HEAT SINK

• US 20080130232A1
• Filed: 11/28/2007
• Published: 06/05/2008
• Est. Priority Date: 11/30/2006
• Status: Abandoned Application

• Current Assignee: Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Original Assignee: Fuji Electric FA Components & Systems Company Limited (Fuji Electric Systems Company Limited)
• Inventors: YAMAMOTO, Tsutomu, HATOZAKI, Yoshihisa
• Application Number:
  US11/946,331
• Publication Number:
  US 20080130232A1
• Time in Patent Office: Days
• US Class Current: 361/703
• CPC Class Codes: H05K 7/209 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20909 takes precedence
• CPC Class Codes: H05K 7/20909 Forced ventilation, e.g. on heat dissipaters coupled to components

Abstract

A heat sink is provided that can prevent the velocity of air flowing between fins in the vicinity of the component mounting space from decreasing. In the heat sink, a plurality of fins and the component mounting space are disposed on a fin unit side of the base. A lateral-end fin portion in the vicinity of the component mounting space is provided with an opening for taking in air and discharging air from a side.

Claims

1. A heat sink comprising:

a base;

a plurality of fin portions and a component mounting space disposed on a fin unit side of the base;

wherein a lateral-end fin portion of the fin portions is provided with an opening in a vicinity of the component mounting space.

2. A heat sink as claimed in claim 1, wherein the lateral-end fin portion forms a side wall of the component mounting space.

3. A heat sink as claimed in claim 1, wherein the fin portions include a fin portion section comprising fins portions of substantially shorter length than the lateral-end fin portion, wherein the fin portion section is laterally aligned with the component mounting space.

4. A heat sink as claimed in claim 3, wherein the heat sink is configured in accordance with a defined flow direction, and wherein the fin portion section is located upstream of the component mounting space with respect to the defined flow direction.

5. A heat sink as claimed in claim 3, wherein the heat sink is configured in accordance with a defined flow direction, and wherein the fin portion section is located downstream of the component mounting space with respect to the defined flow direction.