Plasma Processing Apparatus

• US 20080115728A1
• Filed: 02/22/2006
• Published: 05/22/2008
• Est. Priority Date: 02/28/2005
• Status: Abandoned Application

• Current Assignee: Mitsubishi Heavy Industries, Ltd.
• Original Assignee: Mitsubishi Heavy Industries, Ltd.
• Inventors: Inoue, Masahiko, Matsuda, Ryuichi
• Application Number:
  US11/660,862
• Publication Number:
  US 20080115728A1
• Time in Patent Office: Days
• US Class Current: 118/723R
• CPC Class Codes: H01J 37/32009 Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources plasma generation in general H05H1/24
• CPC Class Codes: H01J 37/32568 Relative arrangement or disposition of electrodes; moving means
• CPC Class Codes: H01J 37/32935 Monitoring and controlling tubes by information coming from the object and/or discharge
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

Abstract

When the size of a substrate 1 is instructed, a map of uniform sputter-etching possible region based on the relationship between the diameter-size Dp of a high-density plasma region and the height H from the center of the high-density plasma region to the bottom of a plasma diffusion region is read out; on the basis of the internal pressure and the frequency of electromagnetic waves from an antenna 116, the value of the height Hp from the center of the high-density plasma region to the upper surface inside a vacuum chamber 111, and the value of the Dp are obtained; on the basis of the internal pressure and the magnitude of the self-bias potential of the substrate 1, the height Hs between the bottom of the plasma diffusion region and the top surface of a supporting table 113 is obtained; on the basis of the above-mentioned values of Dp, Hp and Hs, the value of the H in the uniform sputter-etching possible region is obtained from the map; and a lifting-and-lowering device 121 is controlled so that H can have the above-mentioned value.

Claims

1. A plasma processing apparatus which includes:

a cylindrical vacuum chamber;

exhaust means connected to said vacuum chamber;

a supporting table disposed in the vacuum chamber and supporting a substrate;

a main supply nozzle disposed over said supporting table inside said vacuum chamber, and feeding a main source gas with the tip end thereof directed to an axial center portion of the vacuum chamber;

an auxiliary supply nozzle disposed over said supporting table inside said vacuum chamber, and feeding sub-source gas and rare gas with the tip end thereof directed to the axial center portion of said vacuum chamber;

a ring-shaped high-frequency antenna disposed in an upper portion of said vacuum chamber, coaxially with said vacuum chamber;

power feeding means for antenna connected to said high-frequency antenna, and causing electromagnetic waves to be outputted from said high-frequency antenna;

a bias electrode plate disposed inside said supporting table; and

high-frequency bias power feeding means connected to said bias electrode plate, and causing a self-bias potential to occur in said substrate,

the plasma processing apparatus characterized by comprising;

lifting-and-lowering means which lifts up and down said supporting table; and

controlling means which,

when a size of said substrate to be placed on said supporting table is instructed,

reads out a uniform sputter-etching map, recorded as being associated with the above-mentioned size of substrate, and showing a uniform sputter-etching possible region based on the relationship between;

the size Dp of a center diameter, which is between the outer diameter and the inner diameter, of a ring-shaped high-density plasma region formed along said high-frequency antenna; and

the height H from said center of said high-density plasma region to the bottom of the plasma diffusion region inside the vacuum chamber;

concurrently, obtains, on the basis of the internal pressure of said vacuum chamber and the frequency of electromagnetic waves to be produced from said high-frequency antenna, the height Hp between said center of said high-density plasma region and the upper surface inside said vacuum chamber, and also obtains a value of said Dp, meanwhile, said controlling means obtains, on the basis of the internal pressure of said vacuum chamber and the magnitude of the self-bias potential to be produced in said substrate, the height Hs between the bottom portion of said plasma diffusion region and the top surface of said supporting table;

after that, obtains on the basis of the above-mentioned value of Dp, the above-mentioned value of Hp and the above-mentioned value of Hs, a value of said H in a uniform sputter-etching possible region from said read-out map;

and then controls said lifting-and-lowering means and lifts up and down said supporting table so that H can have the above-mentioned value.

2. The plasma processing apparatus according to claim 1, characterized by further comprising:

main-supply-nozzle adjusting means which adjusts said main supply nozzle so as to change the distance between the tip end of said main supply nozzle and the axial center of said vacuum chamber, and characterized in that

said controlling means,

when a size of said substrate to be placed on said supporting table is instructed,

further reads out a uniform deposition map, recorded as being associated with the above-mentioned size of substrate, and showing a uniform deposition possible region based on the relationship between the distance Dn from the tip end of said main supply nozzle to the axial center of said vacuum chamber and the height Hn from the axial center of said main nozzle to the top surface of said supporting table,

obtains values of said H, and said Hn, on the basis of the values of said Dp, said Hp and said Hs, from the region where the uniform deposition possible region of said read-out uniform deposition map overlaps the uniform sputter-etching possible region of said uniform sputter-etching map, and obtains also a value of said Dn,

and then controls said main-supply-nozzle adjusting means and adjusts said main supply nozzle so that Dn can have the above-mentioned value.

3. A plasma processing apparatus which includes:

a cylindrical vacuum chamber;

exhaust means connected to said vacuum chamber;

a supporting table disposed in the vacuum chamber and supporting a substrate;

a main supply nozzle disposed over said supporting table inside said vacuum chamber, and feeding a main source gas with the tip end thereof directed to the axial center portion of the vacuum chamber;

an auxiliary supply nozzle disposed over said supporting table inside said vacuum chamber, and feeding sub-source gas and rare gas with the tip end thereof directed to the axial center portion of said vacuum chamber;

a ring-shaped high-frequency antenna disposed in an upper portion of said vacuum chamber, coaxially with said vacuum chamber;

power feeding means for antenna connected to said high-frequency antenna, and causing electromagnetic waves to be outputted from said high-frequency antenna;

a bias electrode plate disposed inside said supporting table; and

high-frequency bias power feeding means connected to said bias electrode plate, and causing a self-bias potential to occur in said substrate,

the plasma processing apparatus characterized in that

said high-frequency antenna is composed of a plurality of high-frequency antennas with different diameter-sizes, and

said power feeding means for antenna is capable of feeding power only to selected one of said high-frequency antennas, and

the plasma processing apparatus characterized by comprising;

controlling means which,

when a size of said substrate to be placed on said supporting table is instructed,

reads out a uniform sputter-etching map, recorded as being associated with the above-mentioned size of substrate, and showing a uniform sputter-etching possible region based on the relationship between;

the size Dp of a center diameter, which is between the outer diameter and the inner diameter, of a ring-shaped high-density plasma region formed along said high-frequency antenna; and

the height H from said center of said high-density plasma region to the bottom of the plasma diffusion region inside the vacuum chamber;

concurrently, obtains a height Hp between said center of said high-density plasma region and the upper surface inside said vacuum chamber, on the basis of the internal pressure of said vacuum chamber and the frequency of electromagnetic waves to be produced from said high-frequency antenna, and also obtains a value of said H by obtaining the height Hs between the bottom portion of said plasma diffusion region and the top surface of said supporting table, on the basis of the internal pressure of said vacuum chamber and the magnitude of the self-bias potential to be produced in said substrate,

obtains a value of said Dp in a uniform sputter-etching possible region from said read-out map, on the basis of the above-mentioned value of H;

after that, obtains a diameter-size Da of said high-frequency antenna to be used, from the above-mentioned value of Dp, on the basis of the internal pressure of said vacuum chamber and the frequency of electromagnetic waves to be produced from said high-frequency antenna, and

selects said high-frequency antenna to be used, on the basis of the above-mentioned value of Da, and controls said power feeding means for antenna so that the power can be fed only to the selected one of high-frequency antenna.

4. The plasma processing apparatus according to claim 3, characterized by further comprising:

main-supply-nozzle adjusting means which adjusts said main supply nozzle so as to change the distance between the tip end of said main supply nozzle and the axial center of said vacuum chamber, and characterized in that

said controlling means,

when a size of said substrate to be placed on said supporting table is instructed,

further reads out a uniform deposition map, recorded as being associated with the above-mentioned size of substrate, and showing a uniform deposition possible region based on the relationship between the distance Dn from the tip end of said main supply nozzle to the axial center of said vacuum chamber and the height Hn from the axial center of said main nozzle to the top surface of said supporting table,

obtains values of said Dp and said Dn, on the basis of the values of said H and said Hn, from the region where the uniform deposition possible region of said read-out uniform deposition map overlaps the uniform sputter-etching possible region of said uniform sputter-etching map,

and then controls said main-supply-nozzle adjusting means and adjusts said main supply nozzle so that Dn can have the above-mentioned value.