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SEMICONDUCTOR MANUFACTURING PROCESS MODULES

  • US 20080124197A1
  • Filed: 10/23/2007
  • Published: 05/29/2008
  • Est. Priority Date: 11/10/2003
  • Status: Active Grant
First Claim
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1. A device comprising:

  • a single entry shaped and sized for passage of a single wafer;

    an interior chamber adapted to hold a plurality of wafers in a side-by-side configuration;

    a slot valve operable to selectively isolate the interior chamber; and

    a tool for processing the plurality of wafers within the interior chamber.

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