SEMICONDUCTOR MANUFACTURING PROCESS MODULES

• US 20080124197A1
• Filed: 10/23/2007
• Published: 05/29/2008
• Est. Priority Date: 11/10/2003
• Status: Active Grant

• Current Assignee: Brooks Automation Ltd. (United Kingdom) (Azenta, Inc.)
• Original Assignee: Brooks Automation Incorporated (Azenta, Inc.)
• Inventors: van der Meulen, Peter, Pannese, Patrick D., Kiley, Christopher C.
• Granted Patent: US 8,313,277 B2
• Time in Patent Office: Days
• US Class Current: 414/217
• CPC Class Codes: B65G 25/02 the carrier or impeller having different forward and return paths of movement, e.g. walking beam conveyors
• CPC Class Codes: B65G 37/00 Combinations of mechanical conveyors of the same kind, or of different kinds, of interest apart from their application in particular machines or use in particular manufacturing processes series of co-operating belt conveyor units B65G15/22; series of co-operating chain conveyor units B65G17/26; sequence control of combined conveyors B65G43/10
• CPC Class Codes: H01L 21/67161 characterized by the layout of the process chambers
• CPC Class Codes: H01L 21/6719 characterized by the construction of the processing chambers, e.g. modular processing chambers
• CPC Class Codes: H01L 21/67196 characterized by the construction of the transfer chamber
• CPC Class Codes: H01L 21/67703 between different workstations
• CPC Class Codes: H01L 21/67742 Mechanical parts of transfer devices robots in general in B25J
• CPC Class Codes: H01L 21/67745 characterized by movements or sequence of movements of transfer devices
• CPC Class Codes: H01L 21/67748 horizontal transfer of a single workpiece
• CPC Class Codes: H01L 21/67772 involving removal of lid, door, cover
• CPC Class Codes: H01L 21/68792 characterised by the construction of the shaft
• CPC Class Codes: Y10S 414/139 including wafer charging or discharging means for vacuum chamber

Abstract

A variety of process modules are described for use in semiconductor manufacturing processes.

Claims

1. A device comprising:

a single entry shaped and sized for passage of a single wafer;

an interior chamber adapted to hold a plurality of wafers in a side-by-side configuration;

a slot valve operable to selectively isolate the interior chamber; and

a tool for processing the plurality of wafers within the interior chamber.