Thermal hinge for lid cooling

• US 20080130221A1
• Filed: 12/02/2006
• Published: 06/05/2008
• Est. Priority Date: 12/02/2006
• Status: Abandoned Application

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Mongia, Rajiv, Varadarajan, Krishnakumar, Pokharna, Himanshu
• Application Number:
  US11/607,629
• Publication Number:
  US 20080130221A1
• Time in Patent Office: Days
• US Class Current: 361/687
• CPC Class Codes: G06F 1/203 for portable computers, e.g. for laptops
• CPC Class Codes: G06F 2200/203 Heat conductive hinge

Abstract

A thermal hinge couples a computing platform to a lid. The thermal hinge includes a hinge block that has a groove passing through the hinge block and a hinge pillar to couple to the lid. The hinge pillar is inserted in a first end of the groove passing through the hinge block. The thermal hinge also includes a thermally conductive conduit inserted in a second end of the groove passing through the hinge block. The thermally conductive conduit couples with a heat spreader in the lid in order to transfer thermal energy from the hinge block to the heat spreader.

Claims

1. An apparatus comprising:

a thermal hinge to couple a computing platform to a lid, the thermal hinge to include;

a hinge block including a groove passing through the hinge block;

a hinge pillar to couple to the lid, the hinge pillar inserted in a first end of the groove passing through the hinge block;

a thermally conductive conduit inserted in a second end of the groove passing through the hinge block, wherein the thermally conductive conduit couples with a heat spreader in the lid to transfer thermal energy from the hinge block to the heat spreader.

2. An apparatus according to claim 1, wherein the thermally conductive conduit comprises a heat pipe.

3. An apparatus according to claim 1, wherein the thermally conductive conduit includes one of a copper rod, an aluminum rod and a graphite rod.

4. An apparatus according to claim 1, further comprising:

another heat pipe coupled with the hinge block and to couple with a component resident on the computing platform, the other heat pipe to transfer thermal energy from the component to the hinge block.

5. An apparatus according to claim 1, further comprising:

a thermally conductive conduit coupled with the hinge block and to thermally couple with a component resident on the computing platform, the thermally conductive conduit to transfer thermal energy from the component to the hinge block.

6. An apparatus according to claim 1, wherein the hinge pillar inserted in the first end of the groove passing through the hinge block is inserted with an interference fit that provides mechanical torque such that the lid can be positioned at a plurality of angles over a given number of cycles, a cycle based on an opening and a closing of the lid.

7. An apparatus according to claim 6, wherein a wear resistant ring is positioned within the first end of the groove passing through the hinge block to maintain the mechanical torque over the given number of cycles.

8. An apparatus according to claim 6, wherein a wear resistant ring is coupled with the second end of the groove and the hinge pillar is coupled with the wear resistant ring to maintain the mechanical torque over the given number of cycles.

9. An apparatus according to claim 1, wherein the heat pipe inserted in the second end of the groove passing through the hinge block is inserted with a transition fit such that a gap is between the heat pipe and the groove passing through the heat block, the gap to be filled with a material that provides thermal conduction between the heat pipe and the hinge block.

10. An apparatus according to claim 9, wherein the thermal material that provides thermal conduction between the heat pipe and the hinge block comprises thermal grease.

11. An apparatus according to claim 10, wherein a seal is coupled with the second end of the groove to maintain the thermal grease in the gap and to maintain a given length of the heat pipe in the groove.

12. An apparatus according to claim 1, wherein the groove passing through the hinge block comprises the groove passing through the hinge block with a uniform dimension to include a uniform diameter.

13. A method comprising:

coupling a lid to a computing platform with a thermal hinge that includes;

a hinge block including a groove passing through the hinge block;

a hinge pillar to couple to the lid, the hinge pillar inserted in a first end of the groove passing through the hinge block; and

a thermally conductive conduit inserted in a second end of the groove passing through the hinge block, the thermally conductive conduit to couple with a heat spreader in the lid to transfer thermal energy from the hinge block to the heat spreader; and

transferring thermal energy from a component resident on the computing platform to the heat spreader in the lid via the thermal hinge.

14. A method according to claim 13, wherein transferring thermal energy from the component to the thermal hinge comprises coupling another heat pipe with the component and the thermal hinge.

15. A method according to claim 13, wherein transferring thermal energy from the component to the thermal hinge comprises coupling a thermally conductive conduit with the component and the thermal hinge, the thermally conductive conduit to include one of a copper rod, an aluminum rod and a graphite rod.

16. A system comprising:

a computing platform including a heat generating component;

a lid including a heat spreader; and

a thermal hinge to couple the computing platform to the lid, the thermal hinge to include;

a hinge block including a groove passing through the hinge block;

a hinge pillar to couple to the lid, the hinge pillar inserted in a first given end of the groove passing through the hinge block; and

a heat pipe inserted in a second end of the groove passing through the hinge block, wherein the heat pipe thermally couples to the heat spreader to transfer thermal energy from the hinge block to the heat spreader.

17. A system according to claim 16, further comprising:

another heat pipe coupled with the hinge block and to thermally couple with the heat generating component resident on the computing platform, the other heat pipe to transfer at least a portion of the thermal energy from the heat generating component to the hinge block.

18. A system according to claim 16, wherein the heat generating component comprises one of a microprocessor, a central processing unit, a memory module and a graphics processor.

19. A system according to claim 16, wherein the hinge pillar inserted in the first end of the groove passing through the hinge block is inserted with an interference fit that provides mechanical torque such that the lid can be positioned at a plurality of angles over a given number of cycles, a cycle based on an opening and a closing of the lid.

20. A system according to claim 19, wherein the plurality of angles comprises the plurality of angles to include one of 90 degrees in relation to the computing platform and 130 degrees in relation to the computing platform.

21. A system according to claim 16, wherein the heat pipe inserted in the second end of the groove passing through the hinge block is inserted with a transition fit such that a gap is between the heat pipe and the groove passing through the heat block, the gap to be filled with a material that provides thermal conduction between the heat pipe and the hinge block.