METHOD FOR FORMING RFID TAGS

• US 20080129455A1
• Filed: 05/22/2007
• Published: 06/05/2008
• Est. Priority Date: 05/24/2006
• Status: Abandoned Application

• Current Assignee: RCD Technology Corporation
• Original Assignee: RCD Technology Corporation
• Inventors: Oberle, Robert R.
• Application Number:
  US11/752,166
• Publication Number:
  US 20080129455A1
• Time in Patent Office: Days
• US Class Current: 340/10.1
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/29101 the principal constituent melting at a temperature of less than 400°C
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/7565 Means for transporting the components to be connected
• CPC Class Codes: H01L 2224/838 Bonding techniques
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0102 Calcium [Ca]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/0665 Epoxy resin
• CPC Class Codes: H01L 2924/07811 Extrinsic, i.e. with electrical conductive fillers
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H04B 5/00 Near-field transmission systems, e.g. inductive or capacitive transmission systems
• CPC Class Codes: H04B 5/45 Transponders
• CPC Class Codes: H04B 5/77 : for interrogation

Abstract

A method of constructing an RFID unit can include using a protective layer to hold an integrated circuit chip module to a substrate layer with an antenna unit while a conductive adhesive has not yet fully set.

Claims

1. A RFID tag including:

a tag substrate with an antenna; and

a strap substrate with an IC, the strap substrate positioned on the tab substrate, the IC being electrically connected to the antenna on the tag substrate through a hole in the strap substrate.

2. The RFID tag of claim 1, wherein the hole is filed with a conductive material.

3. The RFID tag of claim 2, wherein the hole is filled with a conductive adhesive.

4. The RFID tag of claim 3, wherein the conductive adhesive is positioned on a bond pad of the tag substrate before the strap substrate is attached to the tag substrate.

5. The RFID tag of claims 4, wherein the conductive adhesive is placed in the hole after the strap substrate is attached to the substrate.

6. The RFID tag of claim 1, wherein the tag substrate is attached to the strap substrate using an adhesive.

7. The RFID tag of claim 1, wherein the IC does not contact the tag substrate.

8. The RFID tag of claim 1, wherein the strap substrate lies flat on the tag substrate.

9. The RFID tag of claim 1, wherein the antenna is a coil antenna.

10. The RFID tag of claim 1, wherein the antenna is a non-coil antenna.

11. The method to form an RFID tag comprising:

attaching a strap substrate with an IC to a tag substrate such that a hole in the strap substrate aligns with a bond pad on the tag substrate; and

electrically connecting the IC with an antenna on the tag substrate through the hole in the strap substrate.

12. The method of claim 11, wherein the hole is filed with a conductive material.

13. The method of claim 12, wherein the hole is filled with a conductive adhesive.

14. The method of claim 13, wherein the conductive adhesive is positioned on a bond pad of the tag substrate before the strap substrate is attached to the tag substrate.

15. The method of claims 14, wherein the conductive adhesive is placed in the hole after the strap substrate is attached to the substrate.

16. The method of claim 11, wherein the tag substrate is attached to the strap substrate using an adhesive.

17. The method of claim 11, wherein the IC does not contact the tag substrate.

18. The method of claim 11, wherein the strap substrate lies flat on the tag substrate.

19. The method of claim 11, wherein the antenna is a coil antenna.

20. The method of claim 11, wherein the antenna is a non-coil antenna.

21. An RFID tag comprising:

a strap substrate having a first side with an IC attached and a hole; and

a tag substrate attached to a second side of the strap substrate, the tag substrate having an antenna that is electrically connected to the IC through the hole.