Apparatus for mass die testing
First Claim
Patent Images
1. A semiconductor wafer comprising:
- a set of dice under test (DUT) connected together by a plurality of signal buses; and
at least one built-in self test (BIST) die including at least one multiplexer designed for multiplexing test signals to a selected DUT on the semiconductor wafer for carrying out tests of the dice under test, the BIST die having a set of pads to be connected to one or more probes of an external test apparatus, andwherein the at least one multiplexer being connected with the set of dice under test via the signal buses, such that the BIST die is capable of receiving signals from the external test apparatus to select any die under test within the set via the multiplexer and the signal buses without repositioning the probes.
1 Assignment
0 Petitions
Accused Products
Abstract
A semiconductor wafer includes a set of dice under test connected together by a plurality of signal buses; and at least one test die designed for carrying out tests of the dice under test, having a set of pads to be connected to one or more probes of an external test apparatus, and at least one multiplexer connected with the set of dice under test via the signal buses, such that the test die is capable of receiving signals from the external test apparatus to select any die under test within the set via the multiplexer and the signal buses without repositioning the probes.
20 Citations
20 Claims
-
1. A semiconductor wafer comprising:
-
a set of dice under test (DUT) connected together by a plurality of signal buses; and at least one built-in self test (BIST) die including at least one multiplexer designed for multiplexing test signals to a selected DUT on the semiconductor wafer for carrying out tests of the dice under test, the BIST die having a set of pads to be connected to one or more probes of an external test apparatus, and wherein the at least one multiplexer being connected with the set of dice under test via the signal buses, such that the BIST die is capable of receiving signals from the external test apparatus to select any die under test within the set via the multiplexer and the signal buses without repositioning the probes. - View Dependent Claims (2, 3, 4, 5, 6, 7)
-
-
8. A test system comprising:
-
a semiconductor wafer having a set of dice under test connected together by a plurality of signal buses, and at least one built-in self test BIST die designed for carrying out tests of the dice under test, wherein the BIST includes at least one multiplexer; a set of probes connected to one or more pads on the BIST die; a test apparatus coupled to the probes for sending test signals to one or more selected dice under test, and for receiving output signals from the selected dice under test for analysis through the multiplexer, wherein the multiplexer is connected to the dice under test via the signal buses, such that the BIST die is capable of receiving signals from the test apparatus to select any die under test within the set without repositioning the probes. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16)
-
-
17. A probe card for testing a set of dice under test on a semiconductor wafer, comprising:
-
at least one set of probes to be connected to one or more pads or a built-in self test (BIST) die on the semiconductor wafer for providing accesses to the dice under test via signal buses there among; at least one multiplexer located within the BIST die and coupled to the probes, having one or more ports for receiving and sending signals from and to an external test apparatus; wherein when the test probes are in contact with the pads and the ports are connected to the external test apparatus, the external test apparatus can select any die under test within the set without repositioning the probes. - View Dependent Claims (18, 19, 20)
-
Specification