Boro-silicate glass frits for hermetic sealing of light emitting device displays

• US 20080124558A1
• Filed: 08/18/2006
• Published: 05/29/2008
• Est. Priority Date: 08/18/2006
• Status: Abandoned Application

• Current Assignee: Corning Incorporated
• Original Assignee: Corning Incorporated
• Inventors: Reddy, Kamjula Pattabhirami, Morena, Robert Michael, Boek, Heather Debra, Danielson, Paul Stephen
• Application Number:
  US11/506,218
• Publication Number:
  US 20080124558A1
• Time in Patent Office: Days
• US Class Current: 428/427
• CPC Class Codes: C03C 27/06 Joining glass to glass by processes other than fusing fusing C03B23/20; units for use as elements for closing wall or like openings and comprising two or more parallel glass panes in spaced relationship, the panes being permanently secured together E06B3/66
• CPC Class Codes: C03C 3/066 containing zinc
• CPC Class Codes: C03C 3/091 containing aluminium
• CPC Class Codes: C03C 3/093 containing zinc or zirconium
• CPC Class Codes: C03C 8/02 Frit compositions, i.e. in a powdered or comminuted form
• CPC Class Codes: C03C 8/04 containing zinc
• CPC Class Codes: C03C 8/24 Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 59/8722 Peripheral sealing arrangements, e.g. adhesives, sealants

Abstract

A frit composition useful for sealing a light emitting device is disclosed. The frit composition comprises a glass portion comprising a base component and at least one absorbing component. The glass portion of the frit comprises silica, boron oxide, optionally alumina, and (a) cupric oxide and/or a (b) combination of ferric oxide, vanadium pentoxide, and optionally titanium dioxide. Also disclosed is an article comprising a substrate and a frit, and a glass package comprising two substrates and a frit positioned between the substrates. A method for manufacturing a hermetically sealed glass package comprising the deposition of a glass frit and heating of the glass frit to form a hermetic seal is also disclosed.

Claims

1. A frit composition comprising a glass portion comprising:

a base component comprising;

from about 5 to about 75 mole % SiO₂;

from about 10 to about 40 mole % B₂O₃;

from 0 to about 20 mole % Al₂O₃; and

at least one absorbing component comprising;

a) from greater than 0 to about 25 mole % CuO;

or

b) from greater than 0 to about 7 mole % Fe₂O₃;

from greater than 0 to about 10 mole % V₂O₅; and

from 0 to about 5 mole % TiO₂.

2. The frit composition of claim 1, wherein at least absorbing component (a) is present.

3. The frit composition of claim 1, wherein at least absorbing component (b) is present.

4. The frit composition of claim 1, wherein absorbing components (a) and (b) are both present.

5. The frit composition of claim 1, wherein:

SiO₂ is from about 50 to about 75 mole %;

B₂O₃ is from about 15 to about 30 mole %; and

Al₂O₃ is from 0 to about 10 mole %.

6. The frit composition of claim 5, wherein the at least one absorbing component comprises:

a) from about 4 to about 18 mole % CuO;

or

b) from about 0.1 to about 3 mole % Fe₂O₃;

from about 0.1 to about 5 mole % V₂O₅; and

from 0 to about 2 mole % TiO₂.

7. The frit composition of claim 6, wherein TiO₂ is from about 0.1 to about 2 mole %.

8. The frit composition of claim 6 wherein at least absorbing component (a) is present.

9. The frit composition of claim 6, wherein at least absorbing component (b) is present.

10. The frit composition of claim 6, wherein absorbing components (a) and (b) are both present.

11. The frit composition of claim 5, wherein the at least one absorbing component comprises:

a) from about 8 to about 14 mole % CuO;

or

b) from about 1 to about 2 mole % Fe₂O₃;

from about 0.5 to about 2 mole % V₂O₅; and

from 0 to about 1 mole % TiO₂.

12. The frit composition of claim 11, wherein TiO₂ is from about 0.1 to about 1 mole %.

13. The frit composition of claim 1, wherein:

SiO₂ is from about 54 to about 70 mole %;

B₂O₃ is from about 19 to about 24 mole %; and

Al₂O₃ is from 0 to about 10 mole %.

14. The frit composition of claim 13, wherein the at least one absorbing component comprises:

a) from about 4 to about 18 mole % CuO;

or

b) from about 0.1 to about 3 mole % Fe₂O₃;

from about 0.1 to about 5 mole % V₂O₅; and

from 0 to about 2 mole % TiO₂.

15. The frit composition of claim 13, wherein the at least one absorbing component comprises:

a) from about 8 to about 14 mole % CuO;

or

b) from about 1 to about 2 mole % Fe₂O₃;

from about 0.5 to about 2 mole % V₂O₅; and

from 0 to about 1 mole % TiO₂.

16. The frit composition of claim 1, wherein:

SiO₂ is from about 5 to about 30 mole %;

B₂O₃ is from about 10 to about 40 mole %;

Al₂O₃ is from 0 to about 10 mole %; and

further comprising from about 30 to about 60 mole % ZnO.

17. The frit composition of claim 1, wherein:

SiO₂ is from about 8 to about 15 mole %;

B₂O₃ is from about 25 to about 35 mole %;

Al₂O₃ is from 0 to about 10 mole %; and

further comprising from about 40 to about 55 mole % ZnO.

18. The frit composition of claim 1, wherein the glass portion further comprises at least one of:

lithium oxide, sodium monoxide, zinc oxide, potassium oxide, bismuth oxide, nickel oxide, manganese oxide, or a mixture thereof.

19. The frit composition of claim 1, wherein the absorption coefficient of radiation is at least about 2/mm.

20. The frit composition of claim 1, wherein the coefficient of thermal expansion of the frit composition is from about 25×

10<sup>−

7</sup>/°

C. to about 80×

10<sup>−

7</sup>/°

C.

21. The frit composition of claim 1, further comprising at least one of a binder, filler, solvent, or a mixture thereof.

22. A vanadium based frit composition having a coefficient of thermal expansion substantially similar to that of borosilicate glass, without addition to the frit composition of a coefficient of thermal expansion matching filler.

23. The vanadium based frit composition of claim 22, wherein the frit composition further comprises Fe₂O₃.

24. The vanadium based frit composition of claim 22, being free of or substantially free of lead.

25. A copper based frit composition having a coefficient of thermal expansion substantially similar to that of borosilicate glass, without addition to the frit composition of a coefficient of thermal expansion matching filler.

26. The copper based frit composition of claim 25, being free of or substantially free of lead.

27. An article comprising:

a substrate; and

a frit composition comprising a glass portion comprising;

a base component comprising;

from about 5 to about 75 mole % SiO₂;

from about 10 to about 40 mole % B₂O₃;

from 0 to about 20 mole % Al₂O₃; and

at least one absorbing component comprising;

a. from greater than 0 to about 25 mole % CuO;

or

b. from greater than 0 to about 7 mole % Fe₂O₃;

from greater than 0 to about 10 mole % V₂O₅; and

from 0 to about 5 mole % TiO₂;

wherein the frit composition is positioned on and affixed to the substrate.

28. The article of claim 27, wherein the coefficient of thermal expansion of the glass portion of the frit composition is substantially similar to that of the substrate.

29. The article of claim 27, wherein the substrate comprises borosilicate glass, soda-lime glass, or a mixture thereof.

30. A glass package comprising:

a first substrate;

a second substrate; and

a frit composition comprising a glass portion comprising;

a base component comprising;

from about 5 to about 75 mole % SiO₂;

from about 10 to about 40 mole % B₂O₃;

from 0 to about 20 mole % Al₂O₃; and

at least one absorbing component comprising;

a. from greater than 0 to about 25 mole % CuO;

or

b. from greater than 0 to about 7 mole % Fe₂O₃;

from greater than 0 to about 10 mole % V₂O₅; and

from 0 to about 5 mole % TiO₂;

wherein the frit composition is positioned between the first substrate and the second substrate, and wherein the frit was heated to form a hermetic seal connecting the first substrate to the second substrate.

31. The glass package of claim 30, wherein the frit composition absorbs more radiation than either the first substrate or the second substrate.

32. The glass package of claim 30, wherein the frit composition has a softening temperature lower than the softening temperature of the first substrate and the second substrate.

33. The glass package of claim 30, wherein the glass portion of the frit composition has a coefficient of thermal expansion substantially similar to both the first substrate and the second substrate.

34. The glass package of claim 30, further comprising a light emitting layer, wherein the frit composition is positioned between the first and second substrates to form a frame, and the light emitting layer is positioned between the first and second substrates and within the frit frame.

35. The glass package of claim 34, wherein the light emitting layer comprises an organic light emitting diode.

36. A method for manufacturing a hermetically sealed glass package, comprising the steps of:

providing a first substrate;

providing a second substrate;

providing a frit composition comprising a glass portion comprising;

a base component comprising;

from about 5 to about 75 mole % SiO₂;

from about 10 to about 40 mole % B₂O₃;

from 0 to about 20 mole % Al₂O₃; and

at least one absorbing component comprising;

a. from greater than 0 to about 25 mole % CuO;

or

b. from greater than 0 to about 7 mole % Fe₂O₃;

from greater than 0 to about 10 mole % V₂O₅; and

from 0 to about 5 mole % TiO₂;

depositing the frit composition onto either the first or the second substrate; and

sealing the first substrate to the second substrate by heating the frit in a manner that would cause the frit composition to soften and form a hermetic seal.

37. The method of claim 36, further comprising the step of heating the frit composition to attach the frit composition to the second substrate before the sealing step.

38. The method of claim 36, wherein the heating step comprises a laser.