Electronic Apparatus
First Claim
Patent Images
1. An electronic apparatus comprising:
- a case;
a first circuit board contained in the case;
a heat-generating component mounted on the first circuit board;
a second circuit board contained in the case and opposed to the heat-generating component; and
a heat-conductive member which is interposed between the heat-generating component and the second circuit board and thermally connects the heat-generating component to the second circuit board.
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Accused Products
Abstract
According to one embodiment, an electronic apparatus is provided with a first circuit board contained in a case, a heat-generating component mounted on the first circuit board, a second circuit board contained in the case and opposed to the heat-generating component, and a heat-conductive member which is interposed between the heat-generating component and the second circuit board and thermally connects the heat-generating component to the second circuit board.
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Citations
9 Claims
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1. An electronic apparatus comprising:
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a case; a first circuit board contained in the case; a heat-generating component mounted on the first circuit board; a second circuit board contained in the case and opposed to the heat-generating component; and a heat-conductive member which is interposed between the heat-generating component and the second circuit board and thermally connects the heat-generating component to the second circuit board. - View Dependent Claims (2, 3, 4, 5, 6)
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7. An electronic apparatus comprising:
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a case; a heat-generating component contained in the case; a circuit board which is contained in the case, has flexibility at least in a part thereof, and includes a first region in which the heat-generating component is mounted and a second region which is turned back over the first region, the second region facing the heat-generating component from the side opposite from the first region; and a heat-conductive member which is interposed between the heat-generating component and the second region of the circuit board and thermally connects the heat-generating component to the second region of the circuit board. - View Dependent Claims (8, 9)
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Specification