CLOSED-LOOP DESIGN FOR MANUFACTURABILITY PROCESS

• US 20080127029A1
• Filed: 10/31/2006
• Published: 05/29/2008
• Est. Priority Date: 10/31/2006
• Status: Active Grant

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Liebmann, Lars W., Graur, Ioana, Han, Geng, Mansfield, Scott M.
• Granted Patent: US 7,624,369 B2
• Time in Patent Office: Days
• US Class Current: 716/21
• CPC Class Codes: G03F 1/36 Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes

Abstract

A method of designing an integrated circuit is provided in which the design layout is optimized using a process model until the design constraints are satisfied by the image contours simulated by the process model. The process model used in the design phase need not be as accurate as the lithographic model used in preparing the lithographic mask layout during data prep. The resulting image contours are then included with the modified, optimized design layout to the data prep process, in which the mask layout is optimized using the lithographic process model, for example, including RET and OPC. The mask layout optimization matches the images simulated by the lithographic process model with the image contours generated during the design phase, which ensures that the design and manufacturability constraints specified by the designer are satisfied by the optimized mask layout.

Claims

1. A method for designing an integrated circuit, the method comprising the steps of:

providing one or more design tolerances;

providing a layout;

providing a first process model;

modifying said layout to form a first modified layout so that first image contours satisfy said one or more design tolerances, wherein said first image contours correspond to said first modified layout as determined using said first process model;

providing a second process model; and

modifying said first modified layout to form a second modified layout so that second image contours substantially match said first image contours, wherein said second image contours correspond to said second modified layout as determined by said second process model.

2. The method of claim 1, wherein said first process model comprises a process window model and said first image contours comprise a band of contours corresponding to a range of process conditions.

3. The method of claim 1, further comprising providing one or more manufacturability tolerances and wherein said second image contours substantially match said first image contours within said one or more manufacturability tolerances.

4. The method of claim 3, wherein said first process model comprises a process window model and said first image contours comprise a band of contours corresponding to a range of process conditions.

5. The method of claim 1, wherein said step of modifying said first modified layout comprises performing optical proximity correction.

6. The method of claim 1, wherein said step of modifying said first modified layout comprises resolution enhancement technology.

7. The method of claim 1, wherein said second process model comprises a process window model.

8. The method of claim 1, wherein said second process model is more accurate than said first process model.

9. The method of claim 1, where in said first process model is a compact process model.

10. The method of claim 1, further comprising performing a tapeout comprising said first image contours and said first modified layout, and providing said tapeout as input to the step of modifying said first modified layout.

11. The method of claim 1, further comprising building a mask in accordance with said second modified layout.

12. A computer program product comprising a computer usable medium having computer readable program embodied in said medium for designing an integrated circuit, wherein the computer readable program when executed on a computer causes the computer to:

providing one or more design tolerances;

providing a layout;

providing a first process model;

modifying said layout to form a first modified layout so that first image contours satisfy said one or more design tolerances, wherein said first image contours correspond to said first modified layout as determined using said first process model;

providing a second process model; and

modifying said first modified layout to form a second modified layout so that second image contours substantially match said first image contours, wherein said second image contours correspond to said second modified layout as determined by said second process model.

13. The computer program product of claim 12, wherein said first process model comprises a process window model and said first image contours comprise a band of contours corresponding to a range of process conditions.

14. The computer program product of claim 12, further comprising providing one or more manufacturability tolerances and wherein said second image contours substantially match said first image contours within said one or more manufacturability tolerances.

15. The computer program product of claim 14, wherein said first process model comprises a process window model and said first image contours comprise a band of contours corresponding to a range of process conditions.

16. The computer program product of claim 12, wherein said step of modifying said first modified layout comprises performing optical proximity correction.

17. The computer program product of claim 12, wherein said step of modifying said first modified layout comprises resolution enhancement technology.

18. The computer program product of claim 12, wherein said second process model comprises a process window model.

19. The computer program product of claim 12, wherein said second process model is more accurate than said first process model.

20. The computer program product of claim 12, where in said first process model is a compact process model.

21. A method of providing a service for designing an integrated circuit, the service comprising:

providing one or more design tolerances;

providing a layout;

providing a first process model;

modifying said layout to form a first modified layout so that first image contours satisfy said one or more design tolerances, wherein said first image contours correspond to said first modified layout as determined using said first process model;

providing a second process model; and

modifying said first modified layout to form a second modified layout so that second image contours substantially match said first image contours, wherein said second image contours correspond to said second modified layout as determined by said second process model.

22. The service of claim 21, wherein said first process model comprises a process window model and said first image contours comprise a band of contours corresponding to a range of process conditions.

23. The service of claim 21, further comprising providing one or more manufacturability tolerances and wherein said second image contours substantially match said first image contours within said one or more manufacturability tolerances.

24. The service of claim 23, wherein said first process model comprises a process window model and said first image contours comprise a band of contours corresponding to a range of process conditions.

25. The service of claim 21, wherein said step of modifying said first modified layout comprises performing optical proximity correction.

26. The service of claim 21, wherein said step of modifying said first modified layout comprises resolution enhancement technology.

27. The service of claim 21, wherein said second process model comprises a process window model.

28. The service of claim 21, wherein said second process model is more accurate than said first process model.

29. The service of claim 21, where in said first process model is a compact process model.

30. The service of claim 21, further comprising performing a tapeout comprising said first image contours and said first modified layout, and providing said tapeout as input to the step of modifying said first modified layout.