Communication System

• US 20080125036A1
• Filed: 10/17/2007
• Published: 05/29/2008
• Est. Priority Date: 10/19/2006
• Status: Active Grant

• Current Assignee: Sony Corporation (Sony Group Corp.)
• Original Assignee: Sony Corporation (Sony Group Corp.)
• Inventors: Washiro, Takanori, KONYA, Satoshi
• Granted Patent: US 7,925,235 B2
• Time in Patent Office: Days
• US Class Current: 455/41.1
• CPC Class Codes: H04B 5/26 using coils

Abstract

A communication system includes: a transmitter including a transmission circuit unit generating an RF signal for transmitting data and an electrical-field coupling antenna transmitting the RF signal as an electrostatic field or an induction field; a receiver including an electrical-field coupling antenna and a reception circuit unit subjecting an RF signal received by the electrical-field coupling antenna to reception processing; and a surface-wave propagation device including a plurality of linear surface-wave transmission lines for propagating a surface wave radiated from the electrical-field coupling antenna of the transmitter.

Claims

1. A communication system comprising:

a transmitter including a transmission circuit unit generating an RF signal for transmitting data and an electrical-field coupling antenna transmitting the RF signal as an electrostatic field or an induction field;

a receiver including an electrical-field coupling antenna and a reception circuit unit subjecting an RF signal received by the electrical-field coupling antenna to reception processing; and

a surface-wave propagation device including a plurality of linear surface-wave transmission lines for propagating a surface wave radiated from the electrical-field coupling antenna of the transmitter.

2. The communication system according to claim 1,

wherein the RF signal is a UWB signal using an ultra wideband.

3. A surface-wave propagation device comprising

a plurality of linear surface-wave transmission lines propagating a surface wave radiated from an electrical-field coupling antenna disposed in a communication apparatus,

wherein a bundle end is formed by bundling a plurality of wire rods at one end, and the bundle of the wire rods are undone at the other end of the linear surface-wave transmission lines.

4. The surface-wave propagation device according to claim 3,

wherein each of the surface-wave transmission lines includes a metal whose surface is insulated.

5. The surface-wave propagation device according to claim 3,

wherein an end face of each of the wire rods is distributedly disposed on a flat coupling face at the other end.

6. The surface-wave propagation device according to claim 4,

wherein a specific relationship or rule is established between an arrangement of end faces of individual wire rods at the bundle end formed by bundling a plurality of the wire rods made of a metal whose surface is insulated and an arrangement of end faces of individual wire rods distributed on the flat coupling face.

7. The surface-wave propagation device according to claim 6,

wherein on an end face of the bundle end bundling wire rods, a first wire-rod group is formed to be disposed substantially in the center, and a second wire-rod group is formed to surround the first wire-rod group in the periphery, and on the flat coupling face, the first wire-rod group and the second wire-rod group are disposed to have substantially uniform densities at each part.