Low cost chip package with integrated RFantenna

• US 20080122726A1
• Filed: 05/03/2007
• Published: 05/29/2008
• Est. Priority Date: 11/27/2006
• Status: Abandoned Application

• Current Assignee: Bon Networks Incorporated
• Original Assignee: Bon Networks Incorporated
• Inventors: Toshev, Alexander, Levi, Gil
• Application Number:
  US11/743,681
• Publication Number:
  US 20080122726A1
• Time in Patent Office: Days
• US Class Current: 343/873
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/19107 off-chip wires
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 21/28 Combinations of substantially independent non-interacting antenna units or systems multiple beam H01Q25/00
• CPC Class Codes: H01Q 23/00 Antennas with active circuits or circuit elements integrated within them or attached to them

Abstract

An electronic RF chip package with integrated antenna includes a top cover section having on its external surface an integrated antenna with antenna elements resonating at different polarizations, a RF chip mounted on an internal surface of the top cover section and functionally coupled to the antenna elements to provide the different polarizations and a bottom cover section shaped to accommodate the RF chip. The RF functional coupling is provided through radiating coupling slots or vias formed in the top cover section.

Claims

1. An electronic package comprising:

a. a top cover section including at least one antenna element formed on an external surface thereof and a chip with radio frequency (RF) circuitry mounted on an internal surface thereof;

b. at least one antenna feed for functionally coupling the RF circuitry to the at least one antenna element; and

c. a bottom cover section enclosing the chip and joined to the top cover section,

whereby the package provides multiple input-multiple output support on the chip.

2. The package of claim 1, wherein the top cover section includes two antenna elements resonating at different polarizations.

3. The package of claim 2, wherein the different polarizations include orthogonal polarizations.

4. The package of claim 1, wherein the top cover section includes two, top and bottom plates.

5. The package of claim 4, wherein each plate includes a printed circuit board (PCB) layer.

6. The package of claim 4, wherein at least one plate includes a plurality of printed circuit board (PCB) layers.

7. The package of claim 1, wherein the top cover section includes more than two antenna elements formed on the external surface, the antenna elements having two different polarizations.

8. The package of claim 1, wherein the antenna element is formed by printing.

9. The package of claim 1, wherein the at least one antenna feed includes a via formed in the top cover section.

10. The package of claim 4, wherein the at least one antenna feed includes a radiating coupling slot formed in the top cover section.

11. An electronic package comprising:

a. a top cover section having an integrated antenna with at least two elements resonating at different polarizations formed on an external surface thereof;

b. a radio frequency (RF) chip mounted on an internal surface of the top cover section and functionally coupled to the antenna elements to provide the different polarizations; and

c. a bottom cover section shaped to accommodate the RF chip, the top and bottom sections joinable into a single package unit.

12. The package of claim 11, further comprising a plurality of leads used to connect the RF chip and package mechanically and electrically to a package carrier.

13. The package of claim 11, wherein the different polarizations are two orthogonal polarizations.

14. The package of claim 11, wherein the at least one antenna feed includes a via formed in the top cover section.

15. The package of claim 12, wherein the top cover section includes two, top and bottom plates.

16. The package of claim 15, wherein the antenna feed includes a radiating coupling slot formed in the top cover section.

17. A method for providing an electronic package for an RF chip, comprising the step of:

a providing a top cover section having an integrated antenna with a plurality of antenna elements resonating at different polarizations formed on an external surface thereof;

b. providing a bottom cover section shaped to accommodate a RF chip, the top and bottom sections joinable into a single package unit;

c. mounting the RF chip on an internal surface of the top cover; and

d. coupling the RF chip to the antenna elements to provide antenna resonances at different polarizations.

18. The method of claim 17, wherein the step of coupling the RF chip to the antenna elements to provide antenna resonances at different polarizations includes providing antenna feeds formed in the top cover surface, the antenna feeds connected respectively to RF circuitry on the RF chip and to the antenna element.

19. The method of claim 18, wherein the providing antenna feeds include providing respective radiating coupling slots formed in the top cover section.

20. The method of claim 18, wherein the providing antenna feeds include providing respective vias formed in the top cover section.