INLAYED FLASH MEMORY MODULE

• US 20080126658A1
• Filed: 05/28/2006
• Published: 05/29/2008
• Est. Priority Date: 05/28/2006
• Status: Abandoned Application

• Current Assignee: Phison Electronics Corporation
• Original Assignee: Phison Electronics Corporation
• Inventors: Wang, Chih-Ling
• Application Number:
  US11/420,763
• Publication Number:
  US 20080126658A1
• Time in Patent Office: Days
• US Class Current: 710/302
• CPC Class Codes: G11C 5/04 Supports for storage elements , e.g. memory modules; Mounting or fixing of storage elements on such supports

Abstract

An inlayed flash memory module suitable for being directly welded or inlayed on a printed circuit board via a pad interface connection is disclosed. The flash memory module comprises a flash memory and a circuit board. The flash memory has at least one or a plurality of blocks for storing data. The circuit board comprises a flash memory controller and a plurality of interface connecting points. The flash memory controller is adopted for interacting with a host and controlling the blocks in the flash memory, and the interface connecting points are directly welded or inlayed on the circuit board. Thus, the need of a connector for memory card can be eliminated.

Claims

1. An inlayed flash memory module comprising a flash memory having at least one or a plurality of blocks for storing data, suitable for being directly welded or inlayed on a printed circuit board via a pad interface connection, said flash memory module comprising:

a circuit board, comprising;

a flash memory controller, for interacting with a host and controlling said blocks in said flash memory; and

a plurality of interface connecting points, directly welded or inlayed via a pad interface connection on said circuit board, comprising at least a power connecting point, a ground connecting point, a signal control connecting point and a data transmission connecting point.

2. The inlayed flash memory module according to claim 1, wherein said flash memory controller comprises a SD controller, a MMC controller, a MS controller, a RS-MMC controller, a RS-MOBILE controller or a CF controller.

3. The inlayed flash memory module according to claim 1, wherein said flash memory comprises a NAND flash memory, an AG-AND flash memory or a NOR flash memory.

4. The inlayed flash memory module according to claim 1, wherein said flash memory controller can be packaged using QFN, LGA, BGA, LQFP, QFP, DIE, COB or SIP packaging methods.

5. The inlayed flash memory module according to claim 1, wherein said flash memory can be packaged using QFN, LGA, BGA, LQFP, QFP, DIE, COB or SIP packaging methods.