Spiral inductors on a substrate
First Claim
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1. A method comprising:
- creating a trench in a spiral inductor to reside between islands of substrate material and between adjacent traces.
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Abstract
Reducing the parasitic capacitance between adjacent traces of a spiral inductor can improve the quality factor of the inductor. To reduce the parasitic capacitance, the substrate material adjacent to the traces of the spiral inductor can be removed. The substrate material coupled to the traces of the spiral inductor can remain intact to support the traces and prevent the traces of the spiral inductor from coming into contact with each other.
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Citations
27 Claims
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1. A method comprising:
creating a trench in a spiral inductor to reside between islands of substrate material and between adjacent traces. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method comprising:
etching a substrate in a spiral to reduce the capacitance generated by a spiral trace of a spiral inductor. - View Dependent Claims (10, 11, 12, 13, 14, 15)
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16. A device comprising:
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an inductor including spiral trace coupled to a substrate; and a trench created in the substrate adjacent to the spiral trace. - View Dependent Claims (17, 18, 19, 20, 21, 22)
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23. A system comprising:
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a communication unit with a spiral inductor supported by a substrate material with trenches in the substrate material adjacent to traces of the spiral inductor; a processor coupled to the communicator; and a static random access memory coupled to the processor. - View Dependent Claims (24, 25, 26, 27)
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Specification