Assembly comprising a support element and a chip, support element, method for shielding, and method for protecting

• US 20080129394A1
• Filed: 12/01/2006
• Published: 06/05/2008
• Est. Priority Date: 12/01/2006
• Status: Active Grant

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Seippel, Dietolf, Kissing, Jens
• Granted Patent: US 8,324,028 B2
• Time in Patent Office: Days
• US Class Current: 331/67
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/131 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/81191 wherein the bump connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 23/5227 Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 2924/0001 Technical content checked by a classifier
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/19042 being an inductor
• CPC Class Codes: H01L 2924/19104 on the semiconductor or solid-state device, i.e. passive-on-chip
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H05K 1/0224 Patterned shielding planes, ground planes or power planes H05K1/0253 takes precedence
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 2201/10098 : Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas

Abstract

An assembly includes a support element and a chip having contact elements. The chip is mounted onto the support element with the contact elements facing the support element. A shield layer is on the support element for electrically or magnetically shielding a circuit element of the chip.

Claims

1. An assembly comprising:

a support element,

a chip having contact elements, the chip being mounted onto the support element with the contact elements facing the support element, and

a shield layer on the support element for electrically or magnetically shielding a circuit element of the chip.

2. The assembly according to claim 1, further comprising:

the support element having an upper surface facing the chip and a lower surface opposite the upper surface, and

the shield layer being formed on the upper surface of the support element.

3. The assembly according to claim 1, wherein the circuit element is a capacitor or an inductor.

4. The assembly according to claim 3, wherein the capacitor or the inductor is part of a voltage controlled oscillator (VCO).

5. The assembly according to claim 1, further comprising means for connecting the shield layer to a fixed potential.

6. The assembly according to claim 5, wherein the fixed potential is a supply voltage of the chip or a ground potential.

7. The assembly according to claim 1, further comprising a printed circuit board, the support element being mounted on the printed circuit board.

8. An assembly comprising:

a support element,

a chip comprising circuit elements and contact elements, the chip being mounted onto the support element with the contact elements facing the support element, and

an electrically conductive layer on the support element for protecting a circuit element of the chip from capacitive or inductive coupling.

9. The assembly according to claim 8, wherein:

the support element further comprises an upper surface facing the chip and a lower surface opposite the upper surface, and

the electrically conductive layer is formed on the upper surface of the support element.

10. The assembly according to claim 8, wherein the circuit element is a capacitor or an inductor.

11. The assembly according to claim 10, wherein the capacitor or the inductor is part of a voltage controlled oscillator (VCO).

12. The assembly according to claim 8, further comprising means for connecting the electrically conductive layer to a fixed potential.

13. The assembly according to claim 12, wherein the fixed potential is a supply voltage of the chip or a ground potential.

14. The assembly according to claim 8, further comprising a printed circuit board, the support element being mounted on the printed circuit board.

15. A support element comprising a shield layer on one of the surfaces of the support element for electrically or magnetically shielding a circuit element of a chip to be connected with the support element.

16. The support element according to claim 15, further comprising means for connecting the shield layer to a fixed potential.

17. The support element according to claim 16, wherein the fixed potential is a supply voltage of the chip or a ground potential.

18. A support element comprising an electrically conductive layer on one of the surfaces of the support element for protecting a circuit element of the chip from capacitive or inductive coupling.

19. The support element according to claim 18, further comprising means for connecting the electrically conductive layer to a fixed potential.

20. The support element according to claim 19, wherein the fixed potential is a supply voltage of the chip or a ground potential.

21. A method for electrically or magnetically shielding a circuit element of a chip, the method comprising:

providing a support element;

providing a chip having contact elements;

forming a shield layer on the support element, and

mounting the chip on the support element with the contact elements facing the support element.

22. The method according to claim 21, further comprising the steps of:

providing the support element with an upper surface for facing the chip and with a lower surface opposite the upper surface, and

forming the shield layer on the upper surface of the support element.

23. The method according to claim 21, wherein the circuit element is a capacitor or an inductor.

24. The method according to claim 23, wherein the capacitor or the inductor is part of a voltage controlled oscillator (VCO).

25. The method according to claim 21, further comprising the step of forming means for connecting the shield layer to a fixed potential.

26. The method according to claim 25, wherein the fixed potential is a supply voltage of the chip or a ground potential.

27. The method according to claim 21, further comprising the steps of:

providing a printed circuit board, and

mounting the support element on the printed circuit board.

28. A method for protecting a circuit element of a chip from capacitive or inductive coupling, the method comprising the steps of:

providing a support element,

forming an electrically conductive layer on the support element, and

flip-chip mounting the chip on the support element.

29. The method according to claim 28, further comprising the steps of:

providing the support element with an upper surface for facing the chip and with a lower surface opposite the upper surface, and

forming the electrically conductive layer on the upper surface of the support element.

30. The method according to claim 28, wherein the circuit element is a capacitor or an inductor.

31. The method according to claim 28, wherein the capacitor or the inductor is part of a voltage controlled oscillator (VCO).

32. The method according to claim 28, further comprising the step of forming means for connecting the electrically conductive layer to a fixed potential.

33. The method according to claim 32, wherein the fixed potential being a supply voltage of the chip or a ground potential.

34. The method according to claim 28, further comprising the steps of:

providing a printed circuit board, and

mounting the support element on the printed circuit board.