Photovoltaic micro-concentrator modules

• US 20080121269A1
• Filed: 08/22/2007
• Published: 05/29/2008
• Est. Priority Date: 08/23/2006
• Status: Abandoned Application

• Current Assignee: Kopin Corporation
• Original Assignee: Kopin Corporation
• Inventors: Roberts, William T., Welser, Roger E., DeLuca, Paul M.
• Application Number:
  US11/895,018
• Publication Number:
  US 20080121269A1
• Time in Patent Office: Days
• US Class Current: 136/246
• CPC Class Codes: H01L 31/0232 Optical elements or arrangements associated with the device H01L31/0236 takes precedence; for photovoltaic cells H01L31/054; for photovoltaic modules H02S40/20
• CPC Class Codes: H01L 31/0543 comprising light concentrating means of the refractive type, e.g. lenses
• CPC Class Codes: H01L 31/0547 comprising light concentrating means of the reflecting type, e.g. parabolic mirrors, concentrators using total internal reflection
• CPC Class Codes: Y02E 10/52 PV systems with concentrators
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor

Abstract

A photovoltaic (PV) device comprises at least one PV lamp that includes at least one solar cell chip that generates an electrical current upon exposure to light, and an epoxy lens that encapsulates the solar cell chip, the epoxy lens concentrating incident light onto the solar cell chip. A method of manufacturing a PV device that includes at least one PV lamp comprises fabricating at least one solar cell chip that generates an electrical current upon exposure to light, and forming an epoxy lens that encapsulates the solar cell chip, the epoxy lens concentrating incident light onto the solar cell chip, to thereby form the PV lamp.

Claims

1. A photovoltaic device, comprising at least one photovoltaic lamp that includes:

a) at least one solar cell chip that generates an electrical current upon exposure to light; and

b) an epoxy lens that encapsulates the solar cell chip, the epoxy lens concentrating incident light onto the solar cell chip.

2. The photovoltaic device of claim 1, wherein the epoxy lens has a top, dome protrusion.

3. The photovoltaic device of claim 1, further including a reflector that peripherally surrounds the solar cell chip and reflects at least a portion of incident light onto the solar cell chip.

4. The photovoltaic device of claim 3, wherein at least a portion of the reflector is encapsulated by the epoxy lens.

5. The photovoltaic device of claim 4, wherein the reflector is a parabolic reflector.

6. The photovoltaic device of claim 1, wherein the solar cell chip has a planar dimension of equal to or less than about one half of the largest planar dimension of a base portion of the photovoltaic lamp.

7. The photovoltaic device of claim 6, wherein the base portion of the photovoltaic lamp has a shape selected from the group consisting of a hexagon, a rectangle and a circle.

8. The photovoltaic device of claim 7, wherein the shape of the base portion is a hexagon.

9. The photovoltaic device of claim 6, wherein the solar cell chip is less than about 100 mm² in area.

10. The photovoltaic device of claim 6, wherein the base portion of the photovoltaic lamp has a largest planar dimension in a range of between about 1.8 mm and about 10 mm.

11. The photovoltaic device of claim 1, wherein at least one of the epoxy lenses has light transmittance of at least about 90%.

12. The photovoltaic device of claim 11, wherein at least one of the epoxy lenses has an index of refraction of about 1.5.

13. The photovoltaic device of claim 12, further includes a refraction micro-lens between the solar cell chip and the epoxy lens, the refraction micro-lens having a refraction index larger than the refraction index of the epoxy lens.

14. The photovoltaic device of claim 1, further including a circuit board with which the solar cell chip is in electrical connection, thereby forming a micro-concentrator cell.

15. The photovoltaic device of claim 14, further includes a first electrical contact means that electrically connects the solar cell chip to the circuit board, and wherein at least a portion of the electrical contact means is encapsulated by the epoxy lens.

16. The photovoltaic device of claim 15, wherein the first electrical contact means is a lead frame.

17. The photovoltaic device of claim 14, wherein the device includes a plurality of the photovoltaic lamps, and wherein each solar cell chip of the photovoltaic lamps is in electrical connection with the circuit board of the micro-concentrator cell.

18. The photovoltaic device of claim 17, wherein at least a portion of the photovoltaic lamps are arranged in a plane.

19. The photovoltaic device of claim 18, further including a reflector structure on or over the circuit board.

20. The photovoltaic device of claim 18, wherein each of the solar cell chips includes at least one p-n diode structure having an n-type semiconductor layer and a p-type semiconductor layer, each of the n-type and p-type semiconductor layers includes a silicon-based semiconductor material or a Group III-V semiconductor material.

21. The photovoltaic device of claim 20, wherein the solar cell chip further includes a plurality of quantum dots or quantum wells between the n-type and p-type semiconductor layers.

22. The photovoltaic device of claim 18, wherein the device includes a plurality of the micro-concentrator cells.

23. The photovoltaic device of claim 22, wherein at least a portion of the micro-concentrator cells are arranged in a plane over a substrate.

24. The photovoltaic device of claim 23, further including an electrical connector electrically connecting each micro-concentrator cell.

25. The photovoltaic device of claim 24, further including a transparent cover over the micro-concentrator cells.

26. The photovoltaic device of claim 25, further including a second electrical contact means that electrically connects the circuit board with an external power-output.

27. The photovoltaic device of claim 26, wherein the transparent cover is a Fresnel lens.

28. The photovoltaic device of claim 26, wherein the substrate is a thermally conductive metal plate.

29. The photovoltaic device of claim 26, wherein the device has a thickness in a range of between about 1 mm and about 5 mm.

30. The photovoltaic device of claim 29, wherein the base portion of at least one of the photovoltaic lamps has a largest planar dimension in a range of between about 1 mm and about 5 mm.

31. The photovoltaic device of claim 26, further including a sealant around a perimeter between the substrate and the transparent cover.

32. A method of manufacturing a photovoltaic device that includes at least one photovoltaic lamp, comprising the steps of:

a) fabricating at least one solar cell chip that generates an electrical current upon exposure to light; and

b) forming an epoxy lens that encapsulates the solar cell chip, the epoxy lens concentrating incident light onto the solar cell chip, to thereby form the photovoltaic lamp.

33. The method of claim 32, wherein the epoxy lens is formed to have a top, dome protrusion.

34. The method of claim 32, further including disposing the solar cell chip at a reflector that is peripherally surrounding the solar cell chip and reflects at least a portion of incident light to the solar cell chip.

35. The method of claim 34, wherein at least a portion of the reflector is encapsulated by the epoxy lens.

36. The photovoltaic device of claim 35, wherein the reflector is a parabolic reflector.

37. The method of claim 32, further including attaching the photovoltaic lamp to a circuit board to thereby electrically connect the solar cell chip with the circuit board, thereby forming a micro-concentrator cell.

38. The method of claim 37, wherein the solar cell chip is attached directly to the circuit board.

39. The method of claim 37, wherein the solar cell chip is attached to the circuit board via a first electrical contact means, and wherein at least a portion of the electrical contact means is encapsulated by the epoxy lens.

40. The method of claim 39, wherein the first electrical contact means is soldered to the circuit board.

41. The method of claim 39, wherein the solar cell chip is attached to the first electrical contact means with at least one means selected from the group consisting of a wire bonding, a conducting paste or adhesive, and a flip chip bonding.

42. The method of claim 37, further including fabricating more than one said photovoltaic lamp, wherein each of the photovoltaic lamps is attached to the circuit board of the micro-concentrator cell, to thereby electrically connect each solar cell chip to the circuit board.

43. The method of claim 42, wherein at least a portion of the photovoltaic lamps are arranged in a plane.

44. The method of claim 43, further including fabricating a plurality of the micro-concentrator cells.

45. The method of claim 44, wherein at least a portion of the micro-concentrator cells are arranged in a plane over a substrate.

46. The method of claim 45, wherein the micro-concentrator cells are in electrical contact with each other via an electrical connector.

47. The method of claim 46, further including disposing a transparent cover over the array of the micro-concentrator cells.

48. The method of claim 47, further including electrically connecting the circuit board with an external power-output.