DYNAMIC SURFACE ANNEALING USING ADDRESSABLE LASER ARRAY WITH PYROMETRY FEEDBACK

• US 20080121626A1
• Filed: 09/01/2006
• Published: 05/29/2008
• Est. Priority Date: 06/27/2006
• Status: Active Grant

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Thomas, Timothy N., Mayur, Abhilash J., Adams, Bruce E., Jennings, Dean
• Granted Patent: US 7,494,272 B2
• Time in Patent Office: Days
• US Class Current: 219/121.62
• CPC Class Codes: B23K 26/03 Observing, e.g. monitoring, the workpiece
• CPC Class Codes: B23K 26/032 using optical means
• CPC Class Codes: B23K 26/034 Observing the temperature of the workpiece
• CPC Class Codes: B23K 26/0665 by beam condensation on the workpiece, e.g. for focusing
• CPC Class Codes: B23K 26/0738 into a linear shape
• CPC Class Codes: F27B 17/0025 Especially adapted for treating semiconductor wafers
• CPC Class Codes: H01L 21/67115 mainly by radiation

Abstract

Apparatus for dynamic surface annealing of a semiconductor wafer includes a source of laser radiation emitting at a laser wavelength and comprising an array of lasers arranged in rows and columns, the optical power of each the laser being individual adjustable and optics for focusing the radiation from the array of lasers into a narrow line beam in a workpiece plane corresponding to a workpiece surface, whereby the optics images respective columns of the laser array onto respective sections of the narrow line beam. A pyrometer sensor is provided that is sensitive to a pyrometer wavelength. An optical element in an optical path of the optics is tuned to divert radiation emanating from the workpiece plane to the pyrometry sensor. As a result, the optics images each of the respective section of the narrow line beam onto a corresponding portion of the pyrometer sensor. The apparatus further includes a controller responsive to the pyrometry sensor and coupled to adjust individual optical outputs of respective columns of the laser array in accordance with outputs of corresponding portions of the pyrometry sensor.

Claims

1. Apparatus for thermal processing a workpiece, comprising:

a source of laser radiation emitting at a laser wavelength and comprising an array of lasers arranged in rows and columns, the optical power of each said laser being individual adjustable;

optics for focusing the radiation from said array of lasers into a narrow line beam in a workpiece plane corresponding to a workpiece surface, whereby said optics images respective columns of said laser array onto respective sections of said narrow line beam;

a pyrometer sensor sensitive to a pyrometer wavelength;

an optical element in an optical path of said optics and tuned to divert radiation emanating from said workpiece plane to said pyrometry sensor, whereby said optics images each said respective section of said narrow line beam onto a corresponding portion of said pyrometer sensor; and

a controller responsive to said pyrometry sensor and coupled to adjust individual optical outputs of respective columns of said laser array in accordance with outputs of corresponding portions of said pyrometry sensor.

2. The apparatus of claim 1 further comprising an emissivity light source of a predetermined intensity positioned to illuminate a zone of said workpiece plane that includes said narrow line beam, said emissivity light source being coupled to said controller for flash activation by said controller.

3. The apparatus of claim 1 further comprising a first optical filter in an optical path of said optics to said pyrometry sensor and tuned to admit radiation of said pyrometry wavelength and block radiation of the wavelength of said laser array.

4. The apparatus of claim 3 further comprising a second optical filter disposed in an optical path of light radiated by said laser array and tuned to block a portion of the wavelengths emitted by the laser array including said pyrometer wavelength.

5. The apparatus of claim 1, wherein said pyrometer sensor comprises a camera having a field of view corresponding to said narrow line beam.

6. The system of claim 1 further comprising:

line beam scanning apparatus having a fast axis transverse to said line beam.

7. Apparatus for thermal processing a workpiece, comprising:

a source of laser radiation emitting at a laser wavelength and comprising an array of lasers arranged in rows and columns, the optical power of at least each column of said laser array being individual adjustable;

a pyrometer sensor sensitive to a pyrometer wavelength;

common optics projecting in a first direction therethrough a line beam of said laser radiation onto a workpiece plane and directing in an opposed second direction therethrough thermal radiation from said workpiece to said pyrometry sensor as a pyrometry image corresponding to said line beam; and

a controller responsive to said pyrometry sensor and coupled to adjust individual optical outputs of respective columns of said laser array in accordance with corresponding portions of said pyrometry image.

8. The apparatus of claim 7 further comprising an emissivity light source of a predetermined intensity positioned to illuminate a zone of said workpiece plane that includes said narrow line beam, said emissivity light source being coupled to said controller for flash activation by said controller.

9. The apparatus of claim 7 further comprising a first optical filter in an optical path of said common optics to said pyrometry sensor and tuned to admit radiation of said pyrometry wavelength and block radiation of the wavelength of said laser array.

10. The apparatus of claim 9 further comprising a second optical filter disposed in an optical path of light radiated by said laser array and tuned to block a portion of the wavelengths emitted by the laser array including said pyrometer wavelength.

11. The apparatus of claim 7, wherein said pyrometer sensor comprises a camera having a field of view corresponding to said narrow line beam.

12. The apparatus of claim 7 further comprising:

line beam scanning apparatus having a fast axis transverse to said line beam.