Assembly comprising a substrate and a chip mounted on the substrate and a method for fabricating the same

• US 20080130257A1
• Filed: 12/19/2006
• Published: 06/05/2008
• Est. Priority Date: 12/05/2006
• Status: Active Grant

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Seippel, Dietolf, Li Puma, Giuseppe
• Granted Patent: US 8,053,890 B2
• Time in Patent Office: Days
• US Class Current: 361/782
• CPC Class Codes: H01F 17/0006 Printed inductances printed coils for dynamo-electric machines H02K3/26; printed circuits H05K
• CPC Class Codes: H01F 2017/0046 with a conductive path having a bridge
• CPC Class Codes: H01F 2021/125 Printed variable inductor with taps, e.g. for VCO
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 23/5227 Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/1902 : including thick film passive components
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: Y10T 29/49002 : Electrical device making

Abstract

An assembly includes a substrate, a chip mounted on the substrate, a voltage controlled oscillator circuit including an inductor and further circuit elements. The inductor is mounted on or in the substrate, and the further circuit elements are mounted on or in the chip. An assembly is disclosed that includes a substrate including a first metallization plane and a second metallization plane, a chip mounted on the substrate, and an inductor mounted on or in the substrate. The inductor includes a first inductor portion in the first metallization plane and a second inductor portion in the second metallization plane. An assembly is also disclosed including a substrate, a chip mounted onto the substrate, and a transformer formed at least in part on or in the substrate.

Claims

1. An assembly, comprising:

a substrate;

a chip mounted on the substrate;

a voltage-controlled oscillator circuit, including an inductor and a circuit element;

wherein the inductor coupled with the substrate and the circuit element is coupled with the chip.

2. The assembly of claim 1, wherein the voltage controlled oscillator circuit includes an LC oscillator circuit, the LC oscillator circuit

comprising the inductor.

3. The assembly of claim 1, wherein the chip includes contact elements, and the chip is mounted onto the substrate with the contact elements facing the substrate.

4. The assembly of claim 1, further comprising a ball grid array operable to mount the chip on the substrate.

5. The assembly of claim 4, wherein the inductor is connected between two balls of the ball grid array.

6. The assembly of claim 4, wherein the substrate includes at least one metallization plane, and the inductor includes at least one winding arranged in the metallization plane.

7. The assembly of claim 6, wherein the substrate comprises a first metallization plane and a second metallization plane, and the inductor comprises a first winding in the first metallization plane and a second winding in the second metallization plane.

8. An assembly, comprising:

a substrate including a first metallization plane and a second metallization plane;

a chip mounted on the substrate; and

an inductor coupled with the substrate;

wherein the inductor includes a first inductor portion in the first metallization plane and a second inductor portion in the second metallization plane.

9. The assembly of claim 8, wherein the chip includes contact elements, the chip being mounted onto the substrate with the contact elements facing the substrate.

10. The assembly of claim 8, further comprising a ball grid array configured to mount the chip on the substrate.

11. The assembly of claim 10, wherein the inductor is mounted between two balls of the ball grid array.

12. The assembly of claim 8, further comprising a voltage-controlled oscillator circuit comprising the inductor and a circuit element, wherein the circuit element is coupled with the chip.

13. The assembly of claim 12, wherein the voltage-controlled oscillator circuit includes an LC oscillator circuit, the LC oscillator circuit including the inductor.

14. An assembly, comprising:

a substrate;

a chip mounted onto the substrate; and

a transformer coupled at least in part with the substrate.

15. The assembly of claim 14, wherein the chip includes contact elements, and the chip is mounted onto the substrate with the contact elements facing the substrate.

16. The assembly of claim 14, further comprising a ball grid array configured to mount the chip on the substrate.

17. The assembly of claim 16, wherein the transformer includes two coils, respective ones of the coils connected between two balls of the ball grid array.

18. The assembly of claim 17, wherein the substrate includes a first metallization plane at a surface of the substrate and further metallization planes in the substrate.

19. A method for fabricating an assembly, comprising:

providing a substrate;

providing a chip;

providing a voltage-controlled oscillator circuit including an inductor and a circuit element;

mounting the chip onto the substrate;

forming the inductor integral with the substrate; and

forming the circuit element integral with the chip.

20. The method of claim 19, further comprising:

providing the chip with contact elements; and

mounting the chip onto the substrate with the contact elements facing the substrate.

21. The method of claim 19, further comprising forming a ball grid array to mount the chip on the substrate.

22. The method of claim 21, further comprising connecting the inductor between two balls of the ball grid array.

23. A method for fabricating an assembly, comprising:

providing a substrate comprising a first metallization plane and a second metallization plane;

providing a chip;

mounting the chip onto the substrate; and

forming an inductor integral with the substrate by forming a first inductor portion in the first metallization plane and a second inductor portion in the second metallization plane.

24. The method of claim 23, further comprising:

providing the chip with contact elements; and

mounting the chip onto the substrate with the contact elements facing the substrate.

25. The method of claim 23, further comprising:

forming a ball grid array to mount the chip on the substrate.

26. The method of claim 25, further comprising:

connecting the inductor between two balls of the ball grid array.

27. A method for fabricating an assembly, comprising:

providing a substrate;

providing a chip;

mounting the chip onto the substrate; and

forming a transformer integral with the substrate.

28. The method of claim 27, further comprising:

providing a chip including contact elements, and

mounting the chip onto the substrate with the contact elements facing the substrate.

29. The method of claim 27, further comprising:

forming a ball grid array to mount the chip onto the substrate.

30. The method of claim 29, further comprising:

forming a transformer comprising a first coil and a second coil; and

connecting the first coil between two balls of the ball grid array, and connecting the second coil between two further balls of the ball grid array.

31. The method of claim 30, further comprising:

providing a substrate comprising a first metallization plane and further metallization planes.