Electronic Apparatus

• US 20080130234A1
• Filed: 08/28/2007
• Published: 06/05/2008
• Est. Priority Date: 11/30/2006
• Status: Abandoned Application

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Suzuki, Yoshiaki, Maehara, Daisuke
• Application Number:
  US11/845,956
• Publication Number:
  US 20080130234A1
• Time in Patent Office: Days
• US Class Current: 361/704
• CPC Class Codes: G06F 1/203 for portable computers, e.g. for laptops
• CPC Class Codes: H05K 1/0206 by printed thermal vias
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 1/145 Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
• CPC Class Codes: H05K 1/148 Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
• CPC Class Codes: H05K 2201/042 Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
• CPC Class Codes: H05K 2201/066 Heatsink mounted on the surface of the printed circuit board [PCB]
• CPC Class Codes: H05K 2201/10734 Ball grid array [BGA]; Bump grid array
• CPC Class Codes: H05K 7/205 Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB] details of PCBs relating to heat transfer H05K1/0201

Abstract

According to one embodiment, an electronic apparatus is provided with a first circuit board contained in a case, a heat-generating component mounted on the first circuit board, a second circuit board contained in the case and opposed to the heat-generating component, and a heat-conductive member which is interposed between the heat-generating component and the second circuit board and thermally connects the heat-generating component to the second circuit board.

Claims

1. An electronic apparatus comprising:

a case;

a first circuit board contained in the case;

a heat-generating component mounted on the first circuit board;

a second circuit board contained in the case and opposed to the heat-generating component; and

a heat-conductive member which is interposed between the heat-generating component and the second circuit board and thermally connects the heat-generating component to the second circuit board.

2. An electronic apparatus according to claim 1, wherein the heat-conductive member has flexibility and is configured to be deformed to follow the shape of a clearance between the heat-generating component and the second circuit board.

3. An electronic apparatus according to claim 1, further comprising:

a member for heat radiation mounted on a surface of the second circuit board different from that surface which faces the first circuit board, the member for heat-radiation being thermally connected to the heat-generating component through the second circuit board.

4. An electronic apparatus according to claim 1, further comprising:

at least one third circuit board contained in the case; and

another heat-conductive member which thermally connects the third circuit board to the second circuit board.

5. An electronic apparatus according to claim 4, further comprising:

a member for heat radiation,

wherein the case includes an inner surface exposed to the interior of the case, the third circuit board is located between the second circuit board and the inner surface of the case, and the member for heat radiation is mounted on that surface of the third circuit board which faces the inner surface, the member for heat radiation being thermally connected to the heat-generating component through the third and second circuit boards.

6. An electronic apparatus according to claim 1, wherein the second circuit board is a metal core board.

7. An electronic apparatus comprising:

a case;

a heat-generating component contained in the case;

a circuit board which is contained in the case, has flexibility at least in a part thereof, and includes a first region in which the heat-generating component is mounted and a second region which is turned back over the first region, the second region facing the heat-generating component from the side opposite from the first region; and

a heat-conductive member which is interposed between the heat-generating component and the second region of the circuit board and thermally connects the heat-generating component to the second region of the circuit board.

8. An electronic apparatus according to claim 7, further comprising:

a member for heat radiation, mounted on a surface of the second region of the circuit board different from that surface which faces the first region, the member for heat radiation being thermally connected to the heat-generating component through the second region of the circuit board.

9. An electronic apparatus according to claim 7, wherein the second region of the circuit board is formed of a rigid board.