DUAL TOP GAS FEED THROUGH DISTRIBUTOR FOR HIGH DENSITY PLASMA CHAMBER

• US 20080121177A1
• Filed: 11/28/2006
• Published: 05/29/2008
• Est. Priority Date: 11/28/2006
• Status: Abandoned Application

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Yieh, Ellie Y., Bang, Won B., Pham, Phong, Nemani, Srivivas D.
• Application Number:
  US11/564,105
• Publication Number:
  US 20080121177A1
• Time in Patent Office: Days
• US Class Current: 118/723I
• CPC Class Codes: C23C 16/4405 Cleaning of reactor or parts inside the reactor by using reactive gases
• CPC Class Codes: C23C 16/45574 Nozzles for more than one gas
• CPC Class Codes: C23C 16/45591 Fixed means, e.g. wings, baffles
• CPC Class Codes: H01J 37/3244 Gas supply means
• CPC Class Codes: H01J 37/32449 Gas control, e.g. control of the gas flow

Abstract

A gas distributor for use in a semiconductor process chamber comprises a body. The body includes a first channel formed within the body and adapted to pass a first fluid from a first fluid supply line through the first channel to a first opening. A second channel is formed within the body and adapted to pass a second fluid from a second fluid supply line through the second channel to a second opening. The first and second openings are arranged to mix the fluids outside the body after the fluids pass through the openings.

Claims

1. A gas distributor for use in a semiconductor process chamber, the gas distributor comprising:

a body including,

a first channel formed within the body and adapted to pass a first fluid from a first fluid supply line through the first channel to a first opening,

a second channel formed within the body and adapted to pass a second fluid from a second fluid supply line through the second channel to a second opening; and

wherein the first and second openings are arranged to mix the fluids outside the body after the fluids pass through the openings.

2. The gas distributor of claim 1 wherein the first channel comprises a plurality of branches that extend to a plurality of first openings, wherein the branches are separated from the second channel to mix the first fluid with the second fluid after the fluids pass through the openings.

3. The gas distributor of claim 2 wherein the second channel comprises at least one branch that extends to a plurality of second openings, wherein the branches of the first channel are separated from the branches of the second channel to mix the fluids after the fluids pass through the openings.

4. The gas distributor of claim 2 wherein the body further includes an annular step disposed near an end of the gas distributor and each of the plurality of first openings extends through at least a portion of the annular step.

5. The gas distributor of claim 1 wherein the body further includes a baffle adapted to deflect a gas from a first direction toward the distributor to a second direction away from the distributor.

6. The gas distributor of claim 1 wherein the body comprises a single piece.

7. The gas distributor of claim 1 wherein the fluid comprises at least one of a liquid or a gas.

8. A gas distributor for use in a semiconductor process chamber, the gas distributor comprising:

a body including,

a lower surface,

a plurality of first openings disposed on the lower surface and adapted to pass a first fluid from a fluid first supply line to the chamber,

a second opening disposed on the lower surface and adapted to pass a second fluid from a second gas supply line to the chamber; and

wherein the plurality of first openings are disposed around the second opening and arranged to mix the fluids outside the body after the fluids pass through the openings.

9. The gas distributor of claim 8 wherein the lower surface includes an elevated central portion, a recessed peripheral portion, and a step extending between the elevated central portion and the recessed peripheral portion, and wherein the plurality of first openings is disposed along the step and the second opening is disposed on the elevated central portion.

10. The gas distributor of claim 8 wherein the body further includes an upper surface adapted to outwardly direct a gas away from the body, the upper surface disposed opposite the lower surface.

11. The gas distributor of claim 10 wherein the lower surface includes an elevated central portion, a recessed peripheral portion, and a step extending between the elevated central portion and the recessed peripheral portion, and wherein the plurality of first openings is disposed along the step and the second opening is disposed on the elevated central portion.

12. The gas distributor of claim 11 wherein the body further includes a first fluid inlet and a channel extending from the first inlet to the plurality of first openings, and wherein the body further includes a second fluid inlet and a second channel extending from the second fluid inlet to the second opening.

13. A method of depositing a thin film in a semiconductor process chamber, the method comprising:

passing a first fluid through a first channel disposed within a body of a gas distributor;

passing a second fluid through a second channel disposed within the body of the gas distributor, wherein the first fluid remains separated from the second fluid while the fluids pass through the channels; and

expelling the fluids from the channels to mix the first fluid with the second fluid outside the gas distributor wherein the first fluid undergoes a chemical reaction with the second fluid outside the gas distributor.

14. The method of claim 13 further comprising deflecting a clean gas with a baffle formed in the body of the gas distributor to clean the chamber.

15. The method of claim 13 wherein the first fluid mixes with the second fluid above a wafer positioned in the chamber.

16. The method of claim 13 wherein the first fluid comprises SiH₄ gas and the second fluid comprises O₂ gas.

17. A device for use with a semiconductor process to deposit a layer on a semiconductor wafer, the device comprising:

a top dome and a side wall positioned to define a chamber;

a support adapted to support the semiconductor wafer;

a gas distributor comprising a body that extends downward into the chamber centrally near the top dome, the body comprising a first channel formed therein and adapted to pass a first fluid downward to a first opening into the chamber, the body comprising a second channel formed therein and adapted to pass a second fluid downward through the gas distributor to a second opening into the chamber;

a first fluid supply line coupled to the first channel formed in the body of gas distributor;

a second fluid supply line coupled to the second channel formed in the body of the gas distributor to separate the second fluid from the first fluid while the fluids are passed from the supply lines to the openings; and

wherein the openings are adapted to mix the first fluid with the second fluid outside the body of the gas distributor.

18. The device of claim 17 wherein the first fluid comprises SiH₄ gas and the second fluid comprises O₂ gas.

19. The device of claim 18 further comprising nozzles disposed near the sidewall and wherein the second channel is directed downward toward the support to provide O₂ to decrease a concentration of Si deposited centrally on the layer.