust means connected to said vacuum chamber; a supporting table disposed in the vacuum chamber and supporting a substrate; a main supply nozzle disposed over said supporting table inside said vacuum chamber, and feeding a main source gas with the tip end thereof directed to the axial center portion of the vacuum chamber; an auxiliary supply nozzle disposed over said supporting table inside said vacuum chamber, and feeding sub-source gas and rare gas with the tip end thereof directed to the axial center portion of said vacuum chamber; a ring-shaped high-frequency antenna disposed in an upper portion of said vacuum chamber, coaxially with said vacuum chamber; power feeding means for antenna connected to said high-frequency antenna, and causing electromagnetic waves to be outputted from said high-frequency antenna; a bias electrode plate disposed inside said supporting table; and high-frequency bias power feeding means connected to said bias electrode plate, and causing a self-bias potential to occur in said substrate, the plasma processing apparatus characterized in that said high-frequency antenna is composed of a plurality of high-frequency antennas with different diameter-sizes, and said power feeding means for antenna is capable of feeding power only to selected one of said high-frequency antennas, and the plasma processing apparatus characterized by comprising; controlling means which, when a size of said substrate to be placed on said supporting table is instructed, reads out a uniform sputter-etching map, recorded as being associated with the above-mentioned size of substrate, and showing a uniform sputter-etching possible region based on the relationship between;
the size Dp of a center diameter, which is between the outer diameter and the inner diameter, of a ring-shaped high-density plasma region formed along said high-frequency antenna; and
the height H from said center of said high-density plasma region to the bottom of the plasma diffusion region inside the vacuum chamber;concurrently, obtains a height Hp between said center of said high-density plasma region and the upper surface inside said vacuum chamber, on the basis of the internal pressure of said vacuum chamber and the frequency of electromagnetic waves to be produced from said high-frequency antenna, and also obtains a value of said H by obtaining the height Hs between the bottom portion of said plasma diffusion region and the top surface of said supporting table, on the basis of the internal pressure of said vacuum chamber and the magnitude of the self-bias potential to be produced in said substrate, obtains a value of said Dp in a uniform sputter-etching possible region from said read-out map, on the basis of the above-mentioned value of H; after that, obtains a diameter-size Da of said high-frequency antenna to be used, from the above-mentioned value of Dp, on the basis of the internal pressure of said vacuum chamber and the frequency of electromagnetic waves to be produced from said high-frequency antenna, and selects said high-frequency antenna to be used, on the basis of the above-mentioned value of Da, and controls said power feeding means for antenna so that the power can be fed only to the selected one of high-frequency antenna. - View Dependent Claims (4)
-
Specification