PRINTED CIRCUIT BOARD ASSEMBLY AND DISPLAY HAVING THE SAME

• US 20080123335A1
• Filed: 11/08/2007
• Published: 05/29/2008
• Est. Priority Date: 11/08/2006
• Status: Abandoned Application

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Joo, Soong Yong, Jung, Suk Ki, Lee, Dong Yub, Lee, Jung Sun, Yoo, Jong Kun
• Application Number:
  US11/936,944
• Publication Number:
  US 20080123335A1
• Time in Patent Office: Days
• US Class Current: 362/257
• CPC Class Codes: G02F 1/13452 Conductors connecting driver circuitry and terminals of panels
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/099 Coating over pads, e.g. solder resist partly over pads
• CPC Class Codes: H05K 2201/10727 Leadless chip carrier [LCC], e.g. chip-modules for cards
• CPC Class Codes: H05K 2203/0594 Insulating resist or coating with special shaped edges
• CPC Class Codes: H05K 3/281 by means of a preformed insulating foil H05K3/284 takes precedence
• CPC Class Codes: H05K 3/3452 Solder masks
• CPC Class Codes: H05K 3/363 by soldering

Abstract

A PCB assembly includes a base, a conductive pattern disposed on the base, a pad provided on a portion of the conductive pattern, a mounting unit disposed on the pad for electrically connecting the conductive pattern and a coverlay having an opening that exposes the mounting unit

Claims

1. A printed circuit board (PCB) assembly, comprising:

a base;

a conductive pattern disposed on the base;

a pad provided on a portion of the conductive pattern;

a mounting unit disposed on the pad for electrically connecting the conductive pattern; and

a coverlay having an opening that exposes the mounting unit, the coverlay covering the conductive pattern,

wherein an area of the pad is larger than an area of the opening.

2. The PCB assembly of claim 1, further comprising an electronic component electrically connected to the conductive pattern over the mounting unit using a bonding member.

3. The PCB assembly of claim 1, wherein a chamfer or a curved surface is provided in the opening of the coverlay.

4. The PCB assembly of claim 1, wherein the pad has a greater width than the conductive pattern in a first direction, the first direction crossing a longitudinal axial direction of the conductive pattern.

5. A printed circuit board (PCB) assembly, comprising:

a base;

a PCB comprising a first conductive pattern disposed on the base;

a pad provided on the first conductive pattern;

a coverlay configured to cover the first conductive pattern; and

an electronic component mounted on the PCB,

wherein the electronic component is mounted on the pad to be connected to the first conductive pattern of the PCB by a bonding member, and the coverlay has an opening which exposes the pad, an area of the pad being larger than an area of the opening.

6. The PCB assembly of claim 5, wherein a circumferential surface of the opening of the coverlay is provided over the pad, and wherein sides of the circumferential surface of the opening are formed of lines having at least two directions.

7. The PCB assembly of claim 6, wherein the circumferential surface of the opening has a curved shape over the pad.

8. The PCB assembly of claim 5, wherein the pad protrudes in a different direction from a longitudinal direction of a second conductive pattern disposed adjacent to the first conductive pattern.

9. The PCB assembly of claim 5, wherein the bonding member contacts the coverlay.

10. A printed circuit board (PCB) assembly, comprising a PCB,

wherein the PCB comprises at least one first conductive pattern disposed on a base;

and a coverlay which has an opening and covers the first conductive pattern;

the first conductive pattern comprises a first pad, on which a bonding member is placed, and an conductive pattern extending from the first pad, the first pad comprising an exposed region that is exposed by the opening of the coverlay and a shielded region that is covered by the coverlay; and

an area of the shielded region of the first pad is equal to or greater than an area of the exposed region.

11. The PCB assembly of claim 10, wherein the first pad protrudes in a different direction from a protruding direction of a second pad disposed adjacent to the first pad.

12. The PCB assembly of claim 10, further comprising a second conductive pattern connected to the first conductive pattern on the PCB by the bonding member.

13. A display, comprising:

a display panel configured to display an image; and

a printed circuit board (PCB) having a first side connected to the display panel, a plurality of electronic components mounted on the first side of the PCB, the PCB comprising at least one conductive pattern disposed on a base, and a coverlay configured to cover the conductive pattern,

wherein the electronic component is mounted to be connected to the conductive pattern of the PCB by a bonding member, and the coverlay has an opening corresponding to a position where the electronic component and the bonding member are provided.

14. The display of claim 13, wherein the PCB is provided by bending the other side of the PCB toward a rear side of the display panel.

15. The display of claim 13, wherein the PCB comprises a flexible PCB.

16. A display, comprising:

a printed circuit board (PCB) assembly; and

a light source configured to receive power from the PCB assembly,

wherein the PCB assembly comprises a PCB which includes;

at least one first conductive pattern or more disposed on a base; and

a coverlay that has an opening and covers the first conductive pattern,

and wherein the first conductive pattern comprises a pad on which a bonding member is placed and a conductive pattern extending from the pad, the pad comprising an exposed region that is exposed by the opening of the coverlay, and a shielded region that is covered by the coverlay.

17. The display of claim 16, wherein the light source comprises at least one light-emitting diode (LED).