METHOD OF PACKAGING A SEMICONDUCTOR DEVICE AND A PREFABRICATED CONNECTOR
First Claim
1. A method of packaging a first device having a first major surface and a second major surface, comprising:
- forming a first layer over a second major surface of the first device and around sides of the first device and leaving the first major surface of the first device exposed, wherein the first layer is selected from the group consisting of an encapsulant and a polymer;
forming a first dielectric layer over the first major surface of the first device;
forming a via in the first dielectric layer;
forming a seed layer within the via and over a portion of the first dielectric layer;
physically coupling a connector to the seed layer; and
plating a conductive material over the seed layer to form a first interconnect in the first via and over a portion of the first dielectric layer.
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Accused Products
Abstract
A method of packaging a first device having a first major surface and a second major surface includes forming a first layer over a second major surface of the first device and around sides of the first device and leaving the first major surface of the first device exposed, wherein the first layer is selected from the group consisting of an encapsulant and a polymer; forming a first dielectric layer over the first major surface of the first device, forming a via in the first dielectric layer, forming a seed layer within the via and over a portion of the first dielectric layer, physically coupling a connector to the seed layer, and plating a conductive material over the seed layer to form a first interconnect in the first via and over a portion of the first dielectric layer.
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Citations
20 Claims
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1. A method of packaging a first device having a first major surface and a second major surface, comprising:
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forming a first layer over a second major surface of the first device and around sides of the first device and leaving the first major surface of the first device exposed, wherein the first layer is selected from the group consisting of an encapsulant and a polymer; forming a first dielectric layer over the first major surface of the first device; forming a via in the first dielectric layer; forming a seed layer within the via and over a portion of the first dielectric layer; physically coupling a connector to the seed layer; and plating a conductive material over the seed layer to form a first interconnect in the first via and over a portion of the first dielectric layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method of packaging a first device having a first major surface and a second major surface, comprising:
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forming a dielectric layer over the first major surface a first device; forming a first via in the dielectric layer; forming a second via in the dielectric layer; forming a first seed layer in the first via; forming a second seed layer in the second via; placing at least a portion of a first external connector over the dielectric layer, wherein the forming the first seed layer and the placing at least a portion of the first external connector couples the first external connector to the first device; plating the first seed layer to form a first interconnect; plating the second seed layer to form a second interconnect; and coupling the second interconnect to a second external connector. - View Dependent Claims (12, 13, 14, 15, 16, 17)
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18. A method of packaging a first device having a first major surface and a second major surface, comprising:
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forming a first layer over a second major surface of the first device and around sides of the first device and leaving the first major surface of the first device exposed, wherein the first layer is selected from the group consisting of an encapsulant and a polymer; forming a first dielectric layer over the first major surface of the first device; embedding a prefabricated connector in at least the first dielectric layer, wherein the connector comprises a pin; and forming an interconnect from the first major surface of the first device to the pin of the connector. - View Dependent Claims (19, 20)
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Specification