HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF
3 Assignments
0 Petitions
Accused Products
Abstract
The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.
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Citations
397 Claims
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1-392. -392. (canceled)
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393. An assembly including an electronic component the electronic component comprising:
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a plurality of contact locations adjacent a surface of the electronic component, a plurality of electrical conductors, each electrical conductors comprising, a first end on the component that is at a position adjacent the surface of the electronic component but fanned out from a corresponding contact location, a compliant elongated electrical conductor positioned at the first end of the electrical conductor, an electrical connection between the corresponding terminal and the first end, where the compliant elongated electrical conductor is free standing, having a first end fixed adjacent to the electronic component and having a second end at a position not adjacent the electronic component, where the compliant elongated electrical conductor can be displaced such that the second end thereof moves in relation to the first end of the compliant contact structure, and the assembly including an active semiconductor device connected to function at least in part by communication of electrical energy through at least one of the contact elements. - View Dependent Claims (394, 395, 396)
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397-597. -597. (canceled)
Specification