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Low cost chip package with integrated RFantenna

  • US 20080122726A1
  • Filed: 05/03/2007
  • Published: 05/29/2008
  • Est. Priority Date: 11/27/2006
  • Status: Abandoned Application
First Claim
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1. An electronic package comprising:

  • a. a top cover section including at least one antenna element formed on an external surface thereof and a chip with radio frequency (RF) circuitry mounted on an internal surface thereof;

    b. at least one antenna feed for functionally coupling the RF circuitry to the at least one antenna element; and

    c. a bottom cover section enclosing the chip and joined to the top cover section,whereby the package provides multiple input-multiple output support on the chip.

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