COMPOSITION FOR FORMING ADHESIVE PATTERN, LAMINATED STRUCTURE OBTAINED BY USING SAME, AND METHOD OF PRODUCING SUCH LAMINATED STRUCTURE

• US 20080124525A1
• Filed: 11/30/2007
• Published: 05/29/2008
• Est. Priority Date: 05/31/2005
• Status: Active Grant

• Current Assignee: Taiyo Ink Mfg. Co., Ltd. (Taiyo Holdings Company Limited)
• Original Assignee: Taiyo Ink Mfg. Co., Ltd. (Taiyo Holdings Company Limited)
• Inventors: Ushiki, Shigeru, Kusama, Masatoshi, Makita, Shohei
• Granted Patent: US 7,829,180 B2
• Time in Patent Office: Days
• US Class Current: 428/195.1
• CPC Class Codes: B29C 65/00 Joining or sealing of preformed parts , e.g. welding of plastics materials; Apparatus therefor general aspects of processes or apparatus for joining preformed parts B29C66/00; using porous material formed by internal pressure generated therein for joining preformed parts B29C44/1228, B29C44/326
• CPC Class Codes: B29C 65/1403 characterised by the type of electromagnetic or particle radiation B29C65/1603 takes precedence
• CPC Class Codes: B29C 65/1496 making use of masks B29C65/1696 takes precedence
• CPC Class Codes: B29C 65/4835 Heat curing adhesives
• CPC Class Codes: B29C 65/4845 Radiation curing adhesives, e.g. UV light curing adhesives
• CPC Class Codes: B29C 65/4865 containing additives C09J11/00 and subgroups take precedence
• CPC Class Codes: B29C 65/4875 being spherical, e.g. particles or powders
• CPC Class Codes: B29C 65/4885 characterised by their composition being non-plastics
• CPC Class Codes: B29C 65/489 being metals
• CPC Class Codes: B29C 65/52 characterised by the way of applying the adhesive B29C65/50 takes precedence; apparatus for applying liquids in general B05C; processes for applying liquids in general B05D
• CPC Class Codes: B29C 66/45 Joining of substantially the whole surface of the articles methods or apparatus for laminating B32B37/00
• CPC Class Codes: B29C 66/71 characterised by the composition of the plastics material of the parts to be joined welding bar compositions B29C65/125
• CPC Class Codes: B32B 37/1292 selectively, e.g. in stripes, in patterns B32B37/0076 takes precedence
• CPC Class Codes: C08K 5/0025 Crosslinking or vulcanising agents; including accelerators
• CPC Class Codes: C08L 2666/02 Organic macromolecular compounds, natural resins, waxes or and bituminous materials
• CPC Class Codes: C08L 2666/04 Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
• CPC Class Codes: C08L 2666/14 Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
• CPC Class Codes: C08L 63/00 Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• CPC Class Codes: C09J 133/00 Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
• CPC Class Codes: C09J 163/00 Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
• CPC Class Codes: C09J 2301/204 : the adhesive coating being discontinuous
• CPC Class Codes: C09J 2301/408 : additives as essential feature of the adhesive layer
• CPC Class Codes: C09J 2301/416 : use of irradiation
• CPC Class Codes: C09J 2433/00 : Presence of (meth)acrylic polymer
• CPC Class Codes: C09J 2463/00 : Presence of epoxy resin
• CPC Class Codes: C09J 7/35 : Heat-activated
• CPC Class Codes: C09J 7/385 : Acrylic polymers
• CPC Class Codes: G02B 6/138 : by using polymerisation
• CPC Class Codes: G03F 7/038 : Macromolecular compounds which are rendered insoluble or differentially wettable G03F7/075 takes precedence; macromolecular azides G03F7/012; macromolecular diazonium compounds G03F7/021
• CPC Class Codes: H05K 2203/0514 : Photodevelopable thick film, e.g. conductive or insulating paste
• CPC Class Codes: H05K 2203/0525 : Patterning by phototackifying or by photopatterning adhesive
• CPC Class Codes: H05K 3/305 : Affixing by adhesive
• CPC Class Codes: H05K 3/321 : by conductive adhesives
• CPC Class Codes: Y10T 428/24174 : including sheet or component perpendicular to plane of web or sheet
• CPC Class Codes: Y10T 428/24273 : including aperture
• CPC Class Codes: Y10T 428/24322 : Composite web or sheet
• CPC Class Codes: Y10T 428/24331 : including nonapertured component
• CPC Class Codes: Y10T 428/24628 : Nonplanar uniform thickness material
• CPC Class Codes: Y10T 428/24802 : Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
• CPC Class Codes: Y10T 428/24851 : Intermediate layer is discontinuous or differential
• CPC Class Codes: Y10T 428/31855 : Of addition polymer from unsaturated monomers
• CPC Class Codes: Y10T 428/31935 : Ester, halide or nitrile of addition polymer

Abstract

An adhesive pattern (4) is formed by applying a photocurable and thermosetting adhesive comprising as indispensable ingredients (A) a carboxyl group-containing photosensitive prepolymer having both a carboxyl group and an ethylenically unsaturated bond in its molecule and an acid value in the range of 30 to 160 mg KOH/g, (B) an epoxy resin, and (C) a photopolymerization initiator onto a surface of a substrate (1) as a member to be bonded to form a coating film; selectively exposing the coating film to an active energy ray through a photomask (3) according to a predetermined pattern, thereafter removing an unexposed portion by development with an aqueous alkaline solution. Then, a sheet member (5) as a joining member is pressed onto the adhesive pattern mentioned above, and the adhesive pattern is thermally cured to obtain a laminated structure.

Claims

1. A composition for forming an adhesive pattern of a laminated structure which is used for joining component members to each other through the medium of a cured product of the adhesive pattern formed by an alkali-developing type photolithography method, characterized in that said composition is a photocurable and thermosetting adhesive comprising as indispensable ingredients (A) a carboxyl group-containing photosensitive prepolymer having both a carboxyl group and an ethylenically unsaturated bond in its molecule and an acid value in the range of 30 to 160 mg KOH/g, (B) an epoxy resin, and (C) a photopolymerization initiator.

2. The adhesive pattern-forming composition according to claim 1, characterized in that said carboxyl group-containing photosensitive prepolymer (A) is a carboxyl group-containing photosensitive prepolymer obtained by the esterification of an epoxy group of (a) a polyfunctional epoxy compound having at least two epoxy groups in its molecule with a carboxyl group of (b) an unsaturated monocarboxylic acid and the subsequent addition reaction of (c) a saturated or unsaturated polybasic acid anhydride with a secondary hydroxyl group produced in said esterification.

3. The adhesive pattern-forming composition according to claim 1, characterized in that said photocurable and thermosetting adhesive further comprises as a diluent an organic solvent and/or a photopolymerizable monomer.

4. The adhesive pattern-forming composition according to claim 1, characterized in that said photocurable and thermosetting adhesive further comprises at least one additive selected from the group consisting of a pigment, conductive particles, ceramic particles, a filler, a dispersant, a thermopolymerization inhibitor, a thickening agent, a plasticizer, a flowability-imparting agent, a stabilizer, an anti-foaming agent, a leveling agent, and an anti-blocking agent.

5. A method of producing a laminated structure, characterized by comprising the steps of applying an adhesive pattern-forming composition according to claim 1 to a surface of a member to be bonded to form a coating film, selectively exposing the coating film to an active energy ray according to a predetermined pattern, thereafter removing an unexposed portion by development to form an adhesive pattern, then pressing a joining member onto said adhesive pattern, and thermally curing said adhesive pattern.

6. A laminated structure, characterized in that component members are joined to each other through the medium of a cured product of an adhesive pattern formed from the adhesive pattern-forming composition according to claim 1.