METHOD FOR PRINTING ELECTRICALLY CONDUCTIVE CIRCUITS

• US 20080131590A1
• Filed: 11/26/2007
• Published: 06/05/2008
• Est. Priority Date: 12/04/2006
• Status: Abandoned Application

• Current Assignee: Illinois Tool Works Inc.
• Original Assignee: Illinois Tool Works Inc.
• Inventors: Padilla, Richard A., Drews, Stephen F.
• Application Number:
  US11/944,973
• Publication Number:
  US 20080131590A1
• Time in Patent Office: Days
• US Class Current: 427/97.3
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 2203/0522 Using an adhesive pattern
• CPC Class Codes: H05K 2203/0528 Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
• CPC Class Codes: H05K 2203/1545 Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
• CPC Class Codes: H05K 3/046 by selective transfer or selective detachment of a conductive layer

Abstract

A method for printing electrically conductive circuits is disclosed. The method comprises the steps of providing a substrate, printing a circuit design on the substrate, providing a film having a conductive layer, selectively transferring portions of the conductive layer of the film to the printed circuit design on the substrate, optionally removing any remaining release coat and optionally applying a protective overcoat. The method of the present invention is particularly useful for creating flexible circuits.

Claims

1. A method for creating an electrically conductive circuit, the method comprising the steps of:

providing a substrate;

printing a design of the circuit on the substrate;

providing a film having a conductive layer; and

selectively transferring the conductive layer to the substrate to form the circuit.

2. The method of creating an electrically conductive circuit of claim 1 wherein the film further comprises a carrier web on which the conductive layer is formed.

3. The method of creating an electrically conductive circuit of claim 2 wherein the film further comprises a release layer between the carrier web and the conductive layer.

4. The method of creating an electrically conductive circuit of claim 3 further comprising the step of removing any release coat from the selectively transferred conductive layer.

5. The method of creating an electrically conductive circuit of claim 1 further comprising the step of optionally applying a protective overcoat to the circuit.

6. The method of creating an electrically conductive circuit of claim 1 wherein the substrate is flexible.

7. The method of creating an electrically conductive circuit of claim 1 wherein the substrate is comprised of a material selected from the group consisting of mylar, acrylic, polyester film, vinyl film, paper and paper board.

8. The method of creating an electrically conductive circuit of claim 1 wherein the design of the circuit is printed using an inkjet printer.

9. The method of creating an electrically conductive circuit of claim 1 wherein the design of the circuit is printed using a laser printer.

10. The method of creating an electrically conductive circuit of claim 1 wherein the design of the circuit is printed by rotogravure printing.

11. The method of creating an electrically conductive circuit of claim 1 wherein the design of the circuit is printed by flexographic offset printing.

12. The method of creating an electrically conductive circuit of claim 1 wherein the design of the circuit is printed using a toner.

13. The method of creating an electrically conductive circuit of claim 12 wherein the toner comprises a heat-activatable binder.

14. The method of creating an electrically conductive circuit of claim 1 wherein the design of the circuit is printed using an ink.

15. The method of creating an electrically conductive circuit of claim 14 wherein the ink comprises a heat-activatable binder.

16. The method of creating an electrically conductive circuit of claim 1 wherein the conductive layer comprises at least one conductive material selected from the group consisting of aluminum, copper, silver, gold, platinum, molybdenum, tungsten, titanium, tantalum, germanium, silicon and silicon-containing materials, indium tin oxide (ITO), aluminum tin oxide (ATO), aluminum zinc oxide (AZO), carbon and nickel.

17. The method of creating an electrically conductive circuit of claim 1 wherein the step of selectively transferring the conductive layer to substrate to form the circuit comprises a hot roil lamination process.

18. The method of creating an electrically conductive circuit of claim 17 wherein the hot roll lamination process comprises the steps of:

providing a hot laminating roller;

printing the design of the circuit on the substrate using a toner;

transporting the film to the hot laminating roller;

transporting the substrate to the hot laminating roller;

positioning the film between the hot laminating roller and the substrate; and

using the hot laminating roller to exert heat and pressure on the film and the substrate, wherein the conductive layer of the film is selectively transferred from the film to the substrate by adhering to the toner.

19. The method of claim 18 wherein the toner comprises a heat-activatable binder.

20. The method of creating an electrically conductive circuit of claim 17 wherein the hot roll lamination process comprises the steps of:

providing a hot laminating roller;

printing the design of the circuit on the substrate using an ink;

transporting the film to the hot laminating roller;

transporting the substrate to the hot laminating roller;

positioning the film between the hot laminating roller and the substrate; and

using the hot laminating roller to exert heat and pressure on the film and the substrate, wherein the conductive layer of the film is selectively transferred from the film to the substrate by adhering to the ink.

21. The method of claim 20 wherein the ink comprises a heat-activatable binder.