Micro-electro-mechanical systems device and integrated circuit device integrated in a three-dimensional semiconductor structure
First Claim
1. A semiconductor device comprising:
- an integrated circuit (IC) device having a die seal ring;
a micro-electro-mechanical systems (MEMS) device including a MEMS seal ring and a back surface, wherein the IC device is coupled to the MEMS device via coupling the die seal ring and the MEMS seal ring;
a first passive device coupled to the back surface; and
a substrate coupled to the passive device such that the first passive device is disposed between the substrate and the back surface, the substrate including at least one aperture extending through the substrate and configured to enable the first passive device to be trimmed when coupled to the back surface.
1 Assignment
0 Petitions
Accused Products
Abstract
Semiconductor devices (300, 400, and 500) including an integrated circuit (IC) device (100) coupled to a micro-electro-mechanical systems (MEMS) device (200) and a method (600) for producing same are disclosed. The IC device includes a die seal ring (130) and the MEMS device includes a MEMS seal ring (230), and the IC device is coupled to the MEMS device via the die seal ring and the MEMS seal ring. The MEMS device may include one or more passive devices (450, 475) coupled to it. Moreover, a substrate (510) including an aperture (550) may be coupled to the passive device, wherein the aperture enables the passive device to be trimmed after being disposed on the MEMS device. The semiconductor devices include an RF signal path (486) and at least one other signal path (482 and 484), wherein the other signal path(s) may be an analog and/or a digital signal path.
66 Citations
28 Claims
-
1. A semiconductor device comprising:
-
an integrated circuit (IC) device having a die seal ring; a micro-electro-mechanical systems (MEMS) device including a MEMS seal ring and a back surface, wherein the IC device is coupled to the MEMS device via coupling the die seal ring and the MEMS seal ring; a first passive device coupled to the back surface; and a substrate coupled to the passive device such that the first passive device is disposed between the substrate and the back surface, the substrate including at least one aperture extending through the substrate and configured to enable the first passive device to be trimmed when coupled to the back surface. - View Dependent Claims (4, 6, 7, 8, 9, 10, 21, 22, 23)
-
-
2-3. -3. (canceled)
-
5. (canceled)
-
11. (canceled)
-
12. A method of producing a semiconductor device, comprising:
-
forming an integrated circuit (IC) device including a die seal ring; forming a micro-electro-mechanical systems (MEMS) device including a MEMS seal ring and a back surface; coupling the die seal ring to the MEMS seal ring; coupling at least one passive device to the back surface; coupling a substrate to the at least one passive device such that the at least one passive device is disposed between the substrate and the back surface; forming an aperture in the substrate; and trimming the at least one passive device via the aperture. - View Dependent Claims (14, 15, 19, 20, 24, 25)
-
-
13. (canceled)
-
16-18. -18. (canceled)
-
26. A method of producing a semiconductor device, comprising:
-
forming a micro-electro-mechanical systems (MEMS) device including a back surface; coupling at least one passive device to the back surface; coupling a substrate to the at least one passive device such that the at least one passive device is disposed between the substrate and the back surface; forming an aperture in the substrate; and trimming the at least one passive device via the aperture. - View Dependent Claims (27, 28)
-
Specification