METHOD OF METALLIZING A SOLAR CELL SUBSTRATE
First Claim
1. A method of forming a solar cell device, comprising:
- positioning a solar cell substrate in a first processing chamber, the solar cell substrate having a first region and a second region that comprise elements that are used to form a solar cell device;
forming a first conductive layer on the first region and the second region in the first processing chamber; and
forming a second conductive layer on the first conductive layer using an electrochemical plating process, wherein forming the second conductive layer comprises;
forming a first metal layer on at least a portion of the first conductive region; and
forming a second metal layer on at least a portion of the second conductive region.
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Accused Products
Abstract
Embodiments of the invention contemplate the formation of a low cost solar cell using a novel high speed electroplating method and apparatus to form a metal contact structure having selectively formed metal lines using an electrochemical plating process. The apparatus and methods described herein remove the need to perform one or more high temperature screen printing processes to form conductive features on the surface of a solar cell substrate. The resistance of interconnects formed in a solar cell device greatly affects the efficiency of the solar cell. It is thus desirable to form a solar cell device that has a low resistance connection that is reliable and cost effective. Therefore, one or more embodiments of the invention described herein are adapted to form a low cost and reliable interconnecting layer using an electrochemical plating process containing a common metal, such as copper.
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Citations
26 Claims
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1. A method of forming a solar cell device, comprising:
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positioning a solar cell substrate in a first processing chamber, the solar cell substrate having a first region and a second region that comprise elements that are used to form a solar cell device; forming a first conductive layer on the first region and the second region in the first processing chamber; and forming a second conductive layer on the first conductive layer using an electrochemical plating process, wherein forming the second conductive layer comprises; forming a first metal layer on at least a portion of the first conductive region; and forming a second metal layer on at least a portion of the second conductive region. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method of forming a solar cell device, comprising:
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positioning a solar cell substrate in a first processing chamber, the solar cell substrate having a first region and a second region that comprise elements that are used to form a solar cell device; forming a first conductive layer over a portion of the first region and the second region in the first processing chamber; and forming a second conductive layer over a portion of the first conductive layer using an electrochemical plating process, wherein forming the second conductive layer comprises; disposing a masking plate having first surface and a plurality of apertures formed therein over at least a portion of the first conductive layer, wherein the plurality of apertures are in communication with a first surface; contacting the first conductive layer with an electrical contact; and forming the second conductive layer over the first conductive layer by immersing the substrate and an electrode in a first electrolyte and electrically biasing the electrical contact relative to the electrode, wherein the second metal layer is simultaneously formed within the areas exposed by apertures formed in the masking plate. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17)
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18. A method of forming a solar cell device, comprising:
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positioning a solar cell substrate in a first processing chamber, the solar cell substrate having a first region and a second region that comprise elements that are used to form a solar cell device; forming a first conductive layer over a portion of the first region and the second region in the first processing chamber; and forming a second conductive layer over a portion of the first conductive layer using an electrochemical plating process, wherein forming the second conductive layer comprises; depositing a masking material over the first conductive layer; forming a plurality of apertures in the masking layer to expose desired regions of the first conductive layer; contacting the first conductive layer with an electrical contact; and forming the second metal layer over the first conductive layer by immersing the substrate and an electrode in a first electrolyte and electrically biasing the electrical contact relative to the electrode. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25, 26)
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Specification